Patents by Inventor Peter Ziereisen

Peter Ziereisen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9504174
    Abstract: A connector for attachment to glass for connecting an electrically conductive substrate to an electric conduit is disclosed. The connector includes an electrically non-conductive housing having an interior region and an underside with a slot formed therein. The connector further includes an electrically conductive insert. The conductive insert has a contact portion that extends at least partially through the slot defined in the housing. A pre-applied, heat-activatable adhesive is provided on the underside of the housing for attaching the housing to the glass. The disclosed invention is provided in two embodiments, one that maintains conductivity between the substrate and the contact portion by a compressive force and one that maintains conductivity by lead-free solder. In the first embodiment, the contact portion includes a conductive skid extending therefrom. In the second embodiment, at least the contact portion of the conductive insert is coated with lead-free solder.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: November 22, 2016
    Assignee: A. Raymond Et Cie
    Inventors: Ida Tem Mai-Krist, Jeffrey Hugh Moser, Peter Ziereisen
  • Publication number: 20150208533
    Abstract: A connector for attachment to glass for connecting an electrically conductive substrate to an electric conduit is disclosed. The connector includes an electrically non-conductive housing having an interior region and an underside with a slot formed therein. The connector further includes an electrically conductive insert. The conductive insert has a contact portion that extends at least partially through the slot defined in the housing. A pre-applied, heat-activatable adhesive is provided on the underside of the housing for attaching the housing to the glass. The disclosed invention is provided in two embodiments, one that maintains conductivity between the substrate and the contact portion by a compressive force and one that maintains conductivity by lead-free solder. In the first embodiment, the contact portion includes a conductive skid extending therefrom. In the second embodiment, at least said contact portion of the conductive insert is coated with lead-free solder.
    Type: Application
    Filed: August 8, 2013
    Publication date: July 23, 2015
    Applicant: A. Raymond Et Cie.
    Inventors: Ida Tem Mai-Krist, Jeffrey Hugh Moser, Peter Ziereisen
  • Patent number: 4676406
    Abstract: A dispenser for storing, mixing and dispensing two components. A casing contains the first component and has a piston therein. A mixing tube containing the second component is axially housed in the casing and has an open end sealed by the piston until mixing of the two components is desired. The mixing tube has a mixing plate adjacent the open end to agitate and mix the two components. The mixing plate comprises arms extending from the mixing with flapping vanes attached on one side of each arm.
    Type: Grant
    Filed: September 29, 1986
    Date of Patent: June 30, 1987
    Assignee: Upat & Co., GmbH
    Inventors: Albert Frischmann, Kurt Mermi, Peter Ziereisen