Abstract: A semiconductor module includes a semiconductor element, a substrate, and a bond connector designed as a gate resistor, shunt, resistor in an RC filter or fuse. The bond connector includes a core made of a first metal material and a jacket which is designed to envelope the core and made from a second metal material that is different from the first metal material, with the first metal material having an electrical conductivity which is lower than an electrical conductivity of the second metal material. At least one of the semiconductor element and the substrate is connected to the bond connector.

Abstract: A power converter includes at least two power semiconductor modules. Each of the power semiconductor modules includes at least one power semiconductor and power contacts, which are electrically conductively connected to the power semiconductors via an external circuit for the parallel connection of the power semiconductor modules. The power semiconductors are further connected to one another in parallel by way of at least one additional connection having a lower parasitic inductance and/or a lower series resistance than the external circuit.

Abstract: A power semiconductor module includes a power semiconductor circuit and a housing partially surrounding the circuit that has a first and second contact electrodes which are each electrically conductively connected to the circuit and are each guided outwards through the housing through a hole in the housing, wherein the housing has first, second and third contacting regions, where the first and second contact electrodes are respectively contactable in the first and second contacting regions, the first and second contact electrodes are contactable together in the third contacting region, the housing has a recess in each contacting region, into which a threaded part is inserted, the recess and the threaded part receive a screw to contact the contact electrodes in each contacting region with an external voltage/current source on an outer face of the housing, and where the contact electrodes also have a recess for receiving the screw.

Abstract: In a method for producing an apparatus for cooling a semiconductor arrangement, a first cooling channel is produced in a metal body with a first FSC (Friction Stir Channeling) at a first depth from a surface of the metal body. Using the first FSC method, a first connecting channel is produced extending from the first cooling channel to the surface of the metal body. Using second FSC method a second cooling channel is produced in the metal body at a second depth from the surface of the metal body, with the second depth being smaller than the first depth. The first connecting channel forms a fluidic connection between the first cooling channel and the second cooling channel, and the first and second cooling channels and the first connecting channel form a cooling channel structure.

Abstract: A method for producing a power semiconductor module system includes producing a first and second power semiconductor modules that each have a power semiconductor circuit, connecting first and second contact electrodes to the respective power semiconductor circuits, and partially enclosing the power semiconductor modules in a common housing, wherein the first and second contact electrodes of the two power semiconductor modules are each led through the common housing through a cut-out and where the common housing has first, second and third contacting regions, where the first and second contact electrodes of the first power semiconductor module contact together in the first contacting region, the first and second contact electrodes of the second power semiconductor module contact together in the second contacting region, the second contact electrode of the first power semiconductor module and the second contact electrode of the second power semiconductor module contact together in the third contacting region.

Abstract: In a method for producing a power converter, a surface or at least part of the surface of at least two aluminum busbars is subjected to an anodizing treatment to color the surface with at least one specifiable color, and a cold gas coating is applied on a first part of the surface to produce a contact surface.

Abstract: A copper busbar has at least one stepped hole for fastening a cable shoe vi a screw connection. The stepped hole extends from a first surface of the copper busbar to a second surface of the copper busbar. The stepped hole has at least a first region, a second region and a third region, wherein the first region of the stepped hole adjoins the first surface, with a radius of the stepped hole being constant over the length of the second region with the second radius value. The third region adjoins the second surface, wherein the third region has at least at the second surface a radius with a third radius value which is less than the second radius value.

Abstract: A copper busbar has at least one stepped hole for fastening a cable shoe vi a screw connection. The stepped hole extends from a first surface of the copper busbar to a second surface of the copper busbar. The stepped hole has at least a first region, a second region and a third region, wherein the first region of the stepped hole adjoins the first surface, with a radius of the stepped hole being constant over the length of the second region with the second radius value. The third region adjoins the second surface, wherein the third region has at least at the second surface a radius with a third radius value which is less than the second radius value.