Patents by Inventor Phillip J. Restle

Phillip J. Restle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020105059
    Abstract: An integrated circuit, comprising: a semiconductor substrate, a plurality of last metal conductors disposed above said substrate, a bottom metallic layer disposed on said last metal conductors, a top metallic layer, and an alpha absorber disposed between said bottom and top metallic layers, said alpha absorber consisting essentially of a high-purity metal which is an alpha-particle absorber. The metal is, for example, of Ta, W, Re, Os or Ir.
    Type: Application
    Filed: February 6, 2001
    Publication date: August 8, 2002
    Applicant: International Business Machines Corporation
    Inventors: Richard A. Wachnik, Henry A. Nye, Charles R. Davis, Theodore H. Zabel, Phillips J. Restle
  • Patent number: 6418401
    Abstract: A method for reducing the computation time and improving the productivity in designing high-performance microprocessor chips that have no failures—due to crosstalk noise. The technique allows a very fast calculation of tables of frequency-dependent circuit parameters needed for accurate crosstalk prediction on lossy on-chip interconnections. These tables of parameters are the basis for CAD tools that perform crosstalk checking on >10K critical nets on typical microprocessor chips. A fast table generation allows for rapid incorporation of design or processing changes and transition to more advanced technologies.
    Type: Grant
    Filed: February 11, 1999
    Date of Patent: July 9, 2002
    Assignee: International Business Machines Corporation
    Inventors: Allan H. Dansky, Alina Deutsch, Gerard V. Kopcsay, Phillip J. Restle, Howard H. Smith
  • Patent number: 5610528
    Abstract: A capacitive bend sensor includes a first element having a comb-patterned portion of conducting material, and a second element having a comb-patterned portion of conducting material. A dielectric material is disposed between the comb-patterned portion of the first element and the comb-patterned portion of the second element. The first element is bonded to the second element such that the comb-patterned portion of the first element slides relative to the comb-patterned portion of the second element when the first and second elements are bent. Bend angle is measured according to the alignment of the comb-patterned portion of the first element and the comb-patterned portion of the second element. The sensor may be coupled to a human finger to measure bend angle of the finger, or may be coupled to a joint of a human body to measure bend angle of the joint.
    Type: Grant
    Filed: June 28, 1995
    Date of Patent: March 11, 1997
    Assignee: International Business Machines Corporation
    Inventors: James S. Neely, Phillip J. Restle