Abstract: An integrated circuit, comprising: a semiconductor substrate, a plurality of last metal conductors disposed above said substrate, a bottom metallic layer disposed on said last metal conductors, a top metallic layer, and an alpha absorber disposed between said bottom and top metallic layers, said alpha absorber consisting essentially of a high-purity metal which is an alpha-particle absorber. The metal is, for example, of Ta, W, Re, Os or Ir.

Abstract: An integrated circuit, comprising: a semiconductor substrate, a plurality of last metal conductors disposed above said substrate, a bottom metallic layer disposed on said last metal conductors, a top metallic layer, and an alpha absorber disposed between said bottom and top metallic layers, said alpha absorber consisting essentially of a high-purity metal which is an alpha-particle absorber. The metal is, for example, of Ta, W, Re, Os or Ir.

Abstract: A method for reducing the computation time and improving the productivity in designing high-performance microprocessor chips that have no failures—due to crosstalk noise. The technique allows a very fast calculation of tables of frequency-dependent circuit parameters needed for accurate crosstalk prediction on lossy on-chip interconnections. These tables of parameters are the basis for CAD tools that perform crosstalk checking on >10K critical nets on typical microprocessor chips. A fast table generation allows for rapid incorporation of design or processing changes and transition to more advanced technologies.

Abstract: A capacitive bend sensor includes a first element having a comb-patterned portion of conducting material, and a second element having a comb-patterned portion of conducting material. A dielectric material is disposed between the comb-patterned portion of the first element and the comb-patterned portion of the second element. The first element is bonded to the second element such that the comb-patterned portion of the first element slides relative to the comb-patterned portion of the second element when the first and second elements are bent. Bend angle is measured according to the alignment of the comb-patterned portion of the first element and the comb-patterned portion of the second element. The sensor may be coupled to a human finger to measure bend angle of the finger, or may be coupled to a joint of a human body to measure bend angle of the joint.