Patents by Inventor Phillip O. Miller

Phillip O. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
    Patent number: 8329006
    Abstract: An apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: December 11, 2012
    Assignee: Faraday Technology, Inc.
    Inventors: Lawrence E. Gebhart, Jenny J. Sun, Phillip O. Miller, E. Jennings Taylor
  • ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DEPOSITION ACROSS A WORKPIECE DURING PLATING
    Publication number: 20090205953
    Abstract: An apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Application
    Filed: April 28, 2009
    Publication date: August 20, 2009
    Applicant: FARADAY TECHNOLOGY, INC.
    Inventors: Lawrence E. Gebhart, Jenny J. Sun, Phillip O. Miller, E. Jennings Taylor
  • Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
    Patent number: 7553401
    Abstract: A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: June 30, 2009
    Assignee: Faraday Technology, Inc.
    Inventors: Lawrence E. Gebhart, Jenny J. Sun, Phillip O. Miller, E. Jennings Taylor
  • Electrolytic looping for forming layering in the deposit of a coating
    Publication number: 20080041728
    Abstract: A method for depositing a metal onto a substrate including the steps of providing a plating bath including ions of the metal, positioning the substrate in the plating bath, positioning at least one counter electrode in the plating bath, performing a first electrolytic process for a predetermined first period of time, performing a second electrolytic process for a predetermined second period of time and looping between the first and second electrolytic processes to form a coating of the metal on the substrate.
    Type: Application
    Filed: August 9, 2006
    Publication date: February 21, 2008
    Inventors: Paul Chalmer, John J. Fortman, Phillip O. Miller, Robert Renz