Patents by Inventor Phuong P. P. Bui

Phuong P. P. Bui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10676572
    Abstract: Some variations provide a curable resin formulation for a water-decomposable thermoset material, comprising: first molecules containing a boron-oxygen-silicon group and a first functional group that is reactive for free-radical, cationic, and/or hydrosilylation polymerization; optionally second molecules containing at least one second functional group that is reactive with the first molecules; and a polymerization initiator. Other variations provide a curable resin formulation comprising: first molecules containing a polyester group and a first functional group that is reactive for free-radical, cationic, and/or hydrosilylation polymerization; optionally second molecules containing at least one second functional group that is reactive with the first molecules; and a polymerization initiator.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: June 9, 2020
    Assignee: HRL Laboratories, LLC
    Inventors: April R. Rodriguez, Zak C. Eckel, Phuong P. P. Bui, Ashley M. Dustin