Abstract: The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.

Abstract: An integrated circuit (IC) package includes solder paste inter-layer and alignment apparatus 100 for applying and aligning solder paste 150 with corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 includes a thin layer 100 which is composed of high-temperature-resistant, non-solder-wetting, and electrical-insulating materials. The apparatus further has a plurality of apertures 110, each disposed on and penetrating through the thin layer 100 for applying solder paste 150 therein and for aligning with the corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 further includes a removable thin film tape 120 disposed on a bottom surface of the thin layer 100 for temporarily maintaining the solder paste 150 in the plurality of apertures 110.