Patents by Inventor Pirmin Hermann Otto Rombach
Pirmin Hermann Otto Rombach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230356998Abstract: In an embodiment, a method for fabricating a Microelectromechanical System (MEMS) microphone includes depositing, on a frontside of a wafer, a first oxide layer over a silicon nitride thin film and over and adjacent the wafer, wherein the silicon nitride thin film is disposed over the wafer, depositing a membrane protection layer over the first oxide layer between a first side of a first cavity formed in the wafer and a second side of a second cavity formed in the wafer, depositing a second oxide layer over and adjacent the membrane protection layer, depositing a first membrane nitride layer over the second oxide layer, depositing a membrane polysilicon layer over the first membrane nitride layer, depositing a second membrane nitride layer over the membrane polysilicon layer, depositing a third oxide layer over the second membrane nitride layer and depositing a fourth oxide layer over the third oxide layer.Type: ApplicationFiled: July 24, 2023Publication date: November 9, 2023Inventors: Pirmin Hermann Otto Rombach, Kurt Rasmussen, Dennis Mortensen, Cheng-Yen Liu, Morten Ginnerup, Jan Tue Ravnkilde, Jotaro Akiyama
-
Publication number: 20230308792Abstract: A microphone component and a method for fabricating a microphone component are disclosed. In an embodiment, a method includes fabricating a microphone component having a backplate and a membrane in a MEMS technology, forming a plurality of holes in the membrane, the holes having diameters smaller than 5 ?m, choosing a value for a low frequency roll-off and a diameter of the holes in the membrane and choosing a number of holes such that the chosen value for low frequency roll-off is achieved.Type: ApplicationFiled: June 2, 2023Publication date: September 28, 2023Inventors: Pirmin Hermann Otto Rombach, Dennis Mortensen
-
Patent number: 11746001Abstract: A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that include a first lateral etch stop that includes a first corner radius and a second lateral etch stop that includes a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.Type: GrantFiled: May 5, 2021Date of Patent: September 5, 2023Assignees: TDK Electronics AG, TDK CorporationInventors: Pirmin Hermann Otto Rombach, Kurt Rasmussen, Dennis Mortensen, Cheng-Yen Liu, Morten Ginnerup, Jan Tue Ravnkilde, Jotaro Akiyama
-
Patent number: 11736845Abstract: A microphone component and a method for fabricating a microphone component are disclosed. In an embodiment, a microphone component includes a membrane and a backplate, wherein the membrane includes a plurality of holes, and wherein the holes have diameters smaller than 5 ?m.Type: GrantFiled: March 19, 2021Date of Patent: August 22, 2023Assignee: TDK CorporationInventors: Pirmin Hermann Otto Rombach, Dennis Mortensen
-
Patent number: 11496829Abstract: A charge pump having an input section, and first and second output charge pump sections. The input section includes an input and output node and N input charge pump cells arranged between the input and output nodes. The first output charge pump section includes a first input and output node and M first charge pump cells arranged between the first input and output nodes. The second output charge pump section includes a second input and output node and K second charge pump cells arranged between the second input and output nodes (M, N, K: any integer?1). The output node of the input charge pump section is coupled with the first input node of the first output charge pump section and with the second input node of the second output charge pump section. The charge pump is configured to provide a first output voltage on the first output node and a second output voltage on the second output node.Type: GrantFiled: November 20, 2018Date of Patent: November 8, 2022Assignee: TDK CorporationInventors: Lei Zou, Gino Rocca, Pirmin Hermann Otto Rombach
-
Patent number: 11272296Abstract: A dual membrane microphone is disclosed. In an embodiment, a MEMS microphone includes a first membrane, a backplate with a separated central area including a first backplate electrode on a lower portion of the backplate, a second backplate electrode on a upper portion of the backplate and a backplate insulation layer galvanically isolating the first and the second backplate electrodes, a second membrane and a coupling central portion, wherein the first membrane couples mechanically to the separated central area of the backplate in an electrically isolating manner and the separated central area of the backplate couples to the second membrane in an electrically isolating manner.Type: GrantFiled: August 17, 2020Date of Patent: March 8, 2022Inventor: Pirmin Hermann Otto Rombach
-
Patent number: 11172313Abstract: A MEMS microphone integrates a temperature-sensing element in or on the ASIC die of a MEMS microphone to enable an audio mode and a temperature-sensing mode in parallel. The system also permits for a method for easily switching between these two modes and for outputting both digital output signals at the same common output pad, which allows for the use of the footprint of a conventional microphone.Type: GrantFiled: March 20, 2018Date of Patent: November 9, 2021Assignee: TDK CorporationInventors: Lei Zou, Pirmin Hermann Otto Rombach, Henning Petersen
-
Publication number: 20210306728Abstract: A microphone component and a method for fabricating a microphone component are disclosed. In an embodiment, a microphone component includes a membrane and a backplate, wherein the membrane includes a plurality of holes, and wherein the holes have diameters smaller than 5 ?m.Type: ApplicationFiled: March 19, 2021Publication date: September 30, 2021Inventors: Pirmin Hermann Otto Rombach, Dennis Mortensen
-
Patent number: 11128959Abstract: A MEMS microphone including a carrier board and a MEMS chip mounted thereon over a sound opening. A filter chip includes a bulk material with an aperture covered and closed by a mesh. The mesh includes a layer of the filter chip with parallel through-going first holes structured in the layer. The filter chip is arranged in or on the carrier board such that the mesh covers the sound opening.Type: GrantFiled: July 3, 2018Date of Patent: September 21, 2021Assignee: TDK CorporationInventors: Pirmin Hermann Otto Rombach, Dennis Mortensen, Jan Tue Ravnkilde, Kurt Rasmussen, Morten Ginnerup
-
Publication number: 20210127212Abstract: It is proposed to integrate a temperature-sensing element in or on the ASIC die of a MEMS microphone to enable an audio mode and a temperature-sensing mode in parallel. A method for easily switching between these two modes and for outputting both digital output signals at the same common output pad is given allowing to use the footprint of a conventional microphone.Type: ApplicationFiled: March 20, 2018Publication date: April 29, 2021Inventors: Lei Zou, Pirmin Hermann Otto Rombach, Henning Petersen
-
Publication number: 20210067882Abstract: A dual membrane microphone is disclosed. In an embodiment, a MEMS microphone includes a first membrane, a backplate with a separated central area including a first backplate electrode on a lower portion of the backplate, a second backplate electrode on a upper portion of the backplate and a backplate insulation layer galvanically isolating the first and the second backplate electrodes, a second membrane and a coupling central portion, wherein the first membrane couples mechanically to the separated central area of the backplate in an electrically isolating manner and the separated central area of the backplate couples to the second membrane in an electrically isolating manner.Type: ApplicationFiled: August 17, 2020Publication date: March 4, 2021Inventor: Pirmin Hermann Otto Rombach
-
Publication number: 20200322721Abstract: A charge pump having an input section, and first and second output charge pump sections. The input section includes an input and output node and N input charge pump cells arranged between the input and output nodes. The first output charge pump section includes a first input and output node and M first charge pump cells arranged between the first input and output nodes. The second output charge pump section includes a second input and output node and K second charge pump cells arranged between the second input and output nodes (M, N, K: any integer?1). The output node of the input charge pump section is coupled with the first input node of the first output charge pump section and with the second input node of the second output charge pump section. The charge pump is configured to provide a first output voltage on the first output node and a second output voltage on the second output node.Type: ApplicationFiled: November 20, 2018Publication date: October 8, 2020Inventors: Lei Zou, Gino Rocca, Pirmin Hermann Otto Rombach
-
Patent number: 10683201Abstract: A MEMS device having a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.Type: GrantFiled: September 30, 2015Date of Patent: June 16, 2020Assignee: TDK CorporationInventors: Pirmin Hermann Otto Rombach, Kurt Rasmussen, Anton Leidl, Wolfgang Pahl, Dennis Mortensen
-
Publication number: 20200169818Abstract: A MEMS microphone is provided comprising a carrier board and a MEMS chip mounted thereon over a sound opening. A filter chip comprises a bulk material with an aperture covered and closed by a mesh. The mesh comprises a layer of the filter chip with parallel through-going first holes structured in the layer. The filter chip is arranged in or on the carrier board such that the mesh covers the sound opening.Type: ApplicationFiled: July 3, 2018Publication date: May 28, 2020Inventors: Pirmin Hermann Otto Rombach, Dennis Mortensen, Jan Tue Ravnkilde, Kurt Rasmussen, Morten Ginnerup
-
Patent number: 10622957Abstract: An integrated circuit, a circuit assembly and a method for operation the integrated circuit are disclosed. In embodiments an integrated circuit includes at least one supply voltage terminal configured to receive a supply voltage for operation of the integrated circuit, at least one input terminal configured to receive an analog input signal corresponding to an audio signal, at least one output terminal configured to provide an analog output signal, a signal strength detector configured to detect a signal strength of the analog input signal provided at the at least one input terminal and a signaling circuit configured to indicate an amplification setting of the integrated circuit at the at least one output terminal, wherein the integrated circuit is configured to amplify the audio signal based on the detected signal strength and to output a corresponding amplified signal at the at least one output terminal.Type: GrantFiled: May 11, 2018Date of Patent: April 14, 2020Assignee: TDK CORPORATIONInventors: Pirmin Hermann Otto Rombach, Gino Rocca, Anton Leidl, Armin Schober
-
Patent number: 10587961Abstract: The present application relates to a transducer element (1) which comprises: a movable diaphragm (2, 2a, 2b) which has a border (4), a frame (5) to which the border (4) of the diaphragm (2, 2a, 2b) is attached, and a reinforcement element (10) which connects to one another a first sub-section of the frame (5) and a second sub-section of the frame (5) which lies opposite the first sub-section.Type: GrantFiled: June 12, 2015Date of Patent: March 10, 2020Assignee: TDK CorporationInventor: Pirmin Hermann Otto Rombach
-
Patent number: 10581397Abstract: An integrated circuit, a circuit assembly and a method for operation the integrated circuit are disclosed. In embodiments the integrated circuit includes at least one supply voltage terminal configured to receive a supply voltage for operation the integrated circuit, at least one input terminal configured to receive an analog input signal corresponding to an audio signal, at least one output terminal configured to provide an analog output signal and a signal strength detector configured to detect a signal strength of the analog input signal provided at the at least one input terminal, wherein the integrated circuit is configured to amplify an audio signal based on the detected signal strength and to output a corresponding amplified signal at the at least one output terminal, wherein the integrated circuit comprises a signaling circuit configured to indicate an amplification setting of the integrated circuit at the at least one supply voltage terminal.Type: GrantFiled: September 7, 2015Date of Patent: March 3, 2020Assignee: TDK CORPORATIONInventors: Pirmin Hermann Otto Rombach, Gino Rocca, Anton Leidl, Armin Schober
-
Patent number: 10484797Abstract: A MEMS microphone with improved sensitivity and a method for producing such a MEMS microphone are disclosed. In an embodiment the MEMS microphone includes a carrier substrate, a capacitor having two electrodes, a substrate-side anchor and an electrode anchor, wherein the substrate-side anchor connects the substrate to the capacitor, wherein the electrode anchor connects the two electrodes of the capacitor, wherein one of the electrodes is a backplate and the other electrode is the anchored membrane, and wherein the substrate-side anchor has a bearing area on the substrate which exceeds a minimum area necessary for a mechanical stability of the MEMS microphone by not more than the minimum area.Type: GrantFiled: May 18, 2015Date of Patent: November 19, 2019Assignee: EPCOS AGInventor: Pirmin Hermann Otto Rombach
-
Patent number: 10351416Abstract: A model is specified in which a MEMS component is connected to the carrier in a stress-free fashion over a large temperature range. For this purpose, a mechanical connection comprises a compensation structure which bridges a horizontal offset of mounting points by means of a horizontal shoulder and the thermal expansion coefficient of which is suitably selected.Type: GrantFiled: November 6, 2015Date of Patent: July 16, 2019Assignee: TDK CorporationInventor: Pirmin Hermann Otto Rombach
-
Patent number: 10237638Abstract: In order to adjust an electric device, it is proposed to integrate a programmable memory unit into the device and to address said programmable memory unit without enlarging the footprint, via contact areas that are obtained by dividing previous contact areas. In this case, an adjustment value in particular for compensating for a fault tolerance is fed into the memory unit, an operating parameter being readjusted with the aid of said adjustment value. In each case two divided contact areas are short-circuited via a common soldering location during the mounting of the device.Type: GrantFiled: February 18, 2015Date of Patent: March 19, 2019Assignee: TDK CorporationInventor: Pirmin Hermann Otto Rombach