Patents by Inventor Po-Hung Lin
Po-Hung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240094498Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.Type: ApplicationFiled: September 14, 2023Publication date: March 21, 2024Inventors: Po-Xiang ZHUANG, Chen-Hung CHAO, Wei-Jhe SHEN, Shou-Jen LIU, Kun-Shih LIN, Yi-Ho CHEN
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Publication number: 20240096787Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Ming-Da CHENG, Wei-Hung LIN, Hui-Min HUANG, Chang-Jung HSUEH, Po-Hao TSAI, Yung-Sheng LIN
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Patent number: 11936927Abstract: A multimedia signal transmission control system is provided, which includes a transmitter control circuit and a receiver control circuit coupled with each other. The transmitter control circuit packs a control signal and at least one of multimedia signals into first hybrid data packets in an active video period of a video frame, and packs the control signal and another at least one of the multimedia signals into second hybrid data packets in a vertical front porch and a vertical back porch of the video frame. The receiver control circuit receives the first hybrid data packets in the active video period, and receives the second hybrid data packets in the vertical front porch and the vertical back porch. The receiver control circuit unpacks the first hybrid data packets and the second hybrid data packets to provide the control signal and the multimedia signals to a display module.Type: GrantFiled: September 8, 2021Date of Patent: March 19, 2024Assignee: Realtek Semiconductor CorporationInventors: Yun-Hung Lin, Po-Hsien Wu, Li-Yu Chen
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Publication number: 20240087974Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng
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Publication number: 20240088307Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11929318Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.Type: GrantFiled: May 10, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11929767Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.Type: GrantFiled: August 16, 2022Date of Patent: March 12, 2024Assignee: MEDIATEK INC.Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
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Patent number: 11927780Abstract: A dielectric grating apparatus comprises a substrate; a grating layer, disposed above the substrate; a first interference layer, disposed above the substrate; and a second interference layer, adjacent to the first interference layer, wherein a refractive index of a material of the second interference layer is greater than a refractive index of a material of the first interference layer.Type: GrantFiled: May 31, 2022Date of Patent: March 12, 2024Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Jian-Hung Lin, Chiang-Hsin Lin, Po-Tse Tai, Tsong-Dong Wang, Bo-Kai Feng
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Publication number: 20240077744Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.Type: ApplicationFiled: September 7, 2023Publication date: March 7, 2024Inventors: Po-Xiang ZHUANG, Chen-Hung CHAO, Wei-Jhe SHEN, Shou-Jen LIU, Kun-Shih LIN, Yi-Ho CHEN
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Publication number: 20240079267Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first diffusion barrier layer made of a dielectric material including a metal element, nitrogen, and oxygen and a first protection layer made of a dielectric material including silicon and oxygen and in direct contact with the top surface of the first diffusion barrier layer. The semiconductor device structure also includes a first thickening layer made of a dielectric material including the metal element and oxygen and in direct contact with the top surface of the first protection layer. A maximum metal content in the first thickening layer is greater than that in the first diffusion barrier layer. The semiconductor device structure further includes a conductive feature surrounded by and in direct contact with the first diffusion barrier layer, the first protection layer, and the first thickening layer.Type: ApplicationFiled: November 9, 2023Publication date: March 7, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Po-Cheng SHIH, Tze-Liang LEE, Jen-Hung WANG, Yu-Kai LIN, Su-Jen SUNG
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Publication number: 20240077697Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.Type: ApplicationFiled: September 7, 2023Publication date: March 7, 2024Inventors: Po-Xiang ZHUANG, Chen-Hung CHAO, Wei-Jhe SHEN, Shou-Jen LIU, Kun-Shih LIN, Yi-Ho CHEN
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Publication number: 20230421280Abstract: A time synchronization method for a time synchronization device, wherein the device is connected to a plurality of time synchronization domains through a plurality of ports, and the plurality of time synchronization domains use a plurality of PTP profiles. The method comprises determining whether each of the plurality of ports is a time receiving port or a time transmitting port; obtaining information of a grandmaster clock of the plurality of time synchronization domains; performing information conversion on the information of the grandmaster clock according to a PTP profile corresponding to each time transmitting port of the plurality of ports in the plurality of PTP profiles, so as to generate a plurality of clock information corresponding to each time transmitting port; and transmitting a corresponding clock information of the plurality of clock information to a corresponding time synchronization domain from each time transmitting port, so as to perform time synchronization.Type: ApplicationFiled: June 8, 2023Publication date: December 28, 2023Applicant: Moxa Inc.Inventors: Chi-Chuan Liu, Chun-Yu Lin, Chien-Yu Lai, Po-Hung Lin
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Patent number: 11803113Abstract: The invention provides a light source module including a substrate, a plurality of light emitting elements, a buffer element, and a cover plate. The substrate has a plurality of accommodation grooves. The light emitting elements are respectively disposed in the accommodation grooves. Each light emitting element has a light emitting portion and a bottom portion connected to each other. The light emitting portion is located on the bottom portion, and the bottom portion has an edge. The buffer element is pressed against the edges of the bottom portions of the light emitting elements. The cover plate is combined with the substrate and is pressed against the buffer element. The cover plate has a plurality of first openings. These first openings respectively expose the light emitting elements. The invention also provides a projection apparatus has above-mentioned light source module.Type: GrantFiled: November 22, 2021Date of Patent: October 31, 2023Assignee: Coretronic CorporationInventor: Po-Hung Lin
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Publication number: 20230170696Abstract: A control device for controlling a power generation system comprises a reception module, for receiving environmental data from the power generation system; an environment generation module, coupled to the reception module, for generating an environment state of the power generation system according to the environment data and an environment model; a strategy generation module, coupled to the environment generation module, for generating a power of the power generation system according to the environmental state, and for generating a control strategy of the power generation system according to the power; a transmission module, coupled to the strategy generation module, for transmitting the control strategy to the power generation system.Type: ApplicationFiled: January 10, 2022Publication date: June 1, 2023Applicant: National Cheng Kung UniversityInventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Po-Hung Lin, Yi-Heng Chen, Ping-Han Huang
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Publication number: 20230060459Abstract: An image object classification optimizing method and system are disclosed. The method is executed by a processor coupled to a memory. The method includes steps: providing an image file including at least one image object; performing a process of characteristics enhancement on the image object; performing a process of characteristics classification on the enhanced image object by an odd number of two-dimensional masks whose sizes are sequentially doubled, based on a plurality of characteristic parameters of a preferred classification model, to generate a plurality of classification results; and estimating variabilities of the plurality of classification results, sorting the variabilities, and selecting at least one of the classification results whose variability is lower than a variation tolerance as at least one optimization result, according to the sorting result.Type: ApplicationFiled: September 1, 2021Publication date: March 2, 2023Inventors: Yan-Jhih WANG, Po-Hung LIN, Chia-Ying HSIEH, Yu-Siang FAN JIANG, Jiun-Huei HO
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Publication number: 20220338749Abstract: The present invention provides a pulse diagnosis device including at least one bellow, at least one sensor, and a locating element. The bellow has a sensing surface having a first end and a second end opposite to each other. The sensor is disposed on the sensing surface and has a sensing area at least partially extending from the first end to the second end or protruding from the second end. The locating element is at least partially disposed along the second end to position the sensor at the second end, wherein the sensing area does not overlap with the locating element at least partially.Type: ApplicationFiled: November 23, 2021Publication date: October 27, 2022Inventors: CHUNG-CHIN HUANG, PO-HUNG LIN, MIN-QIAN JIANG, YI-HAN CHANG, HAO-LUN HSIEH, WEN-BIN HSU
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Publication number: 20220327253Abstract: An interactive information system includes a first frame, a second frame, and a first inter-frame cable. A first interactive module is arranged in the first frame and includes a first display module; a first touch input module; at least one first user input device; a first control module bridge board configured to transmit intra-frame electrical signals; a first interactive module bridge board configured to transmit inter-frame signals; and a first intra-frame cable. A control module is arranged in the second frame and includes a logic module configured to generate the first GUI and to perform function of the interactive information system based on user inputs. The first interactive module and the control module are electrically coupled via only the first inter-frame cable. Both the first frame and the second frame contain an electro-magnetic (EM) shielding material.Type: ApplicationFiled: June 27, 2022Publication date: October 13, 2022Applicant: Flytech Technology Co, Ltd.Inventors: Tai-Seng Lam, Po-Hung LIN, Hsuan-Chuan WANG, Yong-Shun KUAN
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Publication number: 20220284144Abstract: An interactive information system includes: a first frame, a first interactive module arranged in the first frame, a second frame, a control module arranged in the second frame and configured to generate the GUI and to perform a function of the interactive information system based on the first user input; and a first internal cable connecting the first interactive module bridge board and the control module and configured to transmit the plurality of inter-frame signals between the first frame and the second frame. The first interactive module includes: a first display module configured to display a graphic user interface (GUI) of the interactive information system; a first touch input module configured to receive a first user input to the GUI; and a first interactive module bridge board configured to transmit a plurality of inter-frame signals comprising electrical signals of the first display module and the first touch input module.Type: ApplicationFiled: May 24, 2022Publication date: September 8, 2022Applicant: Flytech Technology Co., Ltd.Inventors: Tai-Seng Lam, Po-Hung Lin, Hsuan-Chuan Wang, Yong-Shun Kuan
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Patent number: D1015516Type: GrantFiled: May 17, 2021Date of Patent: February 20, 2024Assignee: GREENFILTEC LTD.Inventors: Po-Hung Lin, Yu-De Lien