Patents by Inventor Po Ju Wu

Po Ju Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fluid delivery apparatus
    Patent number: 11944746
    Abstract: A fluid delivery apparatus comprises a first piston body, a second piston body, a fluid delivery pipe, and a sealing element. The first piston body has a first through hole, a first connecting portion, an accommodation space and a buffer space. The second piston body has a second through hole and a second connecting portion disposed inside the accommodation space. The fluid delivery pipe is accommodated in the first through hole and the second through hole, and movable between a first position and a second position. The sealing element encircles the fluid delivery pipe. When the fluid delivery pipe is at the first position, the sealing element is accommodated in the accommodation space. When the fluid delivery pipe is at the second position, a first part of the sealing element is accommodated in the accommodation space, and a second part of the sealing element is accommodated in the buffer space.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: April 2, 2024
    Assignee: MICROBASE TECHNOLOGY CORP.
    Inventors: Chiu-Ju Shen, Po Chuan Chen, Jo Ling Wu
  • OPTICAL DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20220128768
    Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.
    Type: Application
    Filed: January 4, 2022
    Publication date: April 28, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Huang-Hsien CHANG, Po Ju WU, Yu Cheng CHEN, Wen-Long LU
  • Optical device package and method for manufacturing the same
    Patent number: 11215762
    Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.
    Type: Grant
    Filed: August 15, 2018
    Date of Patent: January 4, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Huang-Hsien Chang, Po Ju Wu, Yu Cheng Chen, Wen-Long Lu
  • Optica device package and method for manufacturing the same
    Publication number: 20200057201
    Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.
    Type: Application
    Filed: August 15, 2018
    Publication date: February 20, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Huang-Hsien Chang, Po Ju Wu, Yu Cheng Chen, Wen-Long Lu