Patents by Inventor Po Tang

Po Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11878083
    Abstract: Multi component fibres for the reduction of the damaging activity of wound exudate components such as protein degrading enzymes and inflammatory mediators in wounds, the fibres comprising: from 10% to 100% by weight of the fibres of pectin and a sacrificial proteinaceous material in a weight ratio of 100:0 to 10:90 pectin to sacrificial proteinaceous material and from 0% to 90% by weight of the fibres of another polysaccharide or a water soluble polymer.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: January 23, 2024
    Assignee: CONVATEC TECHNOLOGIES INC.
    Inventors: Lucy Louisa Ballamy, Sharon Lam Po Tang, Marion Herbe, Alan Rogers, Sean Kelly
  • Patent number: 11619806
    Abstract: A microscope apparatus includes light source configured to generate an illuminating beam. The microscope apparatus further includes a first beam splitter configured to split the illuminating beam into a first component along a first path and a second component along a second path. The microscope apparatus further includes a movable reflector module along the second path. The microscope apparatus further includes a moving mechanism connected to the movable reflector module, wherein the moving mechanism is configured to move the movable reflector in a first direction for adjusting a length of the second path. The microscope apparatus further includes a second beam splitter configured to recombine the first component and the second component. The microscope apparatus further includes an observing device configured to receive the recombined first component and second component.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: April 4, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fu-Sheng Chu, Chih-Shiang Chou, Yu-Po Tang, Yan-Ying He
  • Publication number: 20220336181
    Abstract: An assembly present in an ion source for supporting an arc chamber upon a base plate includes a first arc support plate, a first screw, and a second screw. The first screw passes through a smooth through-hole in an arm of the first arc support plate and extends into a bore in the base plate. The second (or adjustable) screw passes through a threaded through-hole in an arm of the first arc support plate and engages an upper surface of the base plate itself, and can be used to change the altitude and angle of the first arc support plate relative to the base plate. This adjustment ability improves the beam quality of the ion source.
    Type: Application
    Filed: July 15, 2021
    Publication date: October 20, 2022
    Inventors: Po-Tang Tseng, Ching-Heng Yen, Tai-Kun Kao, Sheng-Tai Peng
  • Publication number: 20220096704
    Abstract: Multi component fibres for the reduction of the damaging activity of wound exudate components such as protein degrading enzymes and inflammatory mediators in wounds, the fibres comprising: from 10% to 100% by weight of the fibres of pectin and a sacrificial proteinaceous material in a weight ratio of 100:0 to 10:90 pectin to sacrificial proteinaceous material and from 0% to 90% by weight of the fibres of another polysaccharide or a water soluble polymer.
    Type: Application
    Filed: November 9, 2021
    Publication date: March 31, 2022
    Inventors: Lucy Louisa Ballamy, Sharon Lam Po Tang, Marion Herbe, Alan Rogers, Sean Kelly
  • Patent number: 11048161
    Abstract: Optical proximity correction (OPC) based computational lithography techniques are disclosed herein for enhancing lithography printability. An exemplary mask optimization method includes receiving an integrated circuit (IC) design layout having an IC pattern; generating target points for a contour corresponding with the IC pattern based on a target placement model, wherein the target placement model is selected based on a classification of the IC pattern; and performing an OPC on the IC pattern using the target points, thereby generating a modified IC design layout. The method can further include fabricating a mask based on the modified IC design layout. The OPC can select an OPC model based on the classification of the IC pattern. The OPC model can weight the target placement model.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: June 29, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Chun Wang, Chi-Ping Liu, Feng-Ju Chang, Ching-Hsu Chang, Wen Hao Liu, Chia-Feng Yeh, Ming-Hui Chih, Cheng Kun Tsai, Wei-Chen Chien, Wen-Chun Huang, Yu-Po Tang
  • Publication number: 20210072527
    Abstract: A microscope apparatus includes light source configured to generate an illuminating beam. The microscope apparatus further includes a first beam splitter configured to split the illuminating beam into a first component along a first path and a second component along a second path. The microscope apparatus further includes a movable reflector module along the second path. The microscope apparatus further includes a moving mechanism connected to the movable reflector module, wherein the moving mechanism is configured to move the movable reflector in a first direction for adjusting a length of the second path. The microscope apparatus further includes a second beam splitter configured to recombine the first component and the second component. The microscope apparatus further includes an observing device configured to receive the recombined first component and second component.
    Type: Application
    Filed: November 19, 2020
    Publication date: March 11, 2021
    Inventors: Fu-Sheng CHU, Chih-Shiang CHOU, Yu-Po TANG, Yan-Ying HE
  • Patent number: 10866397
    Abstract: A microscope apparatus including an electromagnetic wave source configured to generate an illuminating electromagnetic wave. The microscope apparatus includes a first beam splitter configured to split the illuminating electromagnetic wave into a first component along a first path and a second component along a second path. The microscope apparatus includes a movable reflector module configured to adjust the second path. The microscope apparatus includes a second beam splitter configured to recombine the first component and the second component. The microscope apparatus includes an observing device arranged along the first path and configured to receive the recombined first component and second component. The microscope apparatus is configured to acquire, from the observing device, a phase image based on positioning of the movable reflector module and representative of an electric field distribution near an object located along the first path between the first beam splitter and the second beam splitter.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fu-Sheng Chu, Chih-Shiang Chou, Yu-Po Tang, Yan-Ying He
  • Publication number: 20200142294
    Abstract: Optical proximity correction (OPC) based computational lithography techniques are disclosed herein for enhancing lithography printability. An exemplary mask optimization method includes receiving an integrated circuit (IC) design layout having an IC pattern; generating target points for a contour corresponding with the IC pattern based on a target placement model, wherein the target placement model is selected based on a classification of the IC pattern; and performing an OPC on the IC pattern using the target points, thereby generating a modified IC design layout. The method can further include fabricating a mask based on the modified IC design layout. The OPC can select an OPC model based on the classification of the IC pattern. The OPC model can weight the target placement model.
    Type: Application
    Filed: December 27, 2019
    Publication date: May 7, 2020
    Inventors: Hung-Chun Wang, Chi-Ping Liu, Feng-Ju Chang, Ching-Hsu Chang, Wen Hao Liu, Chia-Feng Yeh, Ming-Hui Chih, Cheng Kun Tsai, Wei-Chen Chien, Wen-Chun Huang, Yu-Po Tang
  • Patent number: 10527928
    Abstract: Optical proximity correction (OPC) based computational lithography techniques are disclosed herein for enhancing lithography printability. An exemplary mask optimization method includes receiving an integrated circuit (IC) design layout having an IC pattern; generating target points for a contour corresponding with the IC pattern based on a target placement model, wherein the target placement model is selected based on a classification of the IC pattern; and performing an OPC on the IC pattern using the target points, thereby generating a modified IC design layout. The method can further include fabricating a mask based on the modified IC design layout. The OPC can select an OPC model based on the classification of the IC pattern. The OPC model can weight the target placement model.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: January 7, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Chun Wang, Chi-Ping Liu, Feng-Ju Chang, Ching-Hsu Chang, Wen Hao Liu, Chia-Feng Yeh, Ming-Hui Chih, Cheng Kun Tsai, Wei-Chen Chien, Wen-Chun Huang, Yu-Po Tang
  • Publication number: 20190250393
    Abstract: A microscope apparatus including an electromagnetic wave source configured to generate an illuminating electromagnetic wave. The microscope apparatus includes a first beam splitter configured to split the illuminating electromagnetic wave into a first component along a first path and a second component along a second path. The microscope apparatus includes a movable reflector module configured to adjust the second path. The microscope apparatus includes a second beam splitter configured to recombine the first component and the second component. The microscope apparatus includes an observing device arranged along the first path and configured to receive the recombined first component and second component. The microscope apparatus is configured to acquire, from the observing device, a phase image based on positioning of the movable reflector module and representative of an electric field distribution near an object located along the first path between the first beam splitter and the second beam splitter.
    Type: Application
    Filed: April 25, 2019
    Publication date: August 15, 2019
    Inventors: Fu-Sheng CHU, Chih-Shiang CHOU, Yu-Po TANG, Yan-Ying HE
  • Patent number: 10295813
    Abstract: A microscope apparatus includes an electromagnetic wave source configured to generate an illuminating electromagnetic wave, a first beam splitter configured to split the illuminating electromagnetic wave into a first component along a first path and a second component along a second path, a movable reflector module configured to adjust a portion of the second path, and a second beam splitter configured to recombine the first component and the second component. An observing device is configured to receive the recombined first component and second component and the microscope apparatus is configured acquire a phase image from the observing device based on positioning of the movable reflector module and representative of an electric field distribution near an object located along the first path between the first beam splitter and the second beam splitter.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: May 21, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fu-Sheng Chu, Chih-Shiang Chou, Yu-Po Tang, Yan-Ying He
  • Publication number: 20180173090
    Abstract: Optical proximity correction (OPC) based computational lithography techniques are disclosed herein for enhancing lithography printability. An exemplary mask optimization method includes receiving an integrated circuit (IC) design layout having an IC pattern; generating target points for a contour corresponding with the IC pattern based on a target placement model, wherein the target placement model is selected based on a classification of the IC pattern; and performing an OPC on the IC pattern using the target points, thereby generating a modified IC design layout. The method can further include fabricating a mask based on the modified IC design layout. The OPC can select an OPC model based on the classification of the IC pattern. The OPC model can weight the target placement model.
    Type: Application
    Filed: July 19, 2017
    Publication date: June 21, 2018
    Inventors: Hung-Chun Wang, Chi-Ping Liu, Feng-Ju Chang, Ching-Hsu Chang, Wen Hao Liu, Chia-Feng Yeh, Ming-Hui Chih, Cheng Kun Tsai, Wei-Chen Chien, Wen-Chun Huang, Yu-Po Tang
  • Patent number: 9716032
    Abstract: The present disclosure provides a method for forming a semiconductor device. The semiconductor device includes a first conductive line disposed over a substrate. The first conductive line is located in a first interconnect layer and extends along a first direction. The semiconductor device includes a second conductive line and a third conductive line each extending along a second direction different from the first direction. The second and third conductive lines are located in a second interconnect layer that is different from the first interconnect layer. The second and third conductive lines are separated by a gap that is located over or below the first conductive line. The semiconductor device includes a fourth conductive line electrically coupling the second and third conductive lines together. The fourth conductive line is located in a third interconnect layer that is different from the first interconnect layer and the second interconnect layer.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: July 25, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Po Tang, Shih-Ming Chang, Ken-Hsien Hsieh, Ru-Gun Liu
  • Patent number: 9390217
    Abstract: A method for performing optical proximity correction (OPC) and evaluating OPC solutions is disclosed. An exemplary method includes receiving a design database corresponding to an IC circuit mask. A first OPC modification to a mask feature of the design database is made by performing a first OPC process. The OPC process includes: dividing the mask feature into child shapes and adjusting an attribute of a child shape based on an edge placement error (EPE) factor. A first lithography simulation is performed utilizing a first set of performance indexes after making the first OPC modification, and a second OPC modification to the mask feature is made based on a result of the first lithography simulation. A second lithography simulation of the mask feature is performed utilizing a second set of performance indexes to verify the first and second OPC modifications, and the design database is provided for manufacturing.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: July 12, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chun Wang, Ming-Hui Chih, Yu-Po Tang, Chia-Ping Chiang, Feng-Ju Chang, Cheng Kun Tsai, Wen-Chun Huang, Ru-Gun Liu
  • Publication number: 20160121013
    Abstract: Multi component fibres for the reduction of the damaging activity of wound exudate components such as protein degrading enzymes and inflammatory mediators in wounds, the fibres comprising: from 10% to 100% by weight of the fibres of pectin and a sacrificial proteinaceous material in a weight ratio of 100:0 to 10:90 pectin to sacrificial proteinaceous material and from 0% to 90% by weight of the fibres of another polysaccharide or a water soluble polymer.
    Type: Application
    Filed: July 22, 2011
    Publication date: May 5, 2016
    Applicant: CONVATEC TECHNOLOGIES INC.
    Inventors: Lucy Louisa Ballamy, Sharon Lam Po Tang, Marion Herbe, Alan Rogers, Sean Kelly
  • Patent number: 9189588
    Abstract: Methods and systems for design of integrated circuits including performing OPC are discussed. In one embodiment, design data having a geometric feature is provided. A base feature is formed from the geometric feature, which has a substantially linear edge. A pseudo dissection point is determined on the base feature. Add or trim a polygon from the base feature to form a modified feature. An OPC process is performed on the modified feature to generate an output design. The output design is used to fabricate a semiconductor device on a semiconductor substrate.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: November 17, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Li Cheng, Ming-Hui Chih, Yu-Po Tang, Chia-Ping Chiang, Cheng-Lung Tsai, Sheng-Wen Lin, Kuei-Liang Lu, Wen-Chun Huang, Ru-Gun Liu
  • Patent number: 9165095
    Abstract: A method performed by a computer processing system includes receiving a design pattern for an integrated circuit, applying a function to the design pattern to generate a model contour, generating a plurality of Optical Proximity Correction (OPC) target points along the model contour, adjusting the design pattern to create an adjusted pattern, and performing a simulation on the adjusted pattern to create a simulated contour.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: October 20, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Hui Chih, Wen-Li Cheng, Yu-Po Tang, Ping-Chieh Wu, Chia-Ping Chiang, Yong-Cheng Lin, Wen-Chun Huang, Ru-Gun Liu
  • Publication number: 20150161321
    Abstract: Methods and systems for design of integrated circuits including performing OPC are discussed. In one embodiment, design data having a geometric feature is provided. A base feature is formed from the geometric feature, which has a substantially linear edge. A pseudo dissection point is determined on the base feature. Add or trim a polygon from the base feature to form a modified feature. An OPC process is performed on the modified feature to generate an output design. The output design is used to fabricate a semiconductor device on a semiconductor substrate.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 11, 2015
    Inventors: Wen-Li Cheng, Ming-Hui Chih, Yu-Po Tang, Chia-Ping Chiang, Cheng-Lung Tsai, Sheng-Wen Lin, Kuei-Liang Lu, Wen-Chun Huang, Ru-Gun Liu
  • Publication number: 20150143304
    Abstract: A method performed by a computer processing system includes receiving a design pattern for an integrated circuit, applying a function to the design pattern to generate a model contour, generating a plurality of Optical Proximity Correction (OPC) target points along the model contour, adjusting the design pattern to create an adjusted pattern, and performing a simulation on the adjusted pattern to create a simulated contour.
    Type: Application
    Filed: November 15, 2013
    Publication date: May 21, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Hui Chih, Wen-Li Cheng, Yu-Po Tang, Ping-Chieh Wu, Chia-Ping Chiang, Yong-Cheng Lin, Wen-Chun Huang, Ru-Gun Liu
  • Patent number: 9026957
    Abstract: An embodiment of a feed-forward method of determining a photomask pattern is provided. The method includes providing design data associated with an integrated circuit device. A thickness of a coating layer to be used in fabricating the integrated circuit device is predicted based on the design data. This prediction is used to generate a gradating pattern. A photomask is formed having the gradating pattern.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: May 5, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Chu Liu, Kuei Shun Chen, Chih-Yang Yeh, Te-Chih Huang, Wen-Hao Liu, Ying-Chou Cheng, Boren Luo, Tsong-Hua Ou, Yu-Po Tang, Wen-Chun Huang, Ru-Gun Liu, Shu-Chen Lu, Yu Lun Liu, Yao-Ching Ku, Tsai-Sheng Gau