Patents by Inventor Po Tang
Po Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11878083Abstract: Multi component fibres for the reduction of the damaging activity of wound exudate components such as protein degrading enzymes and inflammatory mediators in wounds, the fibres comprising: from 10% to 100% by weight of the fibres of pectin and a sacrificial proteinaceous material in a weight ratio of 100:0 to 10:90 pectin to sacrificial proteinaceous material and from 0% to 90% by weight of the fibres of another polysaccharide or a water soluble polymer.Type: GrantFiled: November 9, 2021Date of Patent: January 23, 2024Assignee: CONVATEC TECHNOLOGIES INC.Inventors: Lucy Louisa Ballamy, Sharon Lam Po Tang, Marion Herbe, Alan Rogers, Sean Kelly
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Patent number: 11619806Abstract: A microscope apparatus includes light source configured to generate an illuminating beam. The microscope apparatus further includes a first beam splitter configured to split the illuminating beam into a first component along a first path and a second component along a second path. The microscope apparatus further includes a movable reflector module along the second path. The microscope apparatus further includes a moving mechanism connected to the movable reflector module, wherein the moving mechanism is configured to move the movable reflector in a first direction for adjusting a length of the second path. The microscope apparatus further includes a second beam splitter configured to recombine the first component and the second component. The microscope apparatus further includes an observing device configured to receive the recombined first component and second component.Type: GrantFiled: November 19, 2020Date of Patent: April 4, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Fu-Sheng Chu, Chih-Shiang Chou, Yu-Po Tang, Yan-Ying He
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Publication number: 20220336181Abstract: An assembly present in an ion source for supporting an arc chamber upon a base plate includes a first arc support plate, a first screw, and a second screw. The first screw passes through a smooth through-hole in an arm of the first arc support plate and extends into a bore in the base plate. The second (or adjustable) screw passes through a threaded through-hole in an arm of the first arc support plate and engages an upper surface of the base plate itself, and can be used to change the altitude and angle of the first arc support plate relative to the base plate. This adjustment ability improves the beam quality of the ion source.Type: ApplicationFiled: July 15, 2021Publication date: October 20, 2022Inventors: Po-Tang Tseng, Ching-Heng Yen, Tai-Kun Kao, Sheng-Tai Peng
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Publication number: 20220096704Abstract: Multi component fibres for the reduction of the damaging activity of wound exudate components such as protein degrading enzymes and inflammatory mediators in wounds, the fibres comprising: from 10% to 100% by weight of the fibres of pectin and a sacrificial proteinaceous material in a weight ratio of 100:0 to 10:90 pectin to sacrificial proteinaceous material and from 0% to 90% by weight of the fibres of another polysaccharide or a water soluble polymer.Type: ApplicationFiled: November 9, 2021Publication date: March 31, 2022Inventors: Lucy Louisa Ballamy, Sharon Lam Po Tang, Marion Herbe, Alan Rogers, Sean Kelly
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Patent number: 11048161Abstract: Optical proximity correction (OPC) based computational lithography techniques are disclosed herein for enhancing lithography printability. An exemplary mask optimization method includes receiving an integrated circuit (IC) design layout having an IC pattern; generating target points for a contour corresponding with the IC pattern based on a target placement model, wherein the target placement model is selected based on a classification of the IC pattern; and performing an OPC on the IC pattern using the target points, thereby generating a modified IC design layout. The method can further include fabricating a mask based on the modified IC design layout. The OPC can select an OPC model based on the classification of the IC pattern. The OPC model can weight the target placement model.Type: GrantFiled: December 27, 2019Date of Patent: June 29, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hung-Chun Wang, Chi-Ping Liu, Feng-Ju Chang, Ching-Hsu Chang, Wen Hao Liu, Chia-Feng Yeh, Ming-Hui Chih, Cheng Kun Tsai, Wei-Chen Chien, Wen-Chun Huang, Yu-Po Tang
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Publication number: 20210072527Abstract: A microscope apparatus includes light source configured to generate an illuminating beam. The microscope apparatus further includes a first beam splitter configured to split the illuminating beam into a first component along a first path and a second component along a second path. The microscope apparatus further includes a movable reflector module along the second path. The microscope apparatus further includes a moving mechanism connected to the movable reflector module, wherein the moving mechanism is configured to move the movable reflector in a first direction for adjusting a length of the second path. The microscope apparatus further includes a second beam splitter configured to recombine the first component and the second component. The microscope apparatus further includes an observing device configured to receive the recombined first component and second component.Type: ApplicationFiled: November 19, 2020Publication date: March 11, 2021Inventors: Fu-Sheng CHU, Chih-Shiang CHOU, Yu-Po TANG, Yan-Ying HE
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Patent number: 10866397Abstract: A microscope apparatus including an electromagnetic wave source configured to generate an illuminating electromagnetic wave. The microscope apparatus includes a first beam splitter configured to split the illuminating electromagnetic wave into a first component along a first path and a second component along a second path. The microscope apparatus includes a movable reflector module configured to adjust the second path. The microscope apparatus includes a second beam splitter configured to recombine the first component and the second component. The microscope apparatus includes an observing device arranged along the first path and configured to receive the recombined first component and second component. The microscope apparatus is configured to acquire, from the observing device, a phase image based on positioning of the movable reflector module and representative of an electric field distribution near an object located along the first path between the first beam splitter and the second beam splitter.Type: GrantFiled: April 25, 2019Date of Patent: December 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Fu-Sheng Chu, Chih-Shiang Chou, Yu-Po Tang, Yan-Ying He
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Publication number: 20200142294Abstract: Optical proximity correction (OPC) based computational lithography techniques are disclosed herein for enhancing lithography printability. An exemplary mask optimization method includes receiving an integrated circuit (IC) design layout having an IC pattern; generating target points for a contour corresponding with the IC pattern based on a target placement model, wherein the target placement model is selected based on a classification of the IC pattern; and performing an OPC on the IC pattern using the target points, thereby generating a modified IC design layout. The method can further include fabricating a mask based on the modified IC design layout. The OPC can select an OPC model based on the classification of the IC pattern. The OPC model can weight the target placement model.Type: ApplicationFiled: December 27, 2019Publication date: May 7, 2020Inventors: Hung-Chun Wang, Chi-Ping Liu, Feng-Ju Chang, Ching-Hsu Chang, Wen Hao Liu, Chia-Feng Yeh, Ming-Hui Chih, Cheng Kun Tsai, Wei-Chen Chien, Wen-Chun Huang, Yu-Po Tang
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Patent number: 10527928Abstract: Optical proximity correction (OPC) based computational lithography techniques are disclosed herein for enhancing lithography printability. An exemplary mask optimization method includes receiving an integrated circuit (IC) design layout having an IC pattern; generating target points for a contour corresponding with the IC pattern based on a target placement model, wherein the target placement model is selected based on a classification of the IC pattern; and performing an OPC on the IC pattern using the target points, thereby generating a modified IC design layout. The method can further include fabricating a mask based on the modified IC design layout. The OPC can select an OPC model based on the classification of the IC pattern. The OPC model can weight the target placement model.Type: GrantFiled: July 19, 2017Date of Patent: January 7, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hung-Chun Wang, Chi-Ping Liu, Feng-Ju Chang, Ching-Hsu Chang, Wen Hao Liu, Chia-Feng Yeh, Ming-Hui Chih, Cheng Kun Tsai, Wei-Chen Chien, Wen-Chun Huang, Yu-Po Tang
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Publication number: 20190250393Abstract: A microscope apparatus including an electromagnetic wave source configured to generate an illuminating electromagnetic wave. The microscope apparatus includes a first beam splitter configured to split the illuminating electromagnetic wave into a first component along a first path and a second component along a second path. The microscope apparatus includes a movable reflector module configured to adjust the second path. The microscope apparatus includes a second beam splitter configured to recombine the first component and the second component. The microscope apparatus includes an observing device arranged along the first path and configured to receive the recombined first component and second component. The microscope apparatus is configured to acquire, from the observing device, a phase image based on positioning of the movable reflector module and representative of an electric field distribution near an object located along the first path between the first beam splitter and the second beam splitter.Type: ApplicationFiled: April 25, 2019Publication date: August 15, 2019Inventors: Fu-Sheng CHU, Chih-Shiang CHOU, Yu-Po TANG, Yan-Ying HE
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Patent number: 10295813Abstract: A microscope apparatus includes an electromagnetic wave source configured to generate an illuminating electromagnetic wave, a first beam splitter configured to split the illuminating electromagnetic wave into a first component along a first path and a second component along a second path, a movable reflector module configured to adjust a portion of the second path, and a second beam splitter configured to recombine the first component and the second component. An observing device is configured to receive the recombined first component and second component and the microscope apparatus is configured acquire a phase image from the observing device based on positioning of the movable reflector module and representative of an electric field distribution near an object located along the first path between the first beam splitter and the second beam splitter.Type: GrantFiled: December 3, 2014Date of Patent: May 21, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Fu-Sheng Chu, Chih-Shiang Chou, Yu-Po Tang, Yan-Ying He
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Publication number: 20180173090Abstract: Optical proximity correction (OPC) based computational lithography techniques are disclosed herein for enhancing lithography printability. An exemplary mask optimization method includes receiving an integrated circuit (IC) design layout having an IC pattern; generating target points for a contour corresponding with the IC pattern based on a target placement model, wherein the target placement model is selected based on a classification of the IC pattern; and performing an OPC on the IC pattern using the target points, thereby generating a modified IC design layout. The method can further include fabricating a mask based on the modified IC design layout. The OPC can select an OPC model based on the classification of the IC pattern. The OPC model can weight the target placement model.Type: ApplicationFiled: July 19, 2017Publication date: June 21, 2018Inventors: Hung-Chun Wang, Chi-Ping Liu, Feng-Ju Chang, Ching-Hsu Chang, Wen Hao Liu, Chia-Feng Yeh, Ming-Hui Chih, Cheng Kun Tsai, Wei-Chen Chien, Wen-Chun Huang, Yu-Po Tang
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Patent number: 9716032Abstract: The present disclosure provides a method for forming a semiconductor device. The semiconductor device includes a first conductive line disposed over a substrate. The first conductive line is located in a first interconnect layer and extends along a first direction. The semiconductor device includes a second conductive line and a third conductive line each extending along a second direction different from the first direction. The second and third conductive lines are located in a second interconnect layer that is different from the first interconnect layer. The second and third conductive lines are separated by a gap that is located over or below the first conductive line. The semiconductor device includes a fourth conductive line electrically coupling the second and third conductive lines together. The fourth conductive line is located in a third interconnect layer that is different from the first interconnect layer and the second interconnect layer.Type: GrantFiled: July 15, 2014Date of Patent: July 25, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Po Tang, Shih-Ming Chang, Ken-Hsien Hsieh, Ru-Gun Liu
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Patent number: 9390217Abstract: A method for performing optical proximity correction (OPC) and evaluating OPC solutions is disclosed. An exemplary method includes receiving a design database corresponding to an IC circuit mask. A first OPC modification to a mask feature of the design database is made by performing a first OPC process. The OPC process includes: dividing the mask feature into child shapes and adjusting an attribute of a child shape based on an edge placement error (EPE) factor. A first lithography simulation is performed utilizing a first set of performance indexes after making the first OPC modification, and a second OPC modification to the mask feature is made based on a result of the first lithography simulation. A second lithography simulation of the mask feature is performed utilizing a second set of performance indexes to verify the first and second OPC modifications, and the design database is provided for manufacturing.Type: GrantFiled: December 30, 2013Date of Patent: July 12, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Chun Wang, Ming-Hui Chih, Yu-Po Tang, Chia-Ping Chiang, Feng-Ju Chang, Cheng Kun Tsai, Wen-Chun Huang, Ru-Gun Liu
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Publication number: 20160121013Abstract: Multi component fibres for the reduction of the damaging activity of wound exudate components such as protein degrading enzymes and inflammatory mediators in wounds, the fibres comprising: from 10% to 100% by weight of the fibres of pectin and a sacrificial proteinaceous material in a weight ratio of 100:0 to 10:90 pectin to sacrificial proteinaceous material and from 0% to 90% by weight of the fibres of another polysaccharide or a water soluble polymer.Type: ApplicationFiled: July 22, 2011Publication date: May 5, 2016Applicant: CONVATEC TECHNOLOGIES INC.Inventors: Lucy Louisa Ballamy, Sharon Lam Po Tang, Marion Herbe, Alan Rogers, Sean Kelly
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Patent number: 9189588Abstract: Methods and systems for design of integrated circuits including performing OPC are discussed. In one embodiment, design data having a geometric feature is provided. A base feature is formed from the geometric feature, which has a substantially linear edge. A pseudo dissection point is determined on the base feature. Add or trim a polygon from the base feature to form a modified feature. An OPC process is performed on the modified feature to generate an output design. The output design is used to fabricate a semiconductor device on a semiconductor substrate.Type: GrantFiled: December 10, 2013Date of Patent: November 17, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Li Cheng, Ming-Hui Chih, Yu-Po Tang, Chia-Ping Chiang, Cheng-Lung Tsai, Sheng-Wen Lin, Kuei-Liang Lu, Wen-Chun Huang, Ru-Gun Liu
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Patent number: 9165095Abstract: A method performed by a computer processing system includes receiving a design pattern for an integrated circuit, applying a function to the design pattern to generate a model contour, generating a plurality of Optical Proximity Correction (OPC) target points along the model contour, adjusting the design pattern to create an adjusted pattern, and performing a simulation on the adjusted pattern to create a simulated contour.Type: GrantFiled: November 15, 2013Date of Patent: October 20, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Hui Chih, Wen-Li Cheng, Yu-Po Tang, Ping-Chieh Wu, Chia-Ping Chiang, Yong-Cheng Lin, Wen-Chun Huang, Ru-Gun Liu
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Publication number: 20150161321Abstract: Methods and systems for design of integrated circuits including performing OPC are discussed. In one embodiment, design data having a geometric feature is provided. A base feature is formed from the geometric feature, which has a substantially linear edge. A pseudo dissection point is determined on the base feature. Add or trim a polygon from the base feature to form a modified feature. An OPC process is performed on the modified feature to generate an output design. The output design is used to fabricate a semiconductor device on a semiconductor substrate.Type: ApplicationFiled: December 10, 2013Publication date: June 11, 2015Inventors: Wen-Li Cheng, Ming-Hui Chih, Yu-Po Tang, Chia-Ping Chiang, Cheng-Lung Tsai, Sheng-Wen Lin, Kuei-Liang Lu, Wen-Chun Huang, Ru-Gun Liu
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Publication number: 20150143304Abstract: A method performed by a computer processing system includes receiving a design pattern for an integrated circuit, applying a function to the design pattern to generate a model contour, generating a plurality of Optical Proximity Correction (OPC) target points along the model contour, adjusting the design pattern to create an adjusted pattern, and performing a simulation on the adjusted pattern to create a simulated contour.Type: ApplicationFiled: November 15, 2013Publication date: May 21, 2015Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Hui Chih, Wen-Li Cheng, Yu-Po Tang, Ping-Chieh Wu, Chia-Ping Chiang, Yong-Cheng Lin, Wen-Chun Huang, Ru-Gun Liu
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Patent number: 9026957Abstract: An embodiment of a feed-forward method of determining a photomask pattern is provided. The method includes providing design data associated with an integrated circuit device. A thickness of a coating layer to be used in fabricating the integrated circuit device is predicted based on the design data. This prediction is used to generate a gradating pattern. A photomask is formed having the gradating pattern.Type: GrantFiled: February 25, 2014Date of Patent: May 5, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Chu Liu, Kuei Shun Chen, Chih-Yang Yeh, Te-Chih Huang, Wen-Hao Liu, Ying-Chou Cheng, Boren Luo, Tsong-Hua Ou, Yu-Po Tang, Wen-Chun Huang, Ru-Gun Liu, Shu-Chen Lu, Yu Lun Liu, Yao-Ching Ku, Tsai-Sheng Gau