Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: An access point (AP) and a station (STA) communicate with each other, with the AP indicating to the STA either or both of a preamble detection (PD) channel and a signaling (SIG) content channel and with the STA being initially monitoring a primary frequency segment of a plurality of frequency segments in an operating bandwidth of the AP. A downlink (DL) or triggered uplink (UL) communication is performed between the AP and the STA during a transmission opportunity (TXOP) such that: (i) during the TXOP, the STA monitors a preamble on the PD channel and decodes a SIG content on the SIG content channel; and (ii) after an end of the TXOP, the STA switches to the primary frequency segment.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: A sensitive device includes a plurality of first conductive nanostructures, a conductive layer and at least one electrode. The conductive layer covers the first conductive nanostructures. An intrinsic melting point of the conductive layer is higher than that of the first conductive nanostructures. At least one of the conductive layer and the first conductive nanostructures is sensitive to gas. The electrode is electrically connected to at least one of the first conductive nanostructures and the conductive layer.

Abstract: A three-dimension measurement device includes a moving device, a projecting device, a surface-type image-capturing device and a processing device. The moving device carries an object, and moves the object to a plurality of positions. The projecting device generates a first light to the object. The surface-type image-capturing device senses a second light generated by the object in response to the first light to generate a phase image on each of the positions. The processing device is coupled to the surface-type image-capturing device and receives the phase images. The processing device performs a region-of-interest (ROI) operation for the phase images to generate a plurality of ROI images. The processing device performs a multi-step phase-shifting operation for the ROI images to calculate the surface height distribution of the object.

Abstract: A three-dimension measurement device includes a moving device, a projecting device, a surface-type image-capturing device and a processing device. The moving device carries an object, and moves the object to a plurality of positions. The projecting device generates a first light to the object. The surface-type image-capturing device senses a second light generated by the object in response to the first light to generate a phase image on each of the positions. The processing device is coupled to the surface-type image-capturing device and receives the phase images. The processing device performs a region-of-interest (ROI) operation for the phase images to generate a plurality of ROI images. The processing device performs a multi-step phase-shifting operation for the ROI images to calculate the surface height distribution of the object.

Abstract: A hinge structure includes a first base, a second base, a first linking rod, a second linking rod, and a torque assembly. The first linking rod has a first pivot part, a first sliding part, and a second pivot part. The first pivot part is pivoted to the first base, and the first sliding part is slidably connected to the second base. The second linking rod has a second sliding part, a shaft part, a third pivot part, and a fourth pivot part. The second sliding part is slidably connected to the first base. The third pivot part is pivoted to the second base. The second pivot part is pivoted to the fourth pivot part. The torque assembly has a sleeve part sleeved on the shaft part and a connection part connected to the second base. The sleeve part generates torque during rotation with respect to the shaft part.

Abstract: A full-range image detecting system including a planar light source, an image capturing device, a light sensing device, a processing unit and a measuring module is provided. The planar light source projects a photo image with periodical variations onto an object. The image capturing device captures a reflective photo image reflected from the object. The light sensing device detects the coordinates of at least three measuring points on the object for fitting a plane. The processing unit calculates a phase variation of the reflective photo image after phase shift, a relative altitude of the surface profile of the object according to the phase variation, and an absolute altitude of the surface profile of the object with respect to the plane to obtain an information of absolute coordinate. The measuring module detects the surface of the object according to the information of absolute coordinate of the object.

Abstract: A hinge structure includes a first base, a second base, a first linking rod, a second linking rod, and a torque assembly. The first linking rod has a first pivot part, a first sliding part, and a second pivot part. The first pivot part is pivoted to the first base, and the first sliding part is slidably connected to the second base. The second linking rod has a second sliding part, a shaft part, a third pivot part, and a fourth pivot part. The second sliding part is slidably connected to the first base. The third pivot part is pivoted to the second base. The second pivot part is pivoted to the fourth pivot part. The torque assembly has a sleeve part sleeved on the shaft part and a connection part connected to the second base. The sleeve part generates torque during rotation with respect to the shaft part.

Abstract: A three-dimensional measurement system includes a projector, an image sensor, an image analyzing module and a measurement module. The projector provides a structured light pattern. The image sensor captures an object image of an object on which the structured light pattern is projected. The image analyzing module analyzes the object image to obtain a space coding image and a phase coding image according to gray level distribution of the object image. The measurement module calculates phase information of each of coordinate points in the phase coding image, calculates compensation information of a coordinate position, corresponding to a coordinate position of a point of discontinuity, in the space coding image, compensates the phase information of the point of discontinuity in the phase coding image by the compensation information, and calculates height information of the object according to the phase information of each of the coordinate points.

Abstract: A three-dimensional measurement system includes a projector, an image sensor, an image analyzing module and a measurement module. The projector provides a structured light pattern. The image sensor captures an object image of an object on which the structured light pattern is projected. The image analyzing module analyzes the object image to obtain a space coding image and a phase coding image according to gray level distribution of the object image. The measurement module calculates phase information of each of coordinate points in the phase coding image, calculates compensation information of a coordinate position, corresponding to a coordinate position of a point of discontinuity, in the space coding image, compensates the phase information of the point of discontinuity in the phase coding image by the compensation information, and calculates height information of the object according to the phase information of each of the coordinate points.

Abstract: A sensitive device includes a plurality of first conductive nanostructures, a conductive layer and at least one electrode. The conductive layer covers the first conductive nanostructures. An intrinsic melting point of the conductive layer is higher than that of the first conductive nanostructures. At least one of the conductive layer and the first conductive nanostructures is sensitive to gas. The electrode is electrically connected to at least one of the first conductive nanostructures and the conductive layer.

Abstract: A full-range image detecting system including a planar light source, an image capturing device, a light sensing device, a processing unit and a measuring module is provided. The planar light source projects a photo image with periodical variations onto an object. The image capturing device captures a reflective photo image reflected from the object. The light sensing device detects the coordinates of at least three measuring points on the object for fitting a plane. The processing unit calculates a phase variation of the reflective photo image after phase shift, a relative altitude of the surface profile of the object according to the phase variation, and an absolute altitude of the surface profile of the object with respect to the plane to obtain an information of absolute coordinate. The measuring module detects the surface of the object according to the information of absolute coordinate of the object.

Abstract: In a thickness measuring system for a bonding layer according to an exemplary embodiment, an optical element changes the wavelength of a first light source to enable at least one second light source propagating through a bonding layer to be incident to an object, wherein the bonding layer has an upper interface and a lower interface that are attached to the object; and an optical image capturing and analysis unit receives a plurality of reflected lights from the upper and the lower interfaces to capture a plurality of interference images of different wavelengths, and analyzes the intensity of the plurality of interference images to compute the thickness information of the bonding layer.

Abstract: A thin metal film measurement method is disclosed. The method includes the following steps. A respective capacitance is measured before and after a thin metal film is formed. The thickness of the thin metal film is calculated according to the variation of the capacitance. In an embodiment, the capacitance is measured respectively by a capacitance measuring module before and after the thin metal film is formed so as to calculate the thickness of the thin metal film. In another embodiment, a pair of capacitance measuring modules opposite at up and down sides is applied to measure the capacitance before and after the thin metal film is formed so as to calculate the thickness of the thin metal film.