Abstract: A method for manufacturing a semiconductor device includes: forming a lower metal contact in a trench of a first dielectric structure, the lower metal contact having a height less than a depth of the trench and being made of a first metal material; forming an upper metal contact to fill the trench and to be in contact with the lower metal contact, the upper metal contact being formed of a second metal material different from the first metal material and having a bottom surface with a dimension the same as a dimension of a top surface of the lower metal contact; forming a second dielectric structure on the first dielectric structure; and forming a via contact penetrating through the second dielectric structure to be electrically connected to the upper metal contact, the via contact being formed of a metal material the same as the second metal material.

Abstract: A method for detecting a location of a segment of a feeding tube is provided. The feeding tube has a proximal end, a hollow tube body and a distal end, and is placed inside the body of a patient. An audio collecting component is placed on a predetermined part of the patient. The method includes steps of pumping air into the proximal end of the feeding tube, collecting sound to obtain audio data by the audio collecting component, performing audio analysis on the audio data, and determining whether a segment of the hollow tube body is at a part inside the body of the patient that corresponds with the location of the audio collecting component based on result of the audio analysis.

Abstract: A semiconductor package includes a lower semiconductor device, a plurality of conductive pillars, an upper semiconductor device, an encapsulating material, and a redistribution structure. The plurality of conductive pillars are disposed on the lower semiconductor device along a direction parallel to a side of the lower semiconductor device. The upper semiconductor device is disposed on the lower semiconductor device and reveals a portion of the lower semiconductor device where the plurality of conductive pillars are disposed, wherein the plurality of conductive pillars disposed by the same side of the upper semiconductor device and the upper semiconductor device comprises a cantilever part cantilevered over the at least one lower semiconductor device. The encapsulating material encapsulates the lower semiconductor device, the plurality of conductive pillars, and the upper semiconductor device. The redistribution structure is disposed over the upper semiconductor device and the encapsulating material.

Abstract: A semiconductor device includes a first substrate. The semiconductor device includes a plurality of metallization layers formed over the first substrate. The semiconductor device includes a plurality of via structures formed over the plurality of metallization layers. The semiconductor device includes a second substrate attached to the first substrate through the plurality of via structures. The semiconductor device includes a first conductive line disposed in a first one of the plurality of metallization layers. The first conductive line, extending along a first lateral direction, is connected to at least a first one of the plurality of via structures that is in electrical contact with a first through via structure of the second substrate, and to at least a second one of the plurality of via structures that is laterally offset from the first through via structure.

Abstract: An electronic device with an auxiliary lighting function and an operation method thereof are provided. The electronic device includes a first body, a display screen, and a light-emitting module. The first body has a first surface. The first surface includes a screen area and a border area. The border area surrounds the screen area. The display screen is disposed in the screen area of the first body. The light-emitting module is disposed in the border area of the first body. The light-emitting module provides an illumination light in at least one first area of the border area, and provides an indicating light in at least one second area of the border area.

Abstract: A sensitive device includes a plurality of first conductive nanostructures, a conductive layer and at least one electrode. The conductive layer covers the first conductive nanostructures. An intrinsic melting point of the conductive layer is higher than that of the first conductive nanostructures. At least one of the conductive layer and the first conductive nanostructures is sensitive to gas. The electrode is electrically connected to at least one of the first conductive nanostructures and the conductive layer.

Abstract: A three-dimension measurement device includes a moving device, a projecting device, a surface-type image-capturing device and a processing device. The moving device carries an object, and moves the object to a plurality of positions. The projecting device generates a first light to the object. The surface-type image-capturing device senses a second light generated by the object in response to the first light to generate a phase image on each of the positions. The processing device is coupled to the surface-type image-capturing device and receives the phase images. The processing device performs a region-of-interest (ROI) operation for the phase images to generate a plurality of ROI images. The processing device performs a multi-step phase-shifting operation for the ROI images to calculate the surface height distribution of the object.

Abstract: A three-dimension measurement device includes a moving device, a projecting device, a surface-type image-capturing device and a processing device. The moving device carries an object, and moves the object to a plurality of positions. The projecting device generates a first light to the object. The surface-type image-capturing device senses a second light generated by the object in response to the first light to generate a phase image on each of the positions. The processing device is coupled to the surface-type image-capturing device and receives the phase images. The processing device performs a region-of-interest (ROI) operation for the phase images to generate a plurality of ROI images. The processing device performs a multi-step phase-shifting operation for the ROI images to calculate the surface height distribution of the object.

Abstract: A hinge structure includes a first base, a second base, a first linking rod, a second linking rod, and a torque assembly. The first linking rod has a first pivot part, a first sliding part, and a second pivot part. The first pivot part is pivoted to the first base, and the first sliding part is slidably connected to the second base. The second linking rod has a second sliding part, a shaft part, a third pivot part, and a fourth pivot part. The second sliding part is slidably connected to the first base. The third pivot part is pivoted to the second base. The second pivot part is pivoted to the fourth pivot part. The torque assembly has a sleeve part sleeved on the shaft part and a connection part connected to the second base. The sleeve part generates torque during rotation with respect to the shaft part.

Abstract: A full-range image detecting system including a planar light source, an image capturing device, a light sensing device, a processing unit and a measuring module is provided. The planar light source projects a photo image with periodical variations onto an object. The image capturing device captures a reflective photo image reflected from the object. The light sensing device detects the coordinates of at least three measuring points on the object for fitting a plane. The processing unit calculates a phase variation of the reflective photo image after phase shift, a relative altitude of the surface profile of the object according to the phase variation, and an absolute altitude of the surface profile of the object with respect to the plane to obtain an information of absolute coordinate. The measuring module detects the surface of the object according to the information of absolute coordinate of the object.

Abstract: A hinge structure includes a first base, a second base, a first linking rod, a second linking rod, and a torque assembly. The first linking rod has a first pivot part, a first sliding part, and a second pivot part. The first pivot part is pivoted to the first base, and the first sliding part is slidably connected to the second base. The second linking rod has a second sliding part, a shaft part, a third pivot part, and a fourth pivot part. The second sliding part is slidably connected to the first base. The third pivot part is pivoted to the second base. The second pivot part is pivoted to the fourth pivot part. The torque assembly has a sleeve part sleeved on the shaft part and a connection part connected to the second base. The sleeve part generates torque during rotation with respect to the shaft part.

Abstract: A three-dimensional measurement system includes a projector, an image sensor, an image analyzing module and a measurement module. The projector provides a structured light pattern. The image sensor captures an object image of an object on which the structured light pattern is projected. The image analyzing module analyzes the object image to obtain a space coding image and a phase coding image according to gray level distribution of the object image. The measurement module calculates phase information of each of coordinate points in the phase coding image, calculates compensation information of a coordinate position, corresponding to a coordinate position of a point of discontinuity, in the space coding image, compensates the phase information of the point of discontinuity in the phase coding image by the compensation information, and calculates height information of the object according to the phase information of each of the coordinate points.

Abstract: A three-dimensional measurement system includes a projector, an image sensor, an image analyzing module and a measurement module. The projector provides a structured light pattern. The image sensor captures an object image of an object on which the structured light pattern is projected. The image analyzing module analyzes the object image to obtain a space coding image and a phase coding image according to gray level distribution of the object image. The measurement module calculates phase information of each of coordinate points in the phase coding image, calculates compensation information of a coordinate position, corresponding to a coordinate position of a point of discontinuity, in the space coding image, compensates the phase information of the point of discontinuity in the phase coding image by the compensation information, and calculates height information of the object according to the phase information of each of the coordinate points.

Abstract: A sensitive device includes a plurality of first conductive nanostructures, a conductive layer and at least one electrode. The conductive layer covers the first conductive nanostructures. An intrinsic melting point of the conductive layer is higher than that of the first conductive nanostructures. At least one of the conductive layer and the first conductive nanostructures is sensitive to gas. The electrode is electrically connected to at least one of the first conductive nanostructures and the conductive layer.

Abstract: A full-range image detecting system including a planar light source, an image capturing device, a light sensing device, a processing unit and a measuring module is provided. The planar light source projects a photo image with periodical variations onto an object. The image capturing device captures a reflective photo image reflected from the object. The light sensing device detects the coordinates of at least three measuring points on the object for fitting a plane. The processing unit calculates a phase variation of the reflective photo image after phase shift, a relative altitude of the surface profile of the object according to the phase variation, and an absolute altitude of the surface profile of the object with respect to the plane to obtain an information of absolute coordinate. The measuring module detects the surface of the object according to the information of absolute coordinate of the object.

Abstract: In a thickness measuring system for a bonding layer according to an exemplary embodiment, an optical element changes the wavelength of a first light source to enable at least one second light source propagating through a bonding layer to be incident to an object, wherein the bonding layer has an upper interface and a lower interface that are attached to the object; and an optical image capturing and analysis unit receives a plurality of reflected lights from the upper and the lower interfaces to capture a plurality of interference images of different wavelengths, and analyzes the intensity of the plurality of interference images to compute the thickness information of the bonding layer.

Abstract: A thin metal film measurement method is disclosed. The method includes the following steps. A respective capacitance is measured before and after a thin metal film is formed. The thickness of the thin metal film is calculated according to the variation of the capacitance. In an embodiment, the capacitance is measured respectively by a capacitance measuring module before and after the thin metal film is formed so as to calculate the thickness of the thin metal film. In another embodiment, a pair of capacitance measuring modules opposite at up and down sides is applied to measure the capacitance before and after the thin metal film is formed so as to calculate the thickness of the thin metal film.