Patents by Inventor Prabhakar Subrahmanyam

Prabhakar Subrahmanyam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210351106
    Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.
    Type: Application
    Filed: May 11, 2020
    Publication date: November 11, 2021
    Inventors: Prabhakar SUBRAHMANYAM, Tewodros WONDIMU, Ying-Feng PANG, Muhammad AHMAD, Paul DIGLIO, David SHIA, Pooya TADAYON
  • Publication number: 20210307199
    Abstract: Techniques for heat exchanger networks are disclosed. In the illustrative embodiment, several heat exchangers and several components to be cooled are connected together in a network. The flow of liquid coolant to each component and heat exchanger can be individually controlled. If a particular component needs more or less cooling, the flow rate of coolant through that component can be controlled. If a first component needs more cooling and a second component can operate with less cooling, coolant may be rerouted from the first component to the second component. Thus, target temperature load balancing can be achieved for all the components of the system. If a heat exchanger is faulty, it can be isolated, and a backup heat exchanger can be brought online, making the system self-healing and fault-tolerant. The faulty heat exchanger can then be repaired or replaced while the rest of the system is operational.
    Type: Application
    Filed: June 8, 2021
    Publication date: September 30, 2021
    Inventor: Prabhakar Subrahmanyam
  • Publication number: 20210289659
    Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
    Type: Application
    Filed: April 27, 2020
    Publication date: September 16, 2021
    Applicant: Intel Corporation
    Inventors: Prabhakar SUBRAHMANYAM, Casey WINKEL, Yingqiong BU, Ming ZHANG, Yuehong FAN, Yi XIA, Ying-Feng PANG
  • Publication number: 20210120703
    Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption.
    Type: Application
    Filed: December 26, 2020
    Publication date: April 22, 2021
    Inventors: Prabhakar SUBRAHMANYAM, Arun KRISHNAMOORTHY, Victor POLYANKO, Ying-Feng PANG, Yi XIA, Pooya TADAYON, Muhammad AHMAD, Rahima K. MOHAMMED
  • Publication number: 20210116391
    Abstract: An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Inventors: Prabhakar SUBRAHMANYAM, Ying-Feng PANG, Yi XIA, Mark BIANCO, Victor POLYANKO
  • Patent number: 10973154
    Abstract: Modular assemblies for thermal management are provided. Modularity permits or facilitates scalable thermal performance with respect to power dissipation demands. Modularity also permits retrofitting a deployed cooling system based at least on a current power dissipation requirement. In some embodiments, a modular assembly can be reversibly reconfigured in order to adjust cooling capacity and fulfill a defined power dissipation target. In some embodiments, a modular assembly can include a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be reversibly coupled to or reversibly decoupled from the liquid-cooled pedestal based at least on a power dissipation condition and/or a change thereof of a dissipative electronic component. The reversible coupling and reversible decoupling of the attachment members can permit or otherwise facilitate reversibly adjusting the heat transfer between the modular assembly and the dissipative electronic component.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: April 6, 2021
    Assignee: Intel Corporation
    Inventors: Tong W. Chao, Prabhakar Subrahmanyam
  • Patent number: 10930575
    Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 23, 2021
    Assignee: Intel Corporation
    Inventors: Prabhakar Subrahmanyam, Tong W. Chao, Stephanie L. Seaman, Ridvan A. Sahan, Ying-Feng Pang
  • Publication number: 20200229325
    Abstract: Modular assemblies for thermal management are provided. Modularity permits or facilitates scalable thermal performance with respect to power dissipation demands Modularity also permits retrofitting a deployed cooling system based at least on a current power dissipation requirement. In some embodiments, a modular assembly can be reversibly reconfigured in order to adjust cooling capacity and fulfill a defined power dissipation target. In some embodiments, a modular assembly can include a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be reversibly coupled to or reversibly decoupled from the liquid-cooled pedestal based at least on a power dissipation condition and/or a change thereof of a dissipative electronic component. The reversible coupling and reversible decoupling of the attachment members can permit or otherwise facilitate reversibly adjusting the heat transfer between the modular assembly and the dissipative electronic component.
    Type: Application
    Filed: September 30, 2016
    Publication date: July 16, 2020
    Inventors: Tong W. CHAO, Prabhakar SUBRAHMANYAM
  • Publication number: 20200027808
    Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package.
    Type: Application
    Filed: September 30, 2016
    Publication date: January 23, 2020
    Inventors: Prabhakar SUBRAHMANYAM, Tong W. CHAO, Stephanie L. SEAMAN, Ridvan A. SAHAN, Ying-Feng PANG
  • Publication number: 20190364691
    Abstract: Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.
    Type: Application
    Filed: May 22, 2018
    Publication date: November 28, 2019
    Applicant: Intel Corporation
    Inventors: Prabhakar Subrahmanyam, Arun Krishnamoorthy