Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to perform power-saving based on user presence, including a network interface to communicate with a cloud device, user presence detector circuitry to determine if a user is present or not present; workload distributor circuitry to distribute an AI workload to either first AI inference circuitry or second AI inference circuitry; and power circuitry to charge a battery at either a first charge level or a second charge level.

Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to retain a printed circuit board between mounting plates. An example standoff comprises a first segment to be adjacent to a first surface of a metal plate and a second segment extending from the first segment toward a second surface of a printed circuit board (PCB), the standoff to maintain separation between the metal plate and the PCB. Also, the example standoff includes at least one of a biasing component to dampen motion between the metal plate and the PCB or a distal end on the second segment, the first segment having a first cross-sectional shape defining a first area, the distal end having a second cross-sectional shape defining a second area, the second area smaller than the first area.

Abstract: Systems, apparatus, articles of manufacture, and methods to improve thermal dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes: a socket to receive an integrated circuit package; and a plate to apply a load on the integrated circuit package towards the socket. The plate includes an internal channel to carry a coolant through the plate. The liquid coolant is to facilitate cooling of the integrated circuit package.

Abstract: An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.

Abstract: An apparatus and method for cooling a computing system, comprising a plurality of electronic components, with a cooling system. The cooling system includes a closed loop for the two-phase coolant, wherein the two-phase coolant has a saturation temperature. The closed loop includes a valve fluidly connected between an outlet of a heat exchanger and an inlet of a plurality of evaporator structures configured to be thermally coupled to the plurality of electronic components, and a compressor fluidly connected between an outlet of the plurality of evaporator structures and an inlet of the heat exchanger. The apparatus and method for the cooling system are configured to monitor one or more system temperatures of the computing system and adjust an operation of at least one of the valve or the compressor to alter the saturation temperature based on the one or more system temperatures.

Abstract: Systems, apparatus, articles of manufacture, and methods to mitigate hotspots in integrated circuit packages using gimballing nozzles and jet vectoring impingement are disclosed. An apparatus includes an array of nozzles to direct a cooling fluid toward an integrated circuit package. The array of nozzles includes a first nozzle and a second nozzle. The apparatus further includes a plate to carry the array of nozzles. The first nozzle is selectively moveable relative to the integrated circuit package and relative to the second nozzle. Movement of the first nozzle relative to the integrated circuit package including rotational movement and translational movement.

Abstract: In some embodiments, an immersion cooling system comprises a spring damper, a crumple block, a frictional layer, and/or preloaded spring-based mounts to mitigate the effects of seismic events. In other embodiments, the combined mass of liquids in the immersion tank and a compensation tank is kept constant to maintain the system's response to seismic events. In still other embodiments, an immersion cooling system comprises a tunable mass to provide an active response to seismic events. In yet other embodiments, an immersion tank is located within a housing pallet and is moveable within the palette. Spring dampers dampen tank movement within the pallet and shutoff switches housed in the pallet cause power to components in the tank to be shut off in response to tank movement. Cooling liquid can be transferred from the tank to a secondary reservoir to avoid cooling liquid loss and protect the tank.

Abstract: An apparatus is described. The apparatus includes a chip package cooling assembly chamber having one or more features to receive one or more heat pipes that receive heat generated by one or more semiconductor devices that reside outside the chip package. In detail, the heat pipes that are thermally coupled to the VR FET heat sinks are attached to the outside of the cold plate (again, they can be screwed to the cold plate with a thermal interface material between them). Thus, heat generated by the VR FETs is transferred to the VR FET heatsinks and the chip package cold plate via the heat pipes. The heat is then transferred to the fluid while it runs through the cold plate and is removed from the system by the fluid as it exits the outlet.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for power budgeting for computer peripherals with electronic devices. An example apparatus to budget power in an electronic device includes interface circuitry; machine readable instructions; and programmable circuitry to at least one of instantiate or execute the machine readable instructions to: detect a Type-C event associated with a computer peripheral; write a power level offset based on an assumed power contract for the computer peripheral during debounce time; obtain an actual power contract for the computer peripheral; and adjust the power level offset based on the actual power contract.

Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Abstract: Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirs are disclosed. An example apparatus includes programmable circuitry to detect, based on outputs of a sensor associated with a first reservoir, a coolant level of the first reservoir, the first reservoir removably coupled to a second reservoir, the first reservoir to supply coolant to the second reservoir, predict, based on the coolant level, a characteristic associated with operation of a cooling device fluidly coupled to the second reservoir, and cause an output to be presented at a user device based on the predicted characteristic.

Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.

Abstract: Compact rear mounted modular heat exchangers and related methods are disclosed herein. An example apparatus disclosed herein includes a heat exchanger having an air flow inlet and an air flow outlet, a holder frame to receive a component of a server chassis, and a bracket coupled to the holder frame, the bracket to retain the heat exchanger adjacent a rear of the server chassis.

Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

Abstract: Methods and apparatus for an autonomous stage-switching multi-stage cooling device are disclosed are disclosed. A disclosed example coolant distribution unit (CDU) includes an enclosure, an inlet and an outlet of the CDU to be fluidly coupled to a cooling block associated with a heat generating source, at least one sensor to measure a first temperature corresponding to the inlet and a second temperature corresponding to the outlet, and a plurality of valves to be controlled by a controller to control a flow of fluid from the inlet to at least one of an ambient cooler or a sub-ambient cooler based on: (i) a comparison of the first temperature to an ambient temperature and (ii) a comparison of the second temperature to a target temperature.

Abstract: Example field replaceable fan assemblies for peripheral processing units and related systems and methods are disclosed. An example apparatus includes a temperature sensor; a fan having a base; at least one memory; machine readable instructions; and processor circuitry to execute operations corresponding to the machine readable instructions to determine a first temperature based on an output of the temperature sensor; and cause the base of the fan to move based on the first temperature.

Abstract: Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.

Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.