Patents by Inventor Pradeep Gandhi

Pradeep Gandhi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968196
    Abstract: Integrated cybersecurity systems and method for providing client access to a website. The methods involve receiving website configuration information for the client access; receiving client enrollment data for the client access; receiving client input data from a client; defining integrated client confirmation; and providing the website with the client identification information based on the integrated client confirmation. The defining involves authenticating the client input data by comparing the client input data with the client enrollment data; authorizing the authenticated client by determining client authorization information associated with the client enrollment data based on the website configuration information; identifying the authenticated client by determining client identification information associated with the client enrollment data; and providing the website with the client identification information based on the integrated client confirmation.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: April 23, 2024
    Assignee: Softex, Inc.
    Inventors: Apurva M. Bhansali, Kamal M. Dhanani, Srinivasapriya Kadalagere, Purav Pipalia, Shashikant D. Shinde, Amit S. Ghuge, Pradeep R. Pathak, Nirav Zaveri, Lingasvaran Nadar, Vishal Gandhi
  • Patent number: 7502830
    Abstract: One example of this system provides the ability to setup a two-way alert notification within an IM system. All parties can negotiate on how they set up the alert and what to do when it sets off. One of the approaches presented in this invention is to modify the basic functionality of existing alert notifications, in such a way that it allows the targeted remote user to become aware that an alert has been set to report the change in his/her availability status, and enables this remote user to respond. A popup message on the targeted user's side notifies the user of this alert event.
    Type: Grant
    Filed: March 10, 2008
    Date of Patent: March 10, 2009
    Assignee: International Business Machines Corporation
    Inventors: Mike V. Macias, Sandip Dnyaneshwar Mahajan, Salil Pradeep Gandhi, Saidas Tukaram Kottawar
  • Patent number: 7502831
    Abstract: An embodiment provides a flexible way to categorize instant messages (IM) or instant data by segmenting them. The default category would be viewable and/or readable as currently is with no change. However, those categories which are categorized as CONFIDENTIAL and/or PERSONAL would be displayed in a hidden form. The invention is demonstrated using a CONFIDENTIAL category; however, the invention is not limited to just CONFIDENTIAL category as it can be applied to other categories as well, such as INFORMATIONAL. An embodiment of the invention allows users to view CONFIDENTIAL informational in private and data would be hidden on the receiving end until a request to un-hide is made by the receiver.
    Type: Grant
    Filed: March 10, 2008
    Date of Patent: March 10, 2009
    Assignee: International Business Machines Corporation
    Inventors: Mike V. Macias, Salil Pradeep Gandhi, Saidas Tukaram Kottawar, Dhaval K. Shah, Sandip Dnyaneshwar Mahajan
  • Patent number: 6716036
    Abstract: Disclosed are electrical connector devices with integrated electronic components, including magnetic devices. The electronic components integrated into the connector are electrically connected to one another and the connector pins by an electrically conductive circuit formed directly on the connector housing. Formation of the electrically conductive circuit directly on the connector housing substantially reduces the number of assembly steps required to manufacture the connector.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: April 6, 2004
    Assignee: Ormet Circuits, Inc.
    Inventor: Pradeep Gandhi
  • Publication number: 20030216061
    Abstract: Disclosed are electrical connector devices with integrated electronic components, including magnetic devices. The electronic components integrated into the connector are electrically connected to one another and the connector pins by an electrically conductive circuit formed directly on the connector housing. Formation of the electrically conductive circuit directly on the connector housing substantially reduces the number of assembly steps required to manufacture the connector.
    Type: Application
    Filed: May 15, 2002
    Publication date: November 20, 2003
    Applicant: Ormet Circuits, Inc.
    Inventor: Pradeep Gandhi
  • Patent number: 6085415
    Abstract: Methods for the production of insulated, conductive through-features in conductive core materials for electronics packaging are disclosed. Invention methods employ protective mask technology in order to facilitate the selective removal of material from planar conductive core material that has been encapsulated in electrically insulated materials. By filling the cavity in the conductive core material with an electrically insulated material, the through-feature is electrically isolated from the remainder of the core material. In this manner, a conductive through-feature that completely transverses the core of the substrate board is created. Also provided are planar substrates for multilayer printed circuit boards, or chip carriers, comprising the conductive through-features produced by invention methods.
    Type: Grant
    Filed: July 27, 1998
    Date of Patent: July 11, 2000
    Assignee: Ormet Corporation
    Inventors: Pradeep Gandhi, Samuel Fu, Gary E. Legerton, Daniel E. Baxter, William C. Robinette
  • Patent number: 5980785
    Abstract: In accordance with the present invention, there are provided novel metal-containing compositions useful for the preparation of electrical resistance devices (e.g., resistors and thermistor elements). Compositions according to the invention comprise at least one low melting point metal material, and optionally a higher melting point metal material, with the further presence of a binder system also being optional. Compositions according to the invention exhibit a wide range of resistivity and a wide range of values for temperature coefficient of resistance (TCR). Compositions with low values for TCR are useful for resistor applications while compositions with large values for TCR are useful for thermistor applications. Resistor or thermistor elements can be produced by applying compositions according to the invention onto suitable substrates and subsequently alloying (i.e., curing and/or sintering) the compositions.
    Type: Grant
    Filed: October 2, 1997
    Date of Patent: November 9, 1999
    Assignee: Ormet Corporation
    Inventors: Xiaomei Xi, Sam Fu, Goran Matijavesic, Lutz Brandt, Catharine Gallagher, Pradeep Gandhi
  • Patent number: 5948533
    Abstract: In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.
    Type: Grant
    Filed: March 6, 1997
    Date of Patent: September 7, 1999
    Assignee: Ormet Corporation
    Inventors: Catherine A. Gallagher, Goran S. Matijasevic, Pradeep Gandhi, M. Albert Capote
  • Patent number: 5922397
    Abstract: In accordance with the present invention, it has been discovered that conductive traces made from transient liquid phase sintering (TLPS) pastes, plated by electroless or electrolytic means, result in improved solderability, adhesion and conductivity of the circuitry. Transient liquid phase sintering pastes employed in the practice of the present invention differ from conventional metal loaded polymer thick film (PTF) inks in that they contain, in addition to a binder, they also contain both a relatively high melting metal powder and a relatively low melting solder powder capable of forming a continuous intermetallic/metallic phase after sintering. The present invention is particularly useful, for example, for the fabrication of single and multi-layer printed circuit boards, providing horizontal and vertical conductive interconnects, metallized through-holes, and conductive pads for electronic component attachment.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: July 13, 1999
    Assignee: Ormet Corporation
    Inventors: Lutz Brandt, Pradeep Gandhi, Bryan Shearer