Patents by Inventor Praveen Pandojirao-Sunkojirao

Praveen Pandojirao-Sunkojirao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8741737
    Abstract: Described are three-dimensional stacked semiconductor structures having one or more vertical interconnects. Vertical stacking relies on vertical interconnects and wafer bonding using a patternable polymer. The polymer is preferably lithographically patternable and photosensitive. Curing of the polymer is preselected from about 35% to up to about 100%, depending on a desired outcome. When fabricated, such vertically stacked structures include electrical interconnects provided by solder reflow. Solder reflow temperature is bounded by a curing and glass transition temperatures of a polymer used for bonding.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: June 3, 2014
    Assignee: Board of Regents, The University of Texas System
    Inventors: Dan O. Popa, Rachita Dewan, Praveen Pandojirao-Sunkojirao, Jung-Chih Chiao
  • Publication number: 20080122115
    Abstract: Described are three-dimensional stacked semiconductor structures having one or more vertical interconnects. Vertical stacking relies on vertical interconnects and wafer bonding using a patternable polymer. The polymer is preferably lithographically patternable and photosensitive. Curing of the polymer is preselected from about 35% to up to about 100%, depending on a desired outcome. When fabricated, such vertically stacked structures include electrical interconnects provided by solder reflow. Solder reflow temperature is bounded by a curing and glass transition temperatures of a polymer used for bonding.
    Type: Application
    Filed: September 20, 2007
    Publication date: May 29, 2008
    Applicant: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
    Inventors: Dan O. Popa, Rachita Dewan, Praveen Pandojirao-Sunkojirao, Jung-Chih Chiao