Patents by Inventor Puntha Vedantham

Puntha Vedantham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190366291
    Abstract: Disclosed herein are formulations, substrates, and arrays. In certain embodiments, substrates and arrays comprise a porous layer for synthesis and attachment of polymers or biomolecules. Also disclosed herein are methods for manufacturing and using the formulations, substrates, and arrays, including porous arrays. Also disclosed herein are formulations and methods for one-step coupling, e.g., for synthesis of peptides in an N->C orientation. In some embodiments, disclosed herein are formulations and methods for high efficiency coupling of biomolecules to a substrate.
    Type: Application
    Filed: February 27, 2019
    Publication date: December 5, 2019
    Inventors: John J. Rajasekaran, Vasanth Jayaraman, Tianhao Wang, Kang Bei, Hari Krishnan Krishnamurthy, Puntha Vedantham