Abstract: Intelligent process management is provided. A start time is determined for an additional process to be run on a worker node within a duration of a sleep state of a task of a process already running on the worker node by adding a first defined buffer time to a determined start time of the sleep state of the task. A backfill time is determined for the additional process by subtracting a second defined buffer time from a determined end time of the sleep state of the task. A scheduling plan is generated for the additional process based on the start time and the backfill time corresponding to the additional process. The scheduling plan is executed to run the additional process on the worker node according to the start time and the backfill time corresponding to the additional process.

Abstract: An electronic device includes an integrated circuit and a smart film layer. Integrated circuit is configured to output a control signal. Smart film layer is coupled to integrated circuit and includes a first substrate, a second substrate, a liquid crystal layer, a transparent glue layer, a cover, and at least one touch electrode layer. Second substrate is located on first substrate. Liquid crystal layer is located between first substrate and second substrate. Transparent glue layer is located on second substrate. Cover is located on transparent glue layer. At least one touch electrode layer is located between two of first substrate, second substrate, liquid crystal layer, transparent glue layer, or cover. At least one touch electrode layer is configured to transmit a touch signal or at least one touch electrode layer is configured to control liquid crystal layer to present in transparent states according to control signal of integrated circuit.

Abstract: A touch display module has plural sensors and includes an integrated frame, a backlight module, a thin film transistor substrate, a color filter, and a polarizer. The integrated frame has a bottom plate portion and a side plate portion, and the side plate portion stands on the bottom plate portion. The backlight module is disposed on the bottom plate portion. The thin film transistor substrate is disposed on the backlight module. The color filter is disposed on the thin film transistor substrate. The polarizer is disposed on the color filter. One surface of the polarizer is an outer surface of the touch display module. The thin film transistor substrate and/or the color filter is connected to the side plate portion of the integrated frame. Therefore, by using the integrated frame to integrate required components into one mechanical part, the touch display module has thinner thickness and lighter weight.

Abstract: A touch display module has plural sensors and includes an integrated frame, a backlight module, a thin film transistor substrate, a color filter, and a polarizer. The integrated frame has a bottom plate portion and a side plate portion, and the side plate portion stands on the bottom plate portion. The backlight module is disposed on the bottom plate portion. The thin film transistor substrate is disposed on the backlight module. The color filter is disposed on the thin film transistor substrate. The polarizer is disposed on the color filter. One surface of the polarizer is an outer surface of the touch display module. The thin film transistor substrate and/or the color filter is connected to the side plate portion of the integrated frame. Therefore, by using the integrated frame to integrate required components into one mechanical part, the touch display module has thinner thickness and lighter weight.

Abstract: A projection system includes a projection device including a projector unit and a camera unit, a signal transmitter unit mounted to a projection screen, and a processing unit. The camera unit captures an image of a projection image projected by the projector unit onto the projection screen, and the processing unit obtains a position of the projection image accordingly. The processing unit obtains a position of the projection screen based on signals wirelessly transmitted by the signal transmitter unit and adjusts setting parameter(s) related to the projector unit based on a comparison between the positions of the projection image and the projection screen to reduce dimensional and/or positional differences between the two.

Abstract: A touch module includes a touch panel unit, a conductive adhesive layer and a circuit board. The touch panel unit includes a substrate, a touch sensing structure disposed on the substrate, a signal transmitting structure disposed on the substrate and electrically connected to the touch sensing structure, and a protection layer covering a part of a surface of the signal transmitting structure. The protection layer and the substrate are disposed at two opposite sides of the signal transmitting structure. The conductive adhesive layer has a main portion which covers a region of the signal transmitting structure on which the protection layer is not disposed, and a cover portion which extends from the main portion and covers the protection layer. The circuit board is disposed on the conductive adhesive layer, and the circuit board and the signal transmitting structure are disposed at two opposite sides of the conductive adhesive layer.

Abstract: A touch module includes a touch panel unit, a conductive adhesive layer and a circuit board. The touch panel unit includes a substrate, a touch sensing structure disposed on the substrate, a signal transmitting structure disposed on the substrate and electrically connected to the touch sensing structure, and a protection layer covering a part of a surface of the signal transmitting structure. The protection layer and the substrate are disposed at two opposite sides of the signal transmitting structure. The conductive adhesive layer has a main portion which covers a region of the signal transmitting structure on which the protection layer is not disposed, and a cover portion which extends from the main portion and covers the protection layer. The circuit board is disposed on the conductive adhesive layer, and the circuit board and the signal transmitting structure are disposed at two opposite sides of the conductive adhesive layer.