Patents by Inventor Qian SHAO
Qian SHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240112480Abstract: Provided is a method for publishing an image by an electronic device. The method comprises: displaying, in response to an image selection instruction, a plurality of images on an image selection page; displaying, in response to a selection operation on a first image on the image selection page, the first image and at least one second image on an image preview page; and publishing, in response to an image publishing instruction, at least one image selected on the image preview page.Type: ApplicationFiled: September 19, 2023Publication date: April 4, 2024Inventor: Qian SHAO
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Publication number: 20240012212Abstract: An optical module includes a shell, a circuit board, a base, a laser assembly, a silicon optical chip and a protective cover. The laser assembly and the silicon optical chip are located on the base. The protective cover covers on the circuit board. The laser assembly and a wiring region of the laser assembly and/or the silicon optical chip and a wiring region of the silicon optical chip are encapsulated between the protective cover and the circuit board. The shell includes at least one heat conduction column, the at least one heat conduction column is disposed on an inner wall of the shell and is in thermal conductive connection with the laser assembly and/or the silicon optical chip. The protective cover includes at least one escape opening that allow the at least one heat conduction column to pass and enter an inside of the protective cover.Type: ApplicationFiled: September 22, 2023Publication date: January 11, 2024Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Guangchao DU, Yongzheng TANG, Tao WU, Jianwei MU, Shaoshuai SUI, Jihong HAN, Sitao CHEN, Qian SHAO, Bangyu YU, Benzheng DONG, Xiangxun SUN, Fabu XU
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Publication number: 20240012210Abstract: An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The circuit board is disposed between an upper shell and a lower shell of the shell. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly and the silicon optical chip are located on the base. An upper box of the laser assembly and the base are combined to provide a cavity. Conductive substrates of the laser assembly are at least partially located in the cavity. Laser chips of the laser assembly are located on the conductive substrates. An opening of the cavity is located in an optical path where light emitted by the laser chips is emitted to the silicon optical chip, and a slot of the cavity allows the conductive substrates or wires to extend out of the cavity.Type: ApplicationFiled: September 22, 2023Publication date: January 11, 2024Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Guangchao DU, Yongzheng TANG, Tao WU, Jianwei MU, Shaoshuai SUI, Jihong HAN, Sitao CHEN, Qian SHAO, Bangyu YU, Benzheng DONG, Xiangxun SUN, Fabu XU
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Publication number: 20240012211Abstract: An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The laser assembly and the silicon optical chip are located on the base. The laser assembly includes an upper box, conductive substrates, laser chips and a light transmitting member. The upper box and the base are combined to provide a cavity. The cavity has an opening and a slot. The laser chips are located on the conductive substrates which are at least partially located in the cavity. The light transmitting member is disposed between the upper box and the base, and is configured to enclose the opening. Light exit surfaces of the laser chips are parallel to a light incident surface of the light transmitting member, and the light incident surface and a light exit surface of the light transmitting member are not parallel.Type: ApplicationFiled: September 22, 2023Publication date: January 11, 2024Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Guangchao DU, Yongzheng TANG, Tao WU, Jianwei MU, Shaoshuai SUI, Jihong HAN, Sitao CHEN, Qian SHAO, Bangyu YU, Benzheng DONG, Xiangxun SUN, Fabu XU
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Publication number: 20240012544Abstract: Provided is a method for determining a resource disclosure range. The method includes displaying, in response to a disclosure scope determining operation on a target resource, at least one disclosure scope option on a resource editing page of the target resource, wherein the disclosure scope option is configured to determine a disclosure scope of a first-type resource, the first-type resource being a resource whose disclosure duration is a preset duration; determining, in response to an operation on a target option, a disclosure scope of the target resource as a target scope; and publishing the target resource as the first-type resource, wherein a disclosure scope of the published target resource is the target scope.Type: ApplicationFiled: July 10, 2023Publication date: January 11, 2024Inventor: Qian SHAO
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Patent number: 11828991Abstract: An optical module includes an upper shell, a lower shell, a circuit board, a base, a laser assembly and a silicon optical chip. The upper shell and the lower shell form a wrapping cavity. The circuit board is located in the wrapping cavity. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly is located on the base, and is configured to provide light. The silicon optical chip is located on the base, and is configured to receive the light, and modulate the light to convert an electrical signal into an optical signal, and is configured to receive an optical signal from an outside of the optical module and convert the optical signal into an electrical signal.Type: GrantFiled: April 20, 2021Date of Patent: November 28, 2023Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Guangchao Du, Yongzheng Tang, Tao Wu, Jianwei Mu, Shaoshuai Sui, Jihong Han, Sitao Chen, Qian Shao, Bangyu Yu, Benzheng Dong, Xiangxun Sun, Fabu Xu
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Publication number: 20230291173Abstract: Provided is a laser. The laser includes: a base plate, an annular side wall, a plurality of conductive pins, a plurality of light-emitting chips, and a plurality of conductive wires; wherein the side wall and the plurality of light-emitting chips are disposed on the base plate, the side wall surrounds the plurality of light-emitting chips, the plurality of conductive pins are extended through the side wall and are affixed into the side wall, and sides, distal from the base plate, of portions of the plurality of conductive pins surrounded by the side wall include planar regions, wherein the planar region of each of the plurality of conductive pins is connected to the light-emitting chip via the conductive wire.Type: ApplicationFiled: May 22, 2023Publication date: September 14, 2023Inventors: Zinan ZHOU, Youliang TIAN, Xin ZHANG, Yunchen LU, Jianjun LI, Xintuan TIAN, Qian SHAO
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Publication number: 20230228957Abstract: An optical module includes a housing, a circuit board, a package, and at least one of a light-emitting assembly or a light receiving assembly. The package includes a package body and a soldering member. The package body includes a cavity. An end of the circuit board is inserted into the cavity, and the soldering member is located in a gap between the circuit board and the package body. The light-emitting assembly or the light receiving assembly is located in the cavity and electrically connected to the circuit board. The light-emitting assembly is configured to convert an electrical signal from the circuit board into an optical signal and emit the optical signal to an outside of the optical module, and the light receiving assembly is configured to convert the optical signal from the outside of the light module into an electric signal and transmit the electric signal to the circuit board.Type: ApplicationFiled: March 27, 2023Publication date: July 20, 2023Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Qian SHAO, Weiwei LIU, Jianwei YAO
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Patent number: 11631960Abstract: This application provides an optical module, and relates to the field of optical communication. An optical module provided in the embodiments of this application includes a laser box and a silicon photonic chip that are enclosed and packaged by an upper enclosure part and a lower enclosure part. The laser box is disposed on and is in contact with the surface of the silicon photonic chip by the side wall or the base. The laser chip is disposed on the top plane of the laser box. The top plane is in contact with the upper enclosure part for heat dissipation, so as to help heat generated by the laser chip be conducted to the upper enclosure part via the top plane, so that the heat generated by the laser chip is dissipated not via the silicon photonic chip.Type: GrantFiled: June 3, 2020Date of Patent: April 18, 2023Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Guangchao Du, Yongzheng Tang, Tao Wu, Jianwei Mu, Shaoshuai Sui, Jihong Han, Sitao Chen, Qian Shao
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Publication number: 20230116287Abstract: An optical module includes a circuit board, a substrate, a laser assembly, and a silicon photonic chip. The silicon photonic chip is electrically connected to the circuit board through the substrate so as to ground the silicon photonic chip. The substrate includes a body, a first support step, and a second support step. The first support step is disposed at an end of the body. The second support step is disposed at another end of the body. The circuit board includes a first metal layer and a second metal layer. The first metal layer is disposed on a surface of the circuit board proximate to the first support step and is electrically connected to the first support step. The second metal layer is disposed on a surface of the circuit board proximate to the second support step and is electrically connected to the second support step.Type: ApplicationFiled: December 13, 2022Publication date: April 13, 2023Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Long ZHENG, Yuting DONG, JR., Shicong HAO, Sigeng YANG, Qian SHAO, Jihong HAN, Jingqi SU
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Publication number: 20220404563Abstract: The present disclosure discloses an optical module including a circuit board and a light-emitting assembly. In the light-emitting assembly, a wavelength tuning mechanism is formed of a semiconductor optical amplification chip, a silicon optical chip and a semiconductor refrigerator. The semiconductor optical amplification chip may provide a plurality of wavelengths, and a wavelength selection is carried out by an optical filter in the silicon optical chip; a temperature adjustment for the optical filter is achieved by the semiconductor refrigerator, so as to further adjust a performance of the filter for wavelength selection. The above device is provided in a housing to facilitate packaging of the devices.Type: ApplicationFiled: August 22, 2022Publication date: December 22, 2022Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Weiwei LIU, Qian SHAO, Liu YANG, Tao WU
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Publication number: 20220163741Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly and a claw assembly. The lens assembly includes a lens base and a connecting part. The lens base covers the at least one of the light-transmitting chip or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The connecting part includes at least one positioning slot disposed on a surface of the connecting part facing away from the lens base. The claw assembly includes a claw and a through hole. The claw includes at least one positioning protrusion disposed on a surface of the claw facing the connecting part. The through hole is configured to be connected to an optical fiber outside the optical module.Type: ApplicationFiled: February 14, 2022Publication date: May 26, 2022Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.Inventors: Wei CUI, Baofeng SI, Xuxia LIU, Hongchao PAN, Qian SHAO, Sigeng YANG, Peng HE, Chengshuang LUO, Fenglai WANG
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Publication number: 20220146763Abstract: An optical module includes: a circuit board with a recess; a laser box disposed in the recess and electrically connected to the circuit board; a fiber ribbon, wherein one end of the fiber ribbon is connected to the laser box; and a silicon photonic chip electrically connected to the circuit board and to the other end of the fiber ribbon. The laser box includes: a flat base disposed in the recess, with one end of the flat base being coupled to the fiber ribbon; a conductive substrate disposed at the other end of the flat base and electrically connected to the circuit board; a laser chip attached on the conductive substrate; and an upper cover including a top plate and side plates, so that the upper cover caps/is covered on the flat base. A fitting between the flat base and the upper cover facilitates assembly of the conductive substrate and the laser chip in the laser box.Type: ApplicationFiled: January 24, 2022Publication date: May 12, 2022Inventors: Qian SHAO, Jihong HAN, Tao WU, Jianwei MU, Honghao JIAO
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Patent number: 11188203Abstract: The disclosure relates to a method for generating a multimedia material. The method includes displaying an album interface in response to receiving a first operation. The album interface includes a draft box interface switching control of the application and at least one terminal album management control. The method includes displaying a draft box interface in response to receiving a second operation. The draft box interface includes at least one first multimedia material belonging to a draft box of the application. The method includes determining a first material in response to receiving a first selection operation in the draft box interface, the first selection operation triggered on the first multimedia material from the user; and generating a first target multimedia material based on the first material in response to receiving a first determination operation, the first determination operation triggered on the first material.Type: GrantFiled: December 30, 2020Date of Patent: November 30, 2021Assignee: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.Inventors: Qian Li, Qian Shao
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Publication number: 20210239922Abstract: An optical module includes an upper shell, a lower shell, a circuit board, a base, a laser assembly and a silicon optical chip. The upper shell and the lower shell form a wrapping cavity. The circuit board is located in the wrapping cavity. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly is located on the base, and is configured to provide light. The silicon optical chip is located on the base, and is configured to receive the light, and modulate the light to convert an electrical signal into an optical signal, and is configured to receive an optical signal from an outside of the optical module and convert the optical signal into an electrical signal.Type: ApplicationFiled: April 20, 2021Publication date: August 5, 2021Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.Inventors: Guangchao DU, Yongzheng TANG, Tao WU, Jianwei MU, Shaoshuai SUI, Jihong HAN, Sitao CHEN, Qian SHAO, Bangyu YU, Benzheng DONG, Xiangxun SUN, Fabu XU
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Publication number: 20210223924Abstract: The disclosure relates to a method for generating a multimedia material. The method includes displaying an album interface in response to receiving a first operation. The album interface includes a draft box interface switching control of the application and at least one terminal album management control. The method includes displaying a draft box interface in response to receiving a second operation. The draft box interface includes at least one first multimedia material belonging to a draft box of the application. The method includes determining a first material in response to receiving a first selection operation in the draft box interface, the first selection operation triggered on the first multimedia material from the user; and generating a first target multimedia material based on the first material in response to receiving a first determination operation, the first determination operation triggered on the first material.Type: ApplicationFiled: December 30, 2020Publication date: July 22, 2021Inventors: Qian Li, Qian Shao
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Publication number: 20200295528Abstract: This application provides an optical module, and relates to the field of optical communication. An optical module provided in the embodiments of this application includes a laser box and a silicon photonic chip that are enclosed and packaged by an upper enclosure part and a lower enclosure part. The laser box is disposed on and is in contact with the surface of the silicon photonic chip by the side wall or the base. The laser chip is disposed on the top plane of the laser box. The top plane is in contact with the upper enclosure part for heat dissipation, so as to help heat generated by the laser chip be conducted to the upper enclosure part via the top plane, so that the heat generated by the laser chip is dissipated not via the silicon photonic chip.Type: ApplicationFiled: June 3, 2020Publication date: September 17, 2020Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Guangchao DU, Yongzheng TANG, Tao WU, Jianwei MU, Shaoshuai SUI, Jihong HAN, Sitao CHEN, Qian SHAO
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Patent number: D962279Type: GrantFiled: April 13, 2021Date of Patent: August 30, 2022Assignee: KWAI GAMES PTE, LTD.Inventors: Haiyang Jiang, Qian Shao
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Patent number: D966331Type: GrantFiled: April 29, 2021Date of Patent: October 11, 2022Assignee: KWAI GAMES PTE, LTD.Inventors: Yafang Mu, Qian Shao
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Patent number: D969140Type: GrantFiled: January 27, 2021Date of Patent: November 8, 2022Assignee: Beijing Dajia Internet Information Technology Co.Inventors: Qian Shao, Jinwei Sun