Patents by Inventor Qinshan CAI

Qinshan CAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240306476
    Abstract: A display panel includes: a light-emitting baseplate including a plurality of light-emitting components arranged in array; a first light extraction layer located at a light-emitting side of the light-emitting baseplate and including a plurality of first light extraction patterns, orthographic projections of the plurality of first light extraction patterns on the light-emitting baseplate covering at least part area of the light-emitting components; a color filter layer including a plurality of filter patterns, orthographic projections of the plurality of filter patterns on the light-emitting baseplate covering orthographic projections of the plurality of light-emitting components on the light-emitting baseplate; and a second light extraction layer including a plurality of second light extraction patterns, orthographic projections of the second light extraction patterns on the light-emitting baseplate being within the orthographic projections of the plurality of filter patterns on the light-emitting baseplate.
    Type: Application
    Filed: April 27, 2022
    Publication date: September 12, 2024
    Applicants: Yunnan Invensight Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Hongtao Yu, Weiliang Bu, Yunhao Zhang, Dongdong Su, Yuhao Lee, Zongshun Yang, Hui Tong, Kuanta Huang, Xiaochuan Chen, Hui Wang, Fushuang Zhang, Chao Yang, Qinshan Cai, Lingang Wen
  • Publication number: 20210318732
    Abstract: A flexible display motherboard includes a carrier substrate, a flexible substrate and a display device disposed on the flexible substrate, where a plurality of heating resistors are arranged between the carrier substrate and the flexible substrate, and a binding force between the heating resistor and the carrier substrate is greater than a binding force between the heating resistor and the flexible substrate; the flexible substrate has an extension portion filled between adjacent heating resistors, and a molecular chain structure of the extension portion forms a hydrogen bond with the molecular chain structure of the carrier substrate; the heating resistor is used for heating the carrier substrate and the flexible substrate, so that heat generated by the heating resistor breaks the hydrogen bond.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Applicant: Yungu (Gu'an) Technology Co., Ltd.
    Inventors: Xinxin YUAN, Zhicong ZHAI, Zhenyu ZHANG, Yongxiang ZHAI, Zhenzhen ZHANG, Qinshan CAI, Xiaojia LIU