Patents by Inventor Qiwei Liang

Qiwei Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240234108
    Abstract: Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. The electrostatic chuck body may define a backside gas lumen that extends through a surface of the substrate seat. The assemblies may include a bias electrode coupled with the electrostatic chuck body. The bias electrode may include a plurality of conductive mesas that protrude upward across the substrate seat. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include at least one chucking electrode embedded within the electrostatic chuck body. The assemblies may include at least one heater embedded within the electrostatic chuck body.
    Type: Application
    Filed: January 4, 2024
    Publication date: July 11, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Paneendra Prakash Bhat, Qiwei Liang, Douglas Buchberger, Dmitry Lubomirsky, Naveen Kumar Nagaraja, Vijay D. Parkhe
  • Publication number: 20240230404
    Abstract: Provided is a method for blending of agricultural product utilizing hyperspectral imaging. At least one region along a sample of agricultural product is scanned using at least one light source of different wavelengths. Hyperspectral images are generated from the at least one region. A spectral fingerprint for the sample of agricultural product is formed from the hyperspectral images. A plurality of samples of agricultural product is blended based on the spectral fingerprints of the samples according to parameters determined by executing a blending algorithm.
    Type: Application
    Filed: February 5, 2024
    Publication date: July 11, 2024
    Applicant: Altria Client Services LLC
    Inventors: Seetharama C. DEEVI, Henry M. DANTE, Qiwei LIANG, Samuel Timothy HENRY
  • Publication number: 20240160117
    Abstract: Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module (100) and includes an upper portion (102) with an electrode (400) and a base portion (104) which is configured to support a substrate (500) on a substrate support surface (159). The upper portion (102) and the base portion (104) are actuated toward and away from one another using one or more arms (112) and form a process volume (404). The process volume (404) is filled with a process fluid and the processing module (100) is rotated about an axis (A). An electric field is applied to the substrate (500) by the electrode (400) before the process fluid is drained from the process volume (404).
    Type: Application
    Filed: April 2, 2021
    Publication date: May 16, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Dmitry LUBOMIRSKY, Kyle M. HANSON, Douglas A. BUCHBERGER, Jr., Alan L. TSO, Rahul KOZHIKKALKANDI, Paul R. MCHUGH, Jiayi SUN, Qiwei LIANG, Nithin Thomas ALEX, Lancelot HUANG, Ellie Y. YIEH
  • Patent number: 11976973
    Abstract: Provided is a method for blending of agricultural product utilizing hyperspectral imaging. At least one region along a sample of agricultural product is scanned using at least one light source of different wavelengths. Hyperspectral images are generated from the at least one region. A spectral fingerprint for the sample of agricultural product is formed from the hyperspectral images. A plurality of samples of agricultural product is blended based on the spectral fingerprints of the samples according to parameters determined by executing a blending algorithm.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: May 7, 2024
    Assignee: ALTRIA CLIENT SERVICES LLC
    Inventors: Seetharama C. Deevi, Henry M. Dante, Qiwei Liang, Samuel Timothy Henry
  • Patent number: 11948828
    Abstract: The present disclosure generally relates to a pin-less substrate transfer apparatus and method for a processing chamber. The processing chamber includes a pedestal. The pedestal includes a pedestal plate. The pedestal plate has a radius, a top surface, and a bottom surface. The pedestal plate further includes a plurality of cut outs on a perimeter of the pedestal plate. Flat edges are disposed on opposite sides of the pedestal plate. Recesses are disposed in the bottom surface below each of the flat edges.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: April 2, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Sultan Malik, Srinivas D. Nemani, Adib M. Khan, Qiwei Liang
  • Patent number: 11899366
    Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: February 13, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff, Randy Harris, Robert B. Moore
  • Patent number: 11756803
    Abstract: A high-pressure processing system for processing a layer on a substrate includes a first chamber, a support to hold the substrate in the first chamber, a second chamber adjacent the first chamber, a foreline to remove gas from the second chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, a gas delivery system configured to increase the pressure within the first chamber to at least 10 atmospheres while the first chamber is isolated from the second chamber, an exhaust system comprising an exhaust line to remove gas from the first chamber, and a common housing surrounding both the first gas delivery module and the second gas delivery module.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: September 12, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Qiwei Liang, Srinivas D. Nemani, Sean S. Kang, Adib Khan, Ellie Y. Yieh
  • Patent number: 11749555
    Abstract: Embodiments of the disclosure relate to an apparatus and method for processing semiconductor substrates. In one embodiment, a processing system is disclosed. The processing system includes an outer chamber that surrounds an inner chamber. The inner chamber includes a substrate support upon which a substrate is positioned during processing. The inner chamber is configured to have an internal volume that, when isolated from an internal volume of the outer chamber, is changeable such that the pressure within the internal volume of the inner chamber may be varied.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: September 5, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Sultan Malik, Srinivas D. Nemani, Qiwei Liang, Adib M. Khan
  • Patent number: 11725274
    Abstract: Embodiments described herein relate to apparatus and methods for processing a substrate. In one embodiment, a cluster tool apparatus is provided having a transfer chamber and a pre-clean chamber, a self-assembled monolayer (SAM) deposition chamber, an atomic layer deposition (ALD) chamber, and a post-processing chamber disposed about the transfer chamber. A substrate may be processed by the cluster tool and transferred between the pre-clean chamber, the SAM deposition chamber, the ALD chamber, and the post-processing chamber. Transfer of the substrate between each of the chambers may be facilitated by the transfer chamber which houses a transfer robot.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: August 15, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Tobin Kaufman-Osborn, Srinivas D. Nemani, Ludovic Godet, Qiwei Liang, Adib Khan
  • Patent number: 11682556
    Abstract: A method of forming graphene layers is disclosed. A method of improving graphene deposition is also disclosed. Some methods are advantageously performed at lower temperatures. Some methods advantageously provide graphene layers with lower resistance. Some methods advantageously provide graphene layers in a relatively short period of time.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: June 20, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jie Zhou, Erica Chen, Qiwei Liang, Chentsau Chris Ying, Srinivas D. Nemani, Ellie Y. Yieh
  • Publication number: 20230161260
    Abstract: A method and apparatus for performing post-exposure bake cooling operations is described herein. The method begins by post exposure baking a substrate disposed on heated substrate support in a process chamber, the process chamber having a showerhead. The heated substrate support is moved to increase a distance between the heated substrate support and a cooled plate of the showerhead. The substrate is separated from the heated substrate support using a substrate lifting device. The substrate is moved into a close proximity to the cooled showerhead. The substrate is cooled until the substrate is less than about 70 degrees Celsius. The substrate is spaced away from the cooled showerhead using the substrate lifting device and aligning the substrate with a substrate transfer passage of the processing chamber for removal by a robot.
    Type: Application
    Filed: October 5, 2022
    Publication date: May 25, 2023
    Inventors: Dmitry LUBOMIRSKY, Douglas A. BUCHBERGER, Jr., Hyunjun KIM, Alan L. TSO, Shekhar ATHANI, Qiwei LIANG, Ellie Y. YIEH
  • Publication number: 20230093374
    Abstract: A high-pressure processing system for processing a layer on a substrate includes a first chamber, a support to hold the substrate in the first chamber, a second chamber adjacent the first chamber, a foreline to remove gas from the second chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, a gas delivery system configured to increase the pressure within the first chamber to at least 10 atmospheres while the first chamber is isolated from the second chamber, an exhaust system comprising an exhaust line to remove gas from the first chamber, and a common housing surrounding both the first gas delivery module and the second gas delivery module.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Inventors: Qiwei LIANG, Srinivas D. NEMANI, Sean S. KANG, Adib KHAN, Ellie Y. YIEH
  • Patent number: 11527421
    Abstract: A high-pressure processing system for processing a layer on a substrate includes a first chamber, a support to hold the substrate in the first chamber, a second chamber adjacent the first chamber, a foreline to remove gas from the second chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, a gas delivery system configured to increase the pressure within the first chamber to at least 10 atmospheres while the first chamber is isolated from the second chamber, an exhaust system comprising an exhaust line to remove gas from the first chamber, and a common housing surrounding both the first gas delivery module and the second gas delivery module.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: December 13, 2022
    Assignee: Micromaterials, LLC
    Inventors: Qiwei Liang, Srinivas D. Nemani, Sean S. Kang, Adib Khan, Ellie Y. Yieh
  • Publication number: 20220350251
    Abstract: A method and apparatus for performing post-exposure bake operations is described herein. The apparatus includes a plate stack and enables formation of a first high ion density plasma before the ion concentration within the first high ion density plasma is reduced using a diffuser to form a second low ion density plasma. The second low ion density plasma is an electron cloud or a dark plasma. An electric field is formed between a substrate support and the diffuser and through the second low ion density plasma during post-exposure bake of a substrate disposed on the substrate support. The second low ion density plasma electrically couples the substrate support and the diffuser during application of the electric field. The plate stack is equipped with power supplies and insulators to enable the formation or modification of a plasma within three regions of a process chamber.
    Type: Application
    Filed: November 19, 2021
    Publication date: November 3, 2022
    Inventors: Dmitry LUBOMIRSKY, Douglas A. BUCHBERGER, JR., Qiwei LIANG, Hyunjun KIM, Ellie Y. YIEH
  • Publication number: 20220341042
    Abstract: Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.
    Type: Application
    Filed: July 11, 2022
    Publication date: October 27, 2022
    Inventors: Adib KHAN, Shankar VENKATARAMAN, Jay D. PINSON, II, Jang-Gyoo YANG, Nitin K. INGLE, Qiwei LIANG
  • Publication number: 20220319896
    Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support for use in a chemical vapor deposition (CVD) chamber includes: a pedestal to support a substrate, wherein the pedestal includes a dielectric plate coupled to a pedestal body; a rotary union coupled to the pedestal, wherein the rotary union includes a stationary housing disposed about a rotor; a drive assembly coupled to the rotary union; a coolant union coupled to the rotary union and having a coolant inlet fluidly coupled to coolant channels disposed in the pedestal via a coolant line; an RF rotary joint coupled to the coolant union and having an RF connector configured to couple the pedestal to an RF bias power source; and an RF conduit that extends from the RF connector to the pedestal through a central opening of the pedestal body to provide RF bias to the pedestal.
    Type: Application
    Filed: April 2, 2021
    Publication date: October 6, 2022
    Inventors: Qiwei LIANG, Douglas Arthur BUCHBERGER, Jr., Gautam PISHARODY, Dmitry LUBOMIRSKY, Shekhar ATHANI
  • Patent number: 11408075
    Abstract: Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: August 9, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Adib Khan, Shankar Venkataraman, Jay D. Pinson, II, Jang-Gyoo Yang, Nitin Krishnarao Ingle, Qiwei Liang
  • Patent number: 11387071
    Abstract: Apparatus for a multi-source ion beam etching (IBE) system are provided herein. In some embodiments, a multi-source IBE system includes a multi-source lid comprising a multi-source adaptor and a lower chamber adaptor, a plurality of IBE sources coupled to the multi-source adaptor, a rotary shield assembly coupled to a shield motor mechanism configured to rotate the rotary shield, wherein the shield motor mechanism is coupled to a top portion of the multi-source lid, and wherein the rotary shield includes a body that has one IBE source opening formed through the body, and at least one beam conduit that engages the one IBE source opening in the rotary shield on one end, and engages the bottom portion of the IBE sources on the opposite end of the beam conduit.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: July 12, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Qiwei Liang, Srinivas D Nemani, Ellie Yieh, Douglas Buchberger, Chentsau Chris Ying
  • Patent number: 11361978
    Abstract: The present disclosure relates to high pressure processing apparatus for semiconductor processing. The apparatus described herein include a high pressure process chamber and a containment chamber surrounding the process chamber. A high pressure fluid delivery module is in fluid communication with the high pressure process chamber and is configured to deliver a high pressure fluid to the process chamber.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: June 14, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Adib M. Khan, Qiwei Liang, Sultan Malik, Srinivas D. Nemani
  • Publication number: 20220172948
    Abstract: A method of forming graphene layers is disclosed. A method of improving graphene deposition is also disclosed. Some methods are advantageously performed at lower temperatures. Some methods advantageously provide graphene layers with lower resistance. Some methods advantageously provide graphene layers in a relatively short period of time.
    Type: Application
    Filed: February 15, 2022
    Publication date: June 2, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Jie Zhou, Erica Chen, Qiwei Liang, Chentsau Chris Ying, Srinivas D. Nemani, Ellie Y. Yieh