Abstract: Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.

Abstract: An MEMS microphone is provided, comprising a substrate and a vibration diaphragm supported above the substrate by a spacing portion, the substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the substrate, wherein: a lower electrode forming a capacitor structure with the vibration diaphragm is provided on the substrate, and an electret layer providing an electric field between the vibration diaphragm and the lower electrode is provided on the substrate

Abstract: An MEMS microphone device and an electronics apparatus are provided. The MEMS microphone device comprises: a substrate; a MEMS microphone element placed on the substrate; a cover encapsulating the MEMS microphone element together with the substrate; and an acoustic port for the MEMS microphone element, wherein a compliant membrane is provided to seal the acoustic port, and the membrane has a mechanical stiffness lower than that of the diaphragm of the MEMS microphone element.

Abstract: A display device manufacturing method, display device and electronics apparatus are provided. The display device manufacturing method comprises: forming the vertical micro-LEDs on a growth substrate: forming a first electrode on top of each of the vertical micro-LEDs; forming a second electrode on side surface of each of the vertical micro-LEDs; and transferring the vertical micro-LEDs from the growth substrate to a display substrate of a display device. An embodiment of this invention can reduce the back-end fabrication process on a display substrate after transfer.

Abstract: An MEMS microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein: one of the vibration diaphragm and the first substrate is provided with a magnetic film, and the other one of the vibration diaphragm and the first substrate is provided with a magnetoresistive sensor cooperating with the magnetic film, the magnetoresistive sensor being configured to sense a change in a magnetic field of the magnetic film during a vibration of the vibration diaphragm and output a varying electrical signal.

Abstract: An MEMS microphone is provided, comprising: a first substrate; a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate; and a floating gate field effect transistor outputting a varying electrical signal, the floating gate field effect transistor including a source electrode and a drain electrode both provided on the first substrate and a floating gate provided on the vibration diaphragm.

Abstract: In one embodiment, a semiconductor device wafer (10) contains electrical components and has electrodes (28) on a first side of the device wafer (10). A transparent carrier wafer (30) is bonded to the first side of the device wafer (10) using a bonding material (32) (e.g., a polymer or metal). The second side of the device wafer (10) is then processed, such as thinned, while the carrier wafer (30) provides mechanical support for the device wafer (10). The carrier wafer (30) is then de-bonded from the device wafer (10) by passing a laser beam (46) through the carrier wafer (30), the carrier wafer (30) being substantially transparent to the wavelength of the beam. The beam impinges on the bonding material (32), which absorbs the beam's energy, to break the chemical bonds between the bonding material (32) and the carrier wafer (30). The released carrier wafer (30) is then removed from the device wafer (10), and the residual bonding material is cleaned from the device wafer (10).

Abstract: A micro laser diode projector comprises: an MEMS scanning device, which rotates around a first axis and a second axis that are orthogonal to each other; and a micro laser diode light source including at least one micro laser diode, wherein the micro laser diode light source is mounted on the MEMS scanning device and rotates around the first and second axes with the MEMS scanning device to project light to a projection screen. An electronics apparatus including the micro laser diode projector is also discussed.

Abstract: The present disclosure discloses a microphone, comprising: a first substrate, the first substrate having an inner cavity open at one end, wherein the microphone further comprises a vibration diaphragm and at least one cantilever which are provided to the first substrate and suspended above the inner cavity. The cantilever is separated from the vibration diaphragm by a spacing portion, and the vibration diaphragm and the inner cavity of the first substrate define an acoustically sealed cavity; and a detection structure is provided to the vibration diaphragm and the cantilever. The structural design of the cantilever is adopted, so that the space between the vibration diaphragm and the cantilever is open, the airflow can smoothly pass by the cantilever, and further the signal-to-noise ratio of the microphone can be greatly improved.

Abstract: The present invention discloses a monolithic integration device and micro Total Analysis System. The monolithic integration device for sensing comprises: a micro-LED; an optical detector; and a sensing channel, wherein the micro-LED is coupled with the sensing channel and is configured for emitting light into the sensing channel, and the optical detector is coupled with the sensing channel and is configured for sensing the light which is emitted by the micro-LED and travels through at least one part of the sensing channel. An embodiment of this invention proposes a new monolithic integration device for sensing with built-in light source and optical detection system.

Abstract: Disclosed are a condenser MEMS microphone and an electronic apparatus. The condenser MEMS microphone comprises: a substrate; a bottom plate placed on the substrate; and a top plate placed above the bottom plate and spaced from the bottom plate, wherein the top plate is torsional with respect to a first torsional axis and is divided into a first part and a second part by the first torsional axis, the first part and the second part form two condensers with the bottom plate, and a first group of acoustic holes are provided in the first part of the top plate.

Abstract: A micro-LED display device and a manufacturing method thereof are disclosed. The method comprises: forming micro-LEDs (202) on a carrier substrate (201), wherein the carrier substrate (201) is transparent for a laser which is used in laser lifting-off; filling trenches between the micro-LEDs (202) on the carrier substrate (201) with a holding material (209); performing a laser lifting-off on selected ones of the micro-LEDs (202) to lift off them from the carrier substrate (201), wherein the selected micro-LEDs (202) are held on the carrier substrate (201) through the holding material (209); bonding the selected micro-LEDs (202) onto a receiving substrate (207) of the micro-LED display device; separating the selected micro-LEDs (202) from the carrier substrate (201) to transfer them to the receiving substrate (207).

Abstract: A MEMS microphone, which comprises a substrate, a first vibrating diaphragm and a second vibrating diaphragm is provided. A sealed cavity is formed between the first vibrating diaphragm and the second vibrating diaphragm. A back electrode unit is located in the sealed cavity, forms a capacitor structure with the first vibrating diaphragm and with the second vibrating diaphragm respectively, and is provided with a plurality of through holes that penetrate through two sides thereof. The sealed cavity is filled with a gas whose viscosity coefficient is smaller than that of air. According to the MEMS microphone disclosed by the present invention, by filling the sealed cavity with a gas whose viscosity coefficient is smaller than that of air, the acoustic resistance when the two vibrating diaphragms move relative to the back electrode can be reduced greatly, thereby reducing the noise of the microphone.

Abstract: Disclosed are a MEMS microphone and an electronic apparatus. The MEMS microphone comprises: a pressure sensing element, for sensing pressure applied thereon; a diaphragm attached to the pressure sensing element and applying pressure to the pressure sensing element; and a backbone attached to the pressure sensing element and supporting the pressure sensing element.

Abstract: A MEMS microphone and a manufacturing method thereof are provided. The MEMS microphone comprises a MEMS microphone chip and a housing with an acoustic port. The MEMS microphone chip is mounted in the housing, and a mesh plug is mounted in the acoustic port and made from a mesh material which has a mesh structure that is suitable for passage of sound.

Abstract: An image display device comprises: a thin film transistor backplane (1), and a first resolution display panel (2), a second resolution display panel (4), a display driving chip (3) and an integrated display driver (5), which are fixed on the thin film transistor backplane (1); the display driving chip (3) is electrically connected to bonding pads (111) on the thin film transistor backplane (1), and is provided under the second resolution display panel (4); and the display driving chip (3) is used for driving the second resolution display panel (4); the integrated display driver (5) is used for driving the first resolution display panel (2); and a resolution of the first resolution display panel (2) is lower than a resolution of the second resolution display panel (4).

Abstract: A micro-LED device, a display apparatus and a method for manufacturing a micro-LED device are provided. The micro-LED device comprises: a growth substrate; a plurality of vertical micro-LEDs formed on the growth substrate; a first type electrode formed on top of each of the vertical micro-LEDs; and a second type electrode formed on side surface of each of the vertical micro-LEDs.

Abstract: The present invention discloses a capacitive MEMS microphone and an electronic apparatus. The capacitive MEMS microphone comprises: a diaphragm; and a substrate, wherein a cavity is formed between the diaphragm and the substrate, and the cavity is filed with an elastic body. According to an embodiment of this invention, an elastic body is adopted in a capacitive MEMS microphone to replace the air gap of the prior art such that the SNR of the microphone is increased.

Abstract: A MEMS microphone, comprising a packaging structure that is enveloped by a PCB substrate (1) and a housing (2), wherein the packaging structure is provided with a MEMS acoustoelectric chip (3) therein, and the PCB substrate (1) is provided with a sound port (11) at a position that is corresponding to the MEMS acoustoelectric chip (3), wherein, the MEMS microphone further comprises a filter (5), wherein the filter (5) is embedded into a back cavity of the MEMS acoustoelectric chip (3), the filter (5) and the PCB substrate (1) have a lateral hole therebetween, and the lateral hole serves as a sound channel that is used by the MEMS acoustoelectric chip (3) to gather sound. The MEMS microphone can prevent gas shock, block the interfering to the MEMS microphone by kinetic particles, keep the acoustic performance of the MEMS microphone, and reduce the packaging size of the MEMS microphone.

Abstract: A display device manufacturing method, display device and electronics apparatus. The display device manufacturing method comprises: forming the vertical micro-LEDs (200) on a growth substrate (201) (S1100); forming a first electrode (207) on top of each of the vertical micro-LEDs (200) (S1200); forming a second electrode (208) on side surface of each of the vertical micro-LEDs (200) (S1300); and transferring the vertical micro-LEDs (200) from the growth substrate (201) to a display substrate (301) of a display device (S1400). Can reduce the back-end fabrication process on a display substrate after transferring.