Abstract: The disclosure discloses an ultraviolet lamp bead package structure and a preparation method thereof. The ultraviolet lamp bead package structure includes a substrate and a first metal layer arranged on each of a package surface and a back surface of the substrate. A Zener chip is arranged on the electrode region of the first metal layer. The first metal layer also has a peripheral region. A second metal layer is arranged on the first metal layer. An Ultra Violet C radiation (UVC) chip is arranged on the electrode region of the second metal layer. The second metal layer is provided with a quartz lens by sealing through the peripheral region of the second metal layer. The quartz lens wraps the UVC chip and the Zener chip. An filler with anti-UVC characteristic is filled between the quartz lens and each of the UVC chip and the Zener chip.

Abstract: A micro-LED macro transfer method, a micro-LED display device, and a method for fabricating the same are provided. In the micro-LED macro transfer method, the LED chips on an array are divided into a first plurality of LED chips and a second plurality of LED chips. An LED chip includes a first surface and a second surface. The first plurality of LED chips are configured so that their first surfaces are coupled to the first transfer substrate. The second plurality of LED chips are configured so that their second surfaces are coupled to the second transfer substrate. Accordingly, the first transfer substrate transfers the first plurality of LED chips to the first transfer substrate while the second transfer substrate transfers the second plurality of LED chips to the second transfer substrate.

Abstract: A micro-LED macro transfer method, a micro-LED display device, and a method for fabricating the same are provided. In the micro-LED macro transfer method, the LED chips on an array are divided into a first plurality of LED chips and a second plurality of LED chips. An LED chip includes a first surface and a second surface. The first plurality of LED chips are configured so that their first surfaces are coupled to the first transfer substrate. The second plurality of LED chips are configured so that their second surfaces are coupled to the second transfer substrate. Accordingly, the first transfer substrate transfers the first plurality of LED chips to the first transfer substrate while the second transfer substrate transfers the second plurality of LED chips to the second transfer substrate.