Patents by Inventor Rachel K. Swanson

Rachel K. Swanson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7678526
    Abstract: Radiation curable thermal transfer elements including a substrate and a light-to-heat conversion layer overlaying the substrate, and processes to make the thermal transfer elements. The light-to-heat conversion layer is derived from a radiation curable material capable of being cured by exposure to radiation at a curing wavelength and an imaging radiation absorber material not substantially increasing radiation absorbance at the curing wavelength. The radiation curable transfer elements can be used in processes for making organic microelectronic devices.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: March 16, 2010
    Assignee: 3M Innovative Properties Company
    Inventors: Robin E. Wright, Khanh T. Huynh, Leslie A. Kreilich, Lan H. Liu, Rachel K. Swanson, Richard L. Walter, Martin B Wolk, Stephen A. Johnson, William A. Tolbert
  • Publication number: 20080241733
    Abstract: Radiation curable thermal transfer elements including a substrate and a light-to-heat conversion layer overlaying the substrate, and processes to make the thermal transfer elements. The light-to-heat conversion layer is derived from a radiation curable material capable of being cured by exposure to radiation at a curing wavelength and an imaging radiation absorber material not substantially increasing radiation absorbance at the curing wavelength. The radiation curable transfer elements can be used in processes for making organic microelectronic devices.
    Type: Application
    Filed: May 2, 2008
    Publication date: October 2, 2008
    Inventors: Robin E. Wright, Khanh T. Huynh, Leslie A. Krellich, Lan H. Liu, Rachel K. Swanson, Richard L. Walter, Martin B. Wolk, Stephen A. Johnson, William A. Tolbert
  • Patent number: 7396631
    Abstract: Radiation curable thermal transfer elements including a substrate and a light-to-heat conversion layer overlaying the substrate, and processes to make the thermal transfer elements. The light-to-heat conversion layer is derived from a radiation curable material capable of being cured by exposure to radiation at a curing wavelength and an imaging radiation absorber material not substantially increasing radiation absorbance at the curing wavelength. The radiation curable transfer elements can be used in processes for making organic microelectronic devices.
    Type: Grant
    Filed: October 7, 2005
    Date of Patent: July 8, 2008
    Assignee: 3M Innovative Properties Company
    Inventors: Robin E. Wright, Khanh T. Huynh, Leslie A. Kreilich, Lan H. Liu, Rachel K. Swanson, Richard L. Walter, Martin B. Wolk, Stephen A. Johnson, William A. Tolbert