Patents by Inventor Rafe Carl Mengel

Rafe Carl Mengel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reinforced bond pad for a semiconductor device
    Patent number: 7301231
    Abstract: Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: November 27, 2007
    Assignee: Agere Systems, Inc.
    Inventors: Joze E. Antol, Philip William Seitzer, Daniel Patrick Chesire, Rafe Carl Mengel, Vance Dolvan Archer, Thomas B. Gans, Taeho Kook, Sailesh M. Merchant
  • Reinforced bond pad for a semiconductor device
    Patent number: 7115985
    Abstract: Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: October 3, 2006
    Assignee: Agere Systems, Inc.
    Inventors: Joze E. Antol, Philip William Seitzer, Daniel Patrick Chesire, Rafe Carl Mengel, Vance Dolvan Archer, Thomas B. Gans, Taeho Kook, Sailesh M. Merchant