Patents by Inventor Rahul V Lakadwala

Rahul V Lakadwala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Configuration parameter transfer
    Patent number: 11068430
    Abstract: Examples relate to configuration parameter transfer. An apparatus may include a memory resource storing executable instructions. Instructions may include instructions to receive a first signal from a host computing device. Instructions may further include instructions to initiate communications with the host computing device in response to receiving the first signal. Instructions may further include instructions to receive a configuration parameter from the host computing device in response to initiation of communications with the host computing device. The apparatus may further include a processing resource to execute the instructions stored on the memory resource.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: July 20, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Isaac Lagnado, Jeffrey K Jeansonne, Roger D Benson, Ho-Sup Chung, Rahul V Lakadwala, Steven Petit
  • CONFIGURATION PARAMETER TRANSFER
    Publication number: 20210109884
    Abstract: Examples relate to configuration parameter transfer. An apparatus may include a memory resource storing executable instructions. Instructions may include instructions to receive a first signal from a host computing device. Instructions may further include instructions to initiate communications with the host computing device in response to receiving the first signal. Instructions may further include instructions to receive a configuration parameter from the host computing device in response to initiation of communications with the host computing device. The apparatus may further include a processing resource to execute the instructions stored on the memory resource.
    Type: Application
    Filed: April 24, 2017
    Publication date: April 15, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Isaac Lagnado, Jeffrey K Jeansonne, Roger D Benson, Ho-Sup Chung, Rahul V Lakadwala, Steven Petit