Patents by Inventor Rainer Jeske

Rainer Jeske has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7728468
    Abstract: A lamination has at least one spacing strip which is formed by cutting out sheet-metal pieces from a metal sheet in order to define an inner boundary and an outer boundary of the lamination. A cut line is made in the metal sheet to define a contour for a spacing strip which is bent out of the main plane of the lamination.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: June 1, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventor: Rainer Jeske
  • Publication number: 20070085440
    Abstract: A lamination has at least one spacing strip which is formed by cutting out sheet-metal pieces from a metal sheet in order to define an inner boundary and an outer boundary of the lamination. A cut line is made in the metal sheet to define a contour for a spacing strip which is bent out of the main plane of the lamination.
    Type: Application
    Filed: November 6, 2006
    Publication date: April 19, 2007
    Applicant: Siemens Aktiengesellschaft
    Inventor: RAINER JESKE
  • Patent number: 5648615
    Abstract: A pressure sensor for connection to a circuit board includes a silicon chip arranged in a housing so that one surface of the silicon chip faces the circuit board, and pressure is applied on the silicon chip surface facing away from the circuit board. The pressure sensor configuration is easy to produce and allows simple installation of the pressure sensor on the circuit board.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: July 15, 1997
    Assignee: Robert Bosch GmbH
    Inventors: Rainer Jeske, Kurt Weiblen, Dieter Arand