Patents by Inventor Rainer Markus Schaller

Rainer Markus Schaller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220172971
    Abstract: A method is provided for producing a hermetically sealed housing having a semiconductor component. The method comprises introducing a housing having a housing body and a housing cover into a process chamber. The housing cover closes off a cavity of the housing body and is attached in a gas-tight manner to the housing body. At least one opening is formed in the housing. At least one semiconductor component is arranged in the cavity. The method furthermore comprises generating a vacuum in the cavity by evacuating the process chamber, and also generating a predetermined gas atmosphere in the cavity and the process chamber. The method moreover comprises applying sealing material to the at least one opening while the predetermined gas atmosphere prevails in the process chamber.
    Type: Application
    Filed: February 18, 2022
    Publication date: June 2, 2022
    Inventors: Rainer Markus SCHALLER, Horst THEUSS
  • Patent number: 11326910
    Abstract: A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: May 10, 2022
    Assignee: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Markus Schaller
  • Publication number: 20220115585
    Abstract: A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 14, 2022
    Applicant: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Volker Strutz
  • Patent number: 11289353
    Abstract: A method is provided for producing a hermetically sealed housing having a semiconductor component. The method comprises introducing a housing having a housing body and a housing cover into a process chamber. The housing cover closes off a cavity of the housing body and is attached in a gas-tight manner to the housing body. At least one opening is formed in the housing. At least one semiconductor component is arranged in the cavity. The method furthermore comprises generating a vacuum in the cavity by evacuating the process chamber, and also generating a predetermined gas atmosphere in the cavity and the process chamber. The method moreover comprises applying sealing material to the at least one opening while the predetermined gas atmosphere prevails in the process chamber.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: March 29, 2022
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Horst Theuss
  • Patent number: 11275110
    Abstract: The disclosure describes techniques for detecting failures or performance degradation of a device including an integrated circuit (IC) components in the field by including additional contacts, i.e. terminals, along with functional contacts of the circuit used for connecting the circuit to a system in which the circuit is a part. These additional contacts may be internal external to the package surface and may be used to measure dynamic changing electrical characteristics over time e.g. voltage, current, capacity, temperature and impedance. These electrical characteristics may be representative of one or more failure modes and may be treated as indicator for device state-of-health (SOH).
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: March 15, 2022
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Rainer Markus Schaller
  • Publication number: 20220065773
    Abstract: A photoacoustic sensor includes a first layer with an optical MEMS emitter; a second layer stacked over the first layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are offset laterally with respect to one another; and a third layer stacked over the second layer with a cavity for a reference gas. The optical MEMS emitter transmits optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is outside the course of the optical path.
    Type: Application
    Filed: August 20, 2021
    Publication date: March 3, 2022
    Inventors: Horst Theuss, Rainer Markus Schaller
  • Patent number: 11255824
    Abstract: The present disclosure is related to a photoacoustic sensor modular assembly. An example interconnect module includes a support structure configured to be situated between an emitter module of the photoacoustic sensor and a detector module of the photoacoustic sensor. The emitter module may include an emitter component and the detector module may include a detector component. The interconnect module may include a conductive element configured to connect to at least one of the emitter component or the detector component.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: February 22, 2022
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Horst Theuss
  • Publication number: 20220028764
    Abstract: A semiconductor device comprises a semiconductor chip and an electrically conductive chip carrier, wherein the semiconductor chip is mounted on the chip carrier. The semiconductor device furthermore comprises an electrically conductive extension element mechanically connected to the chip carrier, wherein the extension element and the chip carrier are formed as an integral single piece. A part of the chip carrier which has the extension element is configured as an antenna.
    Type: Application
    Filed: July 16, 2021
    Publication date: January 27, 2022
    Inventors: Eduardo SCHITTLER NEVES, Rainer Markus SCHALLER, Matthias EBERL, Franz Michael DARRER
  • Publication number: 20220009438
    Abstract: A sensor device includes a sensor which is configured to detect a physical quantity generated by an impact event and to generate first measurement data based on the impact event. The sensor device also includes a MEMS microphone configured to detect sound waves generated by the impact event and to generate second measurement data based on the impact event. The sensor device is configured to provide the first measurement data and the second measurement data to a logic unit. The logic unit is configured to detect the impact event based on a combination of the first measurement data and the second measurement data.
    Type: Application
    Filed: June 18, 2021
    Publication date: January 13, 2022
    Applicant: Infineon Technologies AG
    Inventors: Rainer Markus SCHALLER, Horst THEUSS
  • Patent number: 11211551
    Abstract: A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: December 28, 2021
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Volker Strutz
  • Publication number: 20210323812
    Abstract: A sensor device includes a sensor chip with a micro-electromechanical systems (MEMS) structure, wherein the MEMS structure is arranged at a main surface of the sensor chip, and a gas-permeable cover arranged over the main surface of the sensor chip, which covers the MEMS structure and forms a cavity above the MEMS structure.
    Type: Application
    Filed: March 30, 2021
    Publication date: October 21, 2021
    Applicant: Infineon Technologies AG
    Inventors: Rainer Markus SCHALLER, Klaus ELIAN, Horst THEUSS
  • Publication number: 20210325454
    Abstract: The disclosure describes techniques for detecting failures or performance degradation of a device including an integrated circuit (IC) components in the field by including additional contacts, i.e. terminals, along with functional contacts of the circuit used for connecting the circuit to a system in which the circuit is a part. These additional contacts may be internal external to the package surface and may be used to measure dynamic changing electrical characteristics over time e.g. voltage, current, capacity, temperature and impedance. These electrical characteristics may be representative of one or more failure modes and may be treated as indicator for device state-of-health (SOH).
    Type: Application
    Filed: April 15, 2020
    Publication date: October 21, 2021
    Inventors: Klaus Elian, Rainer Markus Schaller
  • Publication number: 20210302474
    Abstract: A sensor apparatus comprises an electrically conductive chip carrier comprising a busbar, a first connection and a second connection, and a differential magnetic field sensor chip which is arranged on the chip carrier and has two sensor elements. The form of the busbar is such that a measurement current path running from the first connection to the second connection through the busbar comprises a main current path and a bypass current path, wherein the main current path and the bypass current path run parallel to one another, and a bypass current flowing through the bypass current path is less than a main current flowing through the main current path. The magnetic field sensor chip is configured to capture a magnetic field induced by the bypass current.
    Type: Application
    Filed: March 30, 2021
    Publication date: September 30, 2021
    Inventors: Klaus ELIAN, Rainer Markus SCHALLER, Volker STRUTZ
  • Publication number: 20210300749
    Abstract: A sensor package comprises a MEMS sensor chip, a cover arranged over a first main surface of the MEMS sensor chip, said cover being fabricated from a mold compound, and an electrical through contact extending through the cover and to electrically couple the sensor package to a circuit board arranged over the cover.
    Type: Application
    Filed: March 16, 2021
    Publication date: September 30, 2021
    Inventors: Rainer Markus SCHALLER, Jochen DANGELMAIER
  • Patent number: 11105776
    Abstract: A detector module is disclosed. In one example, the detector module is for a photo-acoustic gas sensor and comprises a first substrate made of a semiconductor material and comprising a first surface and a second surface opposite to the first surface, a second substrate comprising a third surface, a fourth surface opposite to the third surface, and a first recess formed in the fourth surface. The second substrate is connected with its fourth surface to the first substrate so that the first recess forms an airtight-closed first cell which is filled with a reference gas and a pressure sensitive element comprising a membrane disposed in contact with the reference gas. The detector module is further configured such that a beam of light pulses passes through the first substrate and thereby enters the first cell.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 31, 2021
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Rainer Markus Schaller
  • Patent number: 11073572
    Abstract: A current sensor device may include a routable molded lead frame that includes a molded substrate. The current sensor device may include a conductor and a semiconductor chip mounted to the molded substrate. The semiconductor chip may include a magnetic field sensor that is galvanically isolated from the conductor by the molded substrate and is configured to sense a magnetic field created by current flowing through the conductor. The current sensor device may include one or more leads configured to output a signal generated by the semiconductor chip. The one or more leads may be galvanically isolated from the conductor by the molded substrate.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: July 27, 2021
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Rainer Markus Schaller
  • Publication number: 20210181151
    Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 17, 2021
    Applicant: Infineon Technologies AG
    Inventors: Rainer Markus SCHALLER, Jochen DANGELMAIER, Matthias EBERL, Simon GASSNER, Franz JOST, Stefan KOLB, Horst THEUSS
  • Publication number: 20210181158
    Abstract: A photoacoustic detector unit comprises a housing having an opening, and also a photoacoustic transducer designed to convert optical radiation into at least one from a pressure signal or a heat signal. The photoacoustic transducer covers the opening of the housing, such that the photoacoustic transducer and the housing form an acoustically tight cavity. A pressure pick-up is arranged in the acoustically tight cavity.
    Type: Application
    Filed: December 1, 2020
    Publication date: June 17, 2021
    Inventors: Rainer Markus SCHALLER, Matthias EBERL, Simon GASSNER, Franz JOST, Stefan KOLB
  • Publication number: 20210088600
    Abstract: A sensor device comprises a busbar, a dielectric arranged on the busbar, and a sensor chip arranged on the dielectric, wherein the sensor chip is designed to measure a magnetic field induced by an electric current flowing through the busbar, wherein the surface of the dielectric facing toward the busbar is spaced from the busbar in an area along the entire periphery of the dielectric.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 25, 2021
    Inventors: Juergen HOEGERL, Rainer Markus SCHALLER, Volker STRUTZ
  • Publication number: 20210063445
    Abstract: A sensor device comprises a dielectric substrate, a busbar mechanically connected to the dielectric substrate, a cavity formed in the dielectric substrate, and a sensor chip arranged in the cavity, wherein the sensor chip is designed to detect a magnetic field induced by an electric current flowing through the busbar, wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar.
    Type: Application
    Filed: August 24, 2020
    Publication date: March 4, 2021
    Inventors: Rainer Markus SCHALLER, Juergen HOEGERL, Volker STRUTZ