Abstract: A micromechanical component and a method for producing a micromechanical component are described. The component has: a frame; a plate spring that is connected to the frame and that has a front side and a rear side facing away from the front side; a mirror element that is situated on the front side of the plate spring and is connected to the front side of the plate spring in such a way that the mirror element is suspended on the frame so as to be capable of displacement; and at least one piezoelectric strip that is connected to the rear side of the plate spring; the plate spring being elastically deformable through the application of an electrical voltage to the at least one piezoelectric strip in order to displace the mirror element.

Abstract: A micromechanical component includes a mounting, and a mirror plate which is adjustable with respect to the mounting about at least one rotational axis and which has a mirror side and a rear side which faces away from the mirror side. The mirror plate is connected to the mounting at least via four springs. Each of the four springs extends partially along the rear side of the mirror plate and is connected to the mirror plate via one support post each, which in each case contacts an anchoring area situated on the rear side. Also described is a micromirror device, as well as a manufacturing method for a micromechanical component.

Abstract: A micromechanical structure includes a substrate having an upper side and a lower side, the substrate having a first region and a second region adjacent thereto, the upper side being fashioned in the first region as a mirror region that reflects light. In the second region on the upper side of the substrate, a network-type structure and/or a web-type structure is fashioned, such that the second region is essentially non-light-reflective.

Abstract: A mechanical component has: a mounting; a movable part which, with the aid of at least one first spring and one second spring, is connected to the mounting in such a way that the movable part is movable about a rotational axis extending through a first anchoring area of the first spring on the mounting and a second anchoring area of the second spring on the mounting; a first sensor device with at least one first resistor which is situated on and/or in the first spring; and a second sensor device with at least one second resistor situated on and/or in the second spring. The first sensor device includes a first Wheatstone half bridge and the second sensor device includes a second Wheatstone half bridge. The first and second Wheatstone half bridges are connected to form a Wheatstone full bridge.

Abstract: An electrical device, particularly a control unit, having at least one joint having a first joining partner, especially a sleeve, and a second joining partner, especially a pin, the joint between the two joining partners having a junction ; at least at the junction an at least partially solidified lubricant being present. Furthermore, in a method for lubricating a joint of an electrical device, the joint having a first joining partner, particularly a sleeve, and a second joining partner, particularly a pin; in a step one of the joining partners being wetted with a lubricant, in a following step the joining partner wetted with the lubricant being joined to the other joining partner and the lubricant subsequently solidifying.

Abstract: A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the functional wafer. the cap wafer is joined at the glass substrate to the functional wafer by anodic bonding. the electrical contact surface is disposed on a side of the functional wafer facing the cap wafer, and the cap wafer has at least one recess, such that an access is provided to the electrical contact surface. A method for encapsulating a micromechanical component having a cap wafer, by anodically bonding the cap wafer to a functional wafer.

Abstract: A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the functional wafer. The cap wafer is joined at the glass substrate to the functional wafer by anodic bonding. The electrical contact surface is disposed on a side of the functional wafer facing the cap wafer, and the cap wafer has at least one recess, such that an access is provided to the electrical contact surface. A method for encapsulating a micromechanical component having a cap wafer, by anodically bonding the cap wafer to a functional wafer.

Abstract: A preparation having increased in vivo tolerability comprising a glycosyl-Y[--C(.dbd.Y)--X--].sub.p --W(R).sub.n --X--C(.dbd.Y)-active compound, sugar or sugar alcohol and, optionally divalent ions, and a pharmaceutically tolerable carrier.

Abstract: Compounds of the formula Iglycosyl-Y?--C(.dbd.Y)--X--!.sub.p --W(R).sub.n --Z--C(.dbd.Y)-active compound (I)are described which are suitable for the treatment of carcinomatous diseases, autoimmune diseases and chronic inflammatory diseases such as rheumatoid arthritis.

Abstract: A method for self-crimping of S/S bi-component fibers on a fiber line includes the steps of main drawing, post-drawing on a cold drawing unit, water application in the tensed state and relaxation at the dryer inlet in the compact closed state, which results in fibers with a novel .OMEGA.-shaped crimping structure.