Abstract: A sensor including a micro-bridge structure, wherein the micro-bridge structure comprises a concave geometry, a first electrode on a surface of the micro-bridge structure, a second electrode on the surface of the micro-bridge structure, and a chemical sensing material coupled to the micro-bridge structure overlying the first electrode and the second electrode and exposed to an environment. The chemical sensing material overlays the first electrode and the second electrode and is within the concave geometry of the micro-bridge structure such that the chemical sensing material settles into the concave geometry of the micro-bridge structure during fabrication of the sensor, and wherein the chemical sensing material has an electrical resistance responsive to a concentration of gas in the environment.

Abstract: A polymer material is contained in a sensing film of a sensor element having a quartz plate, an electrode made of a metal film provided on the quartz plate, and a sensing film provided on the electrode, and has a structural unit that contains one or more ethylene unsaturated bonds and is originated from a compound containing one or more functional groups reactive to a gas.

Abstract: A gas sensor includes a quartz crystal unit and a sensitive layer formed on the quartz crystal unit and configured to adsorb a gas to be detected, wherein the sensitive layer is porous, and has a particle skeleton made of a plurality of conductive polymer particles and a polyelectrolyte that is at least partially disposed between the adjacent conductive polymer particles.

Abstract: A sensing material for detecting hydrogen sulfide capable of detecting hydrogen sulfide even having a low concentration, a hydrogen sulfide-sensitive layer containing the sensing material for detecting hydrogen sulfide, and a metal oxide semiconductor-type gas sensor having the hydrogen sulfide-sensitive layer are provided. The sensing material for detecting hydrogen sulfide includes CuFe2O4-type complex oxide (W). The CuFe2O4-type complex oxide (W) contains, as a main component (W1), 35.0 to 49.5 mol % of iron oxide in terms of Fe2O3 and 50.5 to 65 mol % of copper oxide in terms of CuO, and an average particle diameter of particles is 3 ?m or less.

Abstract: The present invention relates to a method for producing a rare earth sintered magnet including the steps of: molding a mixture of magnetic powder containing a rare earth compound and oil-extended rubber containing oil and rubber to produce a molded body; removing the oil-extended rubber from the molded body; and calcining the molded body from which the oil-extended rubber is removed to produce a rare earth sintered magnet 10.

Abstract: A method for producing covered particles, comprising: a mixing step of mixing a fluid containing particles comprising at least one type of substance selected from among metals, metal oxides and ceramics, a silsesquioxane having a functional group with an affinity for carbon dioxide, and supercritical carbon dioxide; and a covering step of reducing pressure of the fluid to gasify the supercritical carbon dioxide, while adhering the silsesquioxane onto the particles, and thereby obtaining covered particles comprising the particles and silsesquioxane covering the particles.

Abstract: The present invention relates to a method for producing a rare earth sintered magnet including the steps of: molding a mixture of magnetic powder containing a rare earth compound and oil-extended rubber containing oil and rubber to produce a molded body; removing the oil-extended rubber from the molded body; and calcining the molded body from which the oil-extended rubber is removed to produce a rare earth sintered magnet 10.

Abstract: A laminated ceramic electronic component includes a ceramic substrate, an internal electrode, and a buffer layer. The ceramic substrate includes a protective layer and a functional layer. The protective layer is disposed on at least one side of the functional layer. The internal electrode is embedded in the functional layer. The buffer layer is embedded in the protective layer and has a different burning shrinkage from the ceramic substrate.

Abstract: A laminated ceramic electronic component has a plurality of conductive layers embedded in a ceramic substrate. The laminated ceramic electronic component includes: a functional area composed of the plurality of conductive layers and ceramic layers interposed therebetween; and a protective area formed around the functional area to have a ring-like cross section. The laminated ceramic electronic component satisfies the following condition: 0<t/Wg?0.80, where t represents a wall thickness of the protective area in a vertical direction, and Wg represents a wall thickness of the protective area in a transverse direction.

Abstract: Internal electrode layers are superimposed in a dielectric substrate 1 at intervals. Step absorption layers are respectively provided on lateral sides of the internal electrode layers. A side portion of the internal electrode layer forms an inclined surface, and the step absorption layer is superimposed so as to partially overlap the inclined surface of the internal electrode layer. This is also applied to the other internal electrode layers and step absorption layers.

Abstract: A laminated ceramic electronic component has a plurality of conductive layers embedded in a ceramic substrate. The laminated ceramic electronic component includes: a functional area composed of the plurality of conductive layers and ceramic layers interposed therebetween; and a protective area formed around the functional area to have a ring-like cross section. The laminated ceramic electronic component satisfies the following condition: 0<t/Wg?0.80, where t represents a wall thickness of the protective area in a vertical direction, and Wg represents a wall thickness of the protective area in a transverse direction.

Abstract: By a production method for producing a multilayer ceramic electronic device including dielectric layers and internal electrode layers comprising the steps of forming a green sheet to be said dielectric layer after firing, forming a pre-fired electrode layer to be said internal electrode layer after firing in a predetermined pattern on said green sheet by using a conductive material paste, forming a green chip by successively stacking said green sheets and said pre-fired electrode layers, and firing said green chip: wherein the conductive material paste for forming said pre-fired electrode layer is composed at least of conductive material particles, a first common material composed of ceramic powder and a second common material composed of ceramic powder having a larger average particle diameter than that of said first common material; an average particle diameter of said first common material is 1/20 to ½ of an average particle diameter of said conductive material particles; and the average particle diameter

Abstract: A laminated electronic component includes a ceramic body having an inner portion and a pair of outer portions disposed above and below the inner portion and a pair of external electrodes disposed on lateral sides of the ceramic body. A plurality of internal electrodes are embedded in the inner portion and alternately connected to the external electrodes. At least two layers of dummy electrodes are embedded in at least one of the outer portions and each connected to one of the external electrodes. An innermost one of the dummy electrodes has a same polarity as an adjacent outermost one of the internal electrodes. The dummy electrodes include at least one pair of adjacent dummy electrodes of opposite polarities.

Abstract: A laminated electronic component includes a ceramic body having an inner portion and a pair of outer portions disposed above and below the inner portion and a pair of external electrodes disposed on lateral sides of the ceramic body. A plurality of internal electrodes are embedded in the inner portion and alternately connected to the external electrodes. At least two layers of dummy electrodes are embedded in at least one of the outer portions and each connected to one of the external electrodes. An innermost one of the dummy electrodes has a same polarity as an adjacent outermost one of the internal electrodes. The dummy electrodes include at least one pair of adjacent dummy electrodes of opposite polarities.

Abstract: A multilayer electronic component comprises an inner multilayer portion and a pair of outer multilayer portions. The inner multilayer portion includes a plurality of first ceramic layers and a plurality of internal circuit element conductors which are alternately laminated and contain a glass component. A component amount ratio of an amount of the glass component in the second ceramic layers to an amount of a principal component of the second ceramic layers is larger than a component amount ratio of an amount of the glass component in the first ceramic layers to an amount of a principal component of the first ceramic layers.

Abstract: A laminated ceramic electronic component includes a ceramic substrate, an internal electrode, and a buffer layer. The ceramic substrate includes a protective layer and a functional layer. The protective layer is disposed on at least one side of the functional layer. The internal electrode is embedded in the functional layer. The buffer layer is embedded in the protective layer and has a different burning shrinkage from the ceramic substrate.

Abstract: Internal electrode layers are superimposed in a dielectric substrate 1 at intervals. Step absorption layers are respectively provided on lateral sides of the internal electrode layers. A side portion of the internal electrode layer forms an inclined surface, and the step absorption layer is superimposed so as to partially overlap the inclined surface of the internal electrode layer. This is also applied to the other internal electrode layers and step absorption layers.