Patents by Inventor Rajendra C. Dias

Rajendra C. Dias has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9786517
    Abstract: Introducing an underfill material over contact pads on a surface of an integrated circuit substrate; and ablating the introduced underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation. A method including first ablating an underfill material to expose an area of contact pads on a substrate using temporally coherent electromagnetic radiation; introducing a solder to the exposed area of the contact pads; and second ablating the underfill material using temporally coherent electromagnetic radiation. A method including introducing an underfill material over contact pads on a surface of an integrated circuit substrate; defining an opening in the underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation; introducing a solder material to the exposed area of the contact pads; and after introducing the solder, removing the sacrificial material.
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: October 10, 2017
    Assignee: Intel Corporation
    Inventors: Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui, Tyler N. Osborn, Amram Eitan, Timothy A. Gosselin
  • Publication number: 20170287846
    Abstract: Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include substrate including electrical connection circuitry therein, ground circuitry on, or at least partially in the substrate, the ground circuitry at least partially exposed by a surface of the substrate, a die electrically connected to the connection circuitry and the ground circuitry, the die on the substrate, a conductive material on a die backside, and a conductive paste or one or more wires electrically connected to the ground circuitry and the conductive material.
    Type: Application
    Filed: March 31, 2016
    Publication date: October 5, 2017
    Inventors: Rajendra C. Dias, Mitul B. Modi
  • Publication number: 20170287847
    Abstract: Apparatus and methods are provided for an integrated circuit package that includes an integrated EMI shield. In an example, an integrated circuit package can include an integrated circuit mounted to a substrate via connections on the bottom surface of the integrated circuit, a conductive fence surrounding side surfaces of the integrated circuit, a conductive film coupled to the conductive fence, the film located above a top surface of the integrated circuit and coextensive with a footprint defined by the conductive fence.
    Type: Application
    Filed: April 1, 2016
    Publication date: October 5, 2017
    Inventors: Rajendra C. Dias, Robert L. Sankman, Joshua D. Heppner, Mitul B. Modi, Yoshihiro Tomita
  • Publication number: 20170287851
    Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
    Type: Application
    Filed: May 26, 2017
    Publication date: October 5, 2017
    Inventors: Anna M. Prakash, Reynaldo Alberto Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua David Heppner, Ann Jinyan Xu, Sriya Sanyal, Eric Jin Li
  • Publication number: 20170268971
    Abstract: Embodiments are generally directed to membrane test for mechanical testing of wearable devices. A mechanical testing system includes an actuation mechanism including a clamp to hold a membrane including stretchable electronics over an opening in the actuation mechanism, wherein the actuation mechanism is to apply pressure to the membrane through the opening; and a testing logic to control the application and release of pressure on the membrane by the actuation mechanism.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 21, 2017
    Inventors: Ravindranth V. MAHAJAN, Rajendra C. DIAS, Pramod MALATKAR, Steven A. KLEIN, Vijay SUBRAMANIA, Aleksandar ALEKSOV, Robert L. SANKMAN
  • Publication number: 20170271270
    Abstract: Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include a substrate including electrical connection circuitry therein, grounding circuitry on, or at least partially in the substrate, the grounding circuitry at least partially exposed from a surface of the substrate, a die electrically connected to the connection circuitry and the grounding circuitry, the die on the substrate, and a conductive foil or conductive film surrounding the die, the conductive foil or conductive film electrically connected to the grounding circuitry.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 21, 2017
    Inventors: Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar
  • Publication number: 20170269017
    Abstract: Embodiments are generally directed to air bladder based mechanical testing for stretchable electronics. An embodiment of a system includes an inflatable bladder to apply mechanical force to a stretchable electronics device by the inflation and deflation of the inflatable bladder; a valve unit to control fluid pressure applied to the inflatable bladder; and a control unit to control inflation and deflation of the inflatable bladder.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 21, 2017
    Inventors: Steven A. KLEIN, Rajendra C. DIAS, David C. MCCOY, Lars D. SKOGLUND, Vijay SUBRAMANIAN, Aleksander ALEKSOV, Pramod MALATKAR, Ravindranath V. MAHAJAN, Robert L. SANKMAN
  • Publication number: 20170268972
    Abstract: Embodiments are generally directed to a lateral expansion apparatus for mechanical testing of stretchable electronics. An embodiment of a system includes a compressible cylinder to apply mechanical forces to a stretchable electronics device by the compression and release of the compressible cylinder; a compression unit to compress to the compressible cylinder, wherein the compression unit is to apply a compression force in a direction along an axis of the compressible cylinder to generate lateral expansion of the compressible cylinder; and a testing logic to control compression and release of the compressible cylinder.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 21, 2017
    Inventors: Vijay Krishnan SUBRAMANIAN, Steven A. KLEIN, Rajendra C. DIAS, Pramod MALATKAR, Aleksandar ALEKSOV, Ravindranath V. MAHAJAN, Robert L. SANKMAN
  • Publication number: 20170250145
    Abstract: An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.
    Type: Application
    Filed: May 15, 2017
    Publication date: August 31, 2017
    Inventors: Rajendra C. Dias, Joshua D. Heppner, Mitul B. Modi, Anna M. Prakash
  • Patent number: 9721906
    Abstract: An electronic package that includes a substrate and a die attached to the substrate. A plurality of supports attached to the substrate adjacent to the die. At least one support in the plurality of supports is positioned adjacent to at least one corner of the die such that the at least one corner of the die is positioned adjacent to the at least one support. Other example forms relate to a method of fabricating an electronic package. The method includes securing a die to a substrate and securing a plurality of supports to the substrate such that at least one support is adjacent to at least one corner of the die.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: August 1, 2017
    Assignee: Intel Corporation
    Inventors: Manish Dubey, Rajendra C. Dias, Baris Bicen, Digvijay Raorane, Bharat P. Penmecha
  • Patent number: 9704811
    Abstract: An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: July 11, 2017
    Assignee: Intel Corporation
    Inventors: Rajendra C. Dias, Joshua D Heppner, Mitul B Modi, Anna M. Prakash
  • Publication number: 20170181275
    Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for gradient encapsulant protection of devices in stretchable electronic. For instance, in accordance with one embodiment, there is an apparatus with an electrical device on a stretchable substrate; one or more stretchable electrical interconnects coupled with the electrical device; one or more electrical components electrically coupled with the electrical device via the one or more stretchable electrical interconnects; and a gradient encapsulating material layered over and fully surrounding the electrical device and at least a portion of the one or more stretchable electrical interconnects coupled thereto, in which the gradient encapsulating material has an elastic modulus greater than the stretchable substrate and in which the elastic modulus of the gradient encapsulating material is less than the electrical device. Other related embodiments are disclosed.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Rajendra C. Dias, Manish Dubey, Tatyana N. Andryushchenko, Aleksandar Aleksov, David W. Staines
  • Publication number: 20170179040
    Abstract: An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.
    Type: Application
    Filed: December 22, 2015
    Publication date: June 22, 2017
    Inventors: Rajendra C. Dias, Joshua D. Heppner, Mitul B. Modi, Anna M. Prakash
  • Publication number: 20170179103
    Abstract: Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.
    Type: Application
    Filed: March 6, 2017
    Publication date: June 22, 2017
    Inventors: Aleksandar Aleksov, Mauro Kobrinsky, Johanna Swan, Rajendra C. Dias
  • Publication number: 20170179041
    Abstract: Semiconductor packages with electromagnetic interference (EMI) shielding and a method of manufacture therefor is disclosed. The semiconductor packages may house single electronic component or may be a system in a package (SiP) implementation. The EMI shielding may be provided on top of and along the periphery of the semiconductor package. The EMI shielding on the periphery may be formed of cured conductive ink or cured conductive paste disposed on sidewalls of molding that encapsulates the electronic component(s) provided on the semiconductor package. The vertical portions of the EMI shielding, including EMI shielding on the periphery may be formed by filling conductive ink in trenches formed in-situ with curing the molding. The top portion of the EMI shielding and the may additionally be cured conductive ink.
    Type: Application
    Filed: December 22, 2015
    Publication date: June 22, 2017
    Inventors: Rajendra C. Dias, Eric J. Li, Joshua D. Heppner
  • Patent number: 9685413
    Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: June 20, 2017
    Assignee: Intel Corporation
    Inventors: Anna M. Prakash, Reynaldo Alberto Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua David Heppner, Ann Jinyan Xu, Sriya Sanyal, Eric Jin Li
  • Patent number: 9591758
    Abstract: Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: March 7, 2017
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleks Aleksov, Mauro Kobrinsky, Johanna Swan, Rajendra C. Dias
  • Publication number: 20170062356
    Abstract: An electronic package that includes a substrate and a die attached to the substrate. A plurality of supports attached to the substrate adjacent to the die. At least one support in the plurality of supports is positioned adjacent to at least one corner of the die such that the at least one corner of the die is positioned adjacent to the at least one support. Other example forms relate to a method of fabricating an electronic package. The method includes securing a die to a substrate and securing a plurality of supports to the substrate such that at least one support is adjacent to at least one corner of the die.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 2, 2017
    Inventors: Manish Dubey, Rajendra C. Dias, Baris Bicen, Digvijay Raorane, Bharat P. Penmecha
  • Publication number: 20170018525
    Abstract: A method for attaching an integrated circuit (IC) to an IC package substrate includes forming a solder bump on a bond pad of an IC die, forming a solder-wetting protrusion on a bond pad of an IC package substrate, and bonding the solder bump of the IC die to the solder-wetting protrusion of the IC package substrate.
    Type: Application
    Filed: March 28, 2014
    Publication date: January 19, 2017
    Inventors: Rajendra C. Dias, Manish Dubey, Emre Armagan
  • Patent number: 9508660
    Abstract: A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a microelectronic die is incorporated into a microelectronic package. In one embodiment, a microelectronic die may include at least one substantially planar chamfering side extending between at least two adjacent sides of a microelectronic die. In another embodiment, a microelectronic die may include at least one substantially curved or arcuate chamfering side extending between at least two adjacent sides of a microelectronic die.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: November 29, 2016
    Assignee: Intel Corporation
    Inventors: Manish Dubey, Emre Armagan, Rajendra C. Dias, Lars D. Skoglund