Patents by Inventor Rajesh H. Turakhia
Rajesh H. Turakhia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11168189Abstract: The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a fiber material of a heat resistant fiber, such as a continuous fiber material or a discontinuous chopped fiber mat, infused with a thermosetting resin mixture comprising (i) at least one liquid epoxy resin; (ii) at least one epoxy novolac resin, (iii) dicyandiamide and (iv) and an adduct of a cycloaliphatic amine and a liquid epoxy resin, wherein the dicyandiamide is dissolved in the adduct of a cycloaliphatic amine and a liquid epoxy resin. The prepreg or fiber material has a shelf life of at least 30 days at ambient temperature and pressure before its Initial Tg (DSC) rises above 40° C.Type: GrantFiled: June 9, 2017Date of Patent: November 9, 2021Assignee: Dow Global Technologies LLCInventors: Bharati Balijepalli, David H. Bank, Rajesh H. Turakhia
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Publication number: 20200308356Abstract: The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a fiber material of a heat resistant fiber, such as a continuous fiber material or a discontinuous chopped fiber mat, infused with a thermosetting resin mixture comprising (i) at least one liquid epoxy resin; (ii) at least one epoxy novolac resin, (iii) dicyandiamide and (iv) and an adduct of a cycloaliphatic amine and a liquid epoxy resin, wherein the dicyandiamide is dissolved in the adduct of a cycloaliphatic amine and a liquid epoxy resin. The prepreg or fiber material has a shelf life of at least 30 days at ambient temperature and pressure before its Initial Tg (DSC) rises above 40° C.Type: ApplicationFiled: June 9, 2017Publication date: October 1, 2020Inventors: Bharati Balijepalli, David H. Bank, Rajesh H. Turakhia
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Patent number: 10392539Abstract: Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as ?40° C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.Type: GrantFiled: August 13, 2015Date of Patent: August 27, 2019Assignee: Dow Global Technologies LLCInventors: Gary L. Jialanella, Andreas Lutz, Eric E. Cole, Glenn G. Eagle, Rajesh H. Turakhia, Yanli Feng
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Publication number: 20170292049Abstract: Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as ?40° C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.Type: ApplicationFiled: August 13, 2015Publication date: October 12, 2017Inventors: Gary L. JIALANELLA, Andreas LUTZ, Eric E. COLE, Glenn G. EAGLE, Rajesh H. TURAKHIA, Yanli FENG
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Patent number: 9745409Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.Type: GrantFiled: November 1, 2011Date of Patent: August 29, 2017Assignee: BLUE CUBE IP LLCInventors: Rajesh H. Turakhia, Cui-ping Chen, Bill Z. Dellinger, Ludovic Valette, Itaru Kudose, Ha Q. Pham
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Patent number: 9656977Abstract: A polyamide composition comprising a reaction product of: a) an excess of a polyfunctional amine; b) a dimer fatty acid; and c) a monomer fatty acid is disclosed. The polyamide composition can be used as a hardener in epoxy resin formulations.Type: GrantFiled: October 22, 2013Date of Patent: May 23, 2017Assignee: Dow Global Technologies LLCInventors: Eric B. Ripplinger, Rajesh H. Turakhia
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Patent number: 9651189Abstract: The invention relates to a process comprising: (a) preparing a curable epoxy-anhydride thermoset composition; and (b) applying said curable epoxy-anhydride thermoset composition in a cured-in-place pipe rehabilitation process is disclosed. The cured-in-place pipe application utilized can generally be the ‘Inversion Installation Method,’ or the ‘Pull-in Installation Method’. The invention also relates to a cured-in-place pipe that is prepared by this process.Type: GrantFiled: June 22, 2012Date of Patent: May 16, 2017Assignee: BLUE CUBE IP LLCInventors: Krishnan Karunakaran, Rajesh H. Turakhia
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Patent number: 9469721Abstract: A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.Type: GrantFiled: December 11, 2013Date of Patent: October 18, 2016Assignee: BLUE CUBE IP LLCInventors: Rajesh H. Turakhia, Larissa Falsarella, Eva-Maria Michalski, Marcus Pfarherr, Carl J. Marshall, Jr., Bill Z. Dellinger, Felipe A. Donate
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Publication number: 20160168416Abstract: A flooring coating composition includes a coating agent that is a reaction product of an epoxy based formulation, the epoxy based formulation being at least one of an epoxy prepolymer formulation, an epoxy-silane hybrid formulation, and an epoxy thiol acrylate formulation. The coating agent in a cured state exhibits a first tan delta peak between a first temperature range of 75 C to 0 C and a second tan delta peak between a second temperature range of 20 C and 75 C, according to a tan delta plot over a range of temperatures. A value of the first tan delta peak and a value of the second tan delta peak each represents a ratio of a loss modulus of the coating agent and a storage modulus of the coating agent at a specific temperature within the range of temperatures, as measured according to dynamic mechanical thermal analysis. The values of the first and the second tan delta peaks are from 0.10 to 0.80.Type: ApplicationFiled: September 4, 2014Publication date: June 16, 2016Inventors: Venkat S Minnikanti, Marcus Pfarherr, Eva-Maria Michalski, Kamesh R. Vyakaranam, William H. Heath, Kwanho Chang, Rajesh H. Turakhia, Larissa Falsarella, Adam C. Colson
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Patent number: 9315664Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.Type: GrantFiled: April 29, 2014Date of Patent: April 19, 2016Assignee: Dow Global Technologies LLCInventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George C. Jacob, Marty J. Null
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Patent number: 9309354Abstract: A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species.Type: GrantFiled: June 6, 2012Date of Patent: April 12, 2016Assignee: Dow Global Technologies LLCInventors: Nigel Shields, Martin Reimers, Nikhil K. E. Verghese, Timothy A. Morley, Marty J. Null, Rajesh H. Turakhia
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Publication number: 20160024295Abstract: A hardener composition comprising: a) an epoxy-amine adduct of i) a novolac epoxy resin; and ii) a first amine and b) a modifier wherein the hardener has a viscosity in the range of from 50 to 20,000 mPa·s and wherein a cured epoxy thermoset comprising the hardener exhibits no more than 1% weight loss or gain after immersion in concentrated mineral acid for 7 days at a temperature in the range of from 25° C. to 130° C., is disclosed. The hardener composition can be used with an epoxy resin to form a curable composition.Type: ApplicationFiled: March 10, 2014Publication date: January 28, 2016Applicant: BLUE CUBE IP LLCInventors: Krishnan Karunakaran, Rajesh H. Turakhia, Eric B. Ripplinger
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Publication number: 20150315378Abstract: A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.Type: ApplicationFiled: December 11, 2013Publication date: November 5, 2015Inventors: Rajesh H. Turakhia, Larissa Falsarella, Eva-Maria Michalski, Marcus Pfarherr, Carl J. Marshall, JR., Bill Z. Dellinger, Felipe A. Donate
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Publication number: 20150252012Abstract: A polyamide composition comprising a reaction product of: a) an excess of a polyfunctional amine; b) a dimer fatty acid; and c) a monomer fatty acid is disclosed. The polyamide composition can be used as a hardener in epoxy resin formulations.Type: ApplicationFiled: October 22, 2013Publication date: September 10, 2015Inventors: Eric B. Ripplinger, Rajesh H. Turakhia
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Publication number: 20140357763Abstract: An epoxy system having a Part A and a Part B, where the Part A has an epoxy resin component present in a range of 20 weight percent (wt %) to 70 wt %, based on the total weight of the Part A; a flexibilizer present in a range from 20 wt % to 60 wt %, based on the total weight of the Part A; and a catalyst present in the range of 3 wt % to 7 wt % based on the total weight of the Part A, where the wt % of the components of the Part A of the epoxy system totals 100 wt %; and a Part B having a Mannich base hardener. Embodiments of the present disclosure also include a concrete structure that includes a reaction product of the epoxy system.Type: ApplicationFiled: December 21, 2012Publication date: December 4, 2014Applicant: Dow Global Technologies LLCInventors: Bharati Balijepalli, Rajesh H. Turakhia, Hemant A. Naik
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Publication number: 20140256856Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.Type: ApplicationFiled: November 1, 2011Publication date: September 11, 2014Applicant: Dow Global Technologies LLCInventors: Rajesh H. Turakhia, Cui-ping Chen, Bill Z. Dellinger, Ludovic Valette, Itaru Kudose, Ha Q. Pham
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Publication number: 20140235792Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.Type: ApplicationFiled: April 29, 2014Publication date: August 21, 2014Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George C. Jacob, Marty J. Null
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Publication number: 20140213698Abstract: A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species.Type: ApplicationFiled: June 6, 2012Publication date: July 31, 2014Inventors: Nigel Shields, Martin Reimers, Nikhil K. E. Verghese, Timothy A. Morley, Marty J. Null, Rajesh H. Turakhia
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Patent number: 8742018Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.Type: GrantFiled: January 5, 2009Date of Patent: June 3, 2014Assignee: Dow Global Technologies LLCInventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George Jacob, Marty J. Null
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Publication number: 20140109980Abstract: The invention relates to a process comprising: (a) preparing a curable epoxy-anhydride thermoset composition; and (b) applying said curable epoxy-anhydride thermoset composition in a cured-in-place pipe rehabilitation process is disclosed. The cured-in-place pipe application utilized can generally be the ‘Inversion Installation Method,’ or the ‘Pull-in Installation Method’. The invention also relates to a cured-in-place pipe that is prepared by this process.Type: ApplicationFiled: June 22, 2012Publication date: April 24, 2014Applicant: DOW GLOBAL TECHNOLOGIES LLCInventors: Krishnan Karunakaran, Rajesh H. Turakhia