Abstract: The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a fiber material of a heat resistant fiber, such as a continuous fiber material or a discontinuous chopped fiber mat, infused with a thermosetting resin mixture comprising (i) at least one liquid epoxy resin; (ii) at least one epoxy novolac resin, (iii) dicyandiamide and (iv) and an adduct of a cycloaliphatic amine and a liquid epoxy resin, wherein the dicyandiamide is dissolved in the adduct of a cycloaliphatic amine and a liquid epoxy resin. The prepreg or fiber material has a shelf life of at least 30 days at ambient temperature and pressure before its Initial Tg (DSC) rises above 40° C.

Abstract: The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a fiber material of a heat resistant fiber, such as a continuous fiber material or a discontinuous chopped fiber mat, infused with a thermosetting resin mixture comprising (i) at least one liquid epoxy resin; (ii) at least one epoxy novolac resin, (iii) dicyandiamide and (iv) and an adduct of a cycloaliphatic amine and a liquid epoxy resin, wherein the dicyandiamide is dissolved in the adduct of a cycloaliphatic amine and a liquid epoxy resin. The prepreg or fiber material has a shelf life of at least 30 days at ambient temperature and pressure before its Initial Tg (DSC) rises above 40° C.

Abstract: Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as ?40° C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.

Abstract: Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as ?40° C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.

Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.

Abstract: A polyamide composition comprising a reaction product of: a) an excess of a polyfunctional amine; b) a dimer fatty acid; and c) a monomer fatty acid is disclosed. The polyamide composition can be used as a hardener in epoxy resin formulations.

Abstract: The invention relates to a process comprising: (a) preparing a curable epoxy-anhydride thermoset composition; and (b) applying said curable epoxy-anhydride thermoset composition in a cured-in-place pipe rehabilitation process is disclosed. The cured-in-place pipe application utilized can generally be the ‘Inversion Installation Method,’ or the ‘Pull-in Installation Method’. The invention also relates to a cured-in-place pipe that is prepared by this process.

Abstract: A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.

Abstract: A flooring coating composition includes a coating agent that is a reaction product of an epoxy based formulation, the epoxy based formulation being at least one of an epoxy prepolymer formulation, an epoxy-silane hybrid formulation, and an epoxy thiol acrylate formulation. The coating agent in a cured state exhibits a first tan delta peak between a first temperature range of 75 C to 0 C and a second tan delta peak between a second temperature range of 20 C and 75 C, according to a tan delta plot over a range of temperatures. A value of the first tan delta peak and a value of the second tan delta peak each represents a ratio of a loss modulus of the coating agent and a storage modulus of the coating agent at a specific temperature within the range of temperatures, as measured according to dynamic mechanical thermal analysis. The values of the first and the second tan delta peaks are from 0.10 to 0.80.

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species.

Abstract: A hardener composition comprising: a) an epoxy-amine adduct of i) a novolac epoxy resin; and ii) a first amine and b) a modifier wherein the hardener has a viscosity in the range of from 50 to 20,000 mPa·s and wherein a cured epoxy thermoset comprising the hardener exhibits no more than 1% weight loss or gain after immersion in concentrated mineral acid for 7 days at a temperature in the range of from 25° C. to 130° C., is disclosed. The hardener composition can be used with an epoxy resin to form a curable composition.

Abstract: A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.

Abstract: A polyamide composition comprising a reaction product of: a) an excess of a polyfunctional amine; b) a dimer fatty acid; and c) a monomer fatty acid is disclosed. The polyamide composition can be used as a hardener in epoxy resin formulations.

Abstract: An epoxy system having a Part A and a Part B, where the Part A has an epoxy resin component present in a range of 20 weight percent (wt %) to 70 wt %, based on the total weight of the Part A; a flexibilizer present in a range from 20 wt % to 60 wt %, based on the total weight of the Part A; and a catalyst present in the range of 3 wt % to 7 wt % based on the total weight of the Part A, where the wt % of the components of the Part A of the epoxy system totals 100 wt %; and a Part B having a Mannich base hardener. Embodiments of the present disclosure also include a concrete structure that includes a reaction product of the epoxy system.

Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species.

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: The invention relates to a process comprising: (a) preparing a curable epoxy-anhydride thermoset composition; and (b) applying said curable epoxy-anhydride thermoset composition in a cured-in-place pipe rehabilitation process is disclosed. The cured-in-place pipe application utilized can generally be the ‘Inversion Installation Method,’ or the ‘Pull-in Installation Method’. The invention also relates to a cured-in-place pipe that is prepared by this process.