Patents by Inventor Ralph Nuzzo
Ralph Nuzzo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140373898Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: March 13, 2014Publication date: December 25, 2014Applicants: Semprius, Inc., The Board of Trustees of the University of IllinoisInventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
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Patent number: 8865489Abstract: Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.Type: GrantFiled: May 12, 2010Date of Patent: October 21, 2014Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Ralph Nuzzo, Hoon-sik Kim, Eric Brueckner, Sang Il Park, Rak Hwan Kim
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Publication number: 20140216524Abstract: Provided are solar cells, photovoltaics and related methods for making solar cells, wherein the solar cell is made of ultrathin solar grade or low quality silicon. In an aspect, the invention is a method of making a solar cell by providing a solar cell substrate having a receiving surface and assembling a printable semiconductor element on the receiving surface of the substrate via contact printing. The semiconductor element has a thickness that is less than or equal to 100 ?m and, for example, is made from low grade Si.Type: ApplicationFiled: February 5, 2014Publication date: August 7, 2014Inventors: John A. ROGERS, Angus A. ROCKETT, Ralph NUZZO, Jongseung YOON, Alfred BACA
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Patent number: 8722458Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: May 4, 2011Date of Patent: May 13, 2014Assignees: The Board of Trustees of the University of Illinois, Semprius, Inc.Inventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred J. Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
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Patent number: 8679888Abstract: Provided are solar cells, photovoltaics and related methods for making solar cells, wherein the solar cell is made of ultrathin solar grade or low quality silicon. In an aspect, the invention is a method of making a solar cell by providing a solar cell substrate having a receiving surface and assembling a printable semiconductor element on the receiving surface of the substrate via contact printing. The semiconductor element has a thickness that is less than or equal to 100 ?m and, for example, is made from low grade Si.Type: GrantFiled: September 24, 2009Date of Patent: March 25, 2014Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Angus A. Rockett, Ralph Nuzzo, Jongseung Yoon, Alfred Baca
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Patent number: 8252191Abstract: The present invention provides a method of sub-micron decal transfer lithography. The method includes forming a first pattern in a surface of a first silicon-containing elastomer, bonding at least a portion of the first pattern to a substrate, and etching a portion of at least one of the first silicon-containing elastomer and the substrate.Type: GrantFiled: May 5, 2006Date of Patent: August 28, 2012Assignee: Dow Corning CorporationInventors: Ahn Heejoon, Ralph Nuzzo, Anne Shim
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Publication number: 20110277813Abstract: Provided are solar cells, photovoltaics and related methods for making solar cells, wherein the solar cell is made of ultrathin solar grade or low quality silicon. In an aspect, the invention is a method of making a solar cell by providing a solar cell substrate having a receiving surface and assembling a printable semiconductor element on the receiving surface of the substrate via contact printing. The semiconductor element has a thickness that is less than or equal to 100 ?m and, for example, is made from low grade Si.Type: ApplicationFiled: September 24, 2009Publication date: November 17, 2011Inventors: John A. Rogers, Angus A. Rockett, Ralph Nuzzo, Jongseung Yoon, Alfred Baca
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Publication number: 20110266561Abstract: The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: May 4, 2011Publication date: November 3, 2011Inventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred J. BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung-Cho KO, Mark STOYKOVICH, Jongseung YOON
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Patent number: 7972875Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: October 31, 2007Date of Patent: July 5, 2011Assignee: The Board of Trustees of the University of IllinoisInventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred J. Baca, Michael Motala, Jong-Hyun Ahn, Sang-II Park, Chang-Jae Yu, Heung-Cho Ko, Mark Stoykovich, Jongseung Yoon
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Publication number: 20100317132Abstract: Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.Type: ApplicationFiled: May 12, 2010Publication date: December 16, 2010Inventors: John A. Rogers, Ralph Nuzzo, Hoon-sik Kim, Eric Brueckner, Sang Il Park, Rak Hwan Kim
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Publication number: 20100283069Abstract: The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: October 31, 2007Publication date: November 11, 2010Inventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred J. Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung-Cho Ko, Mark Stoykovich, Jongseung Yoon
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Publication number: 20080190888Abstract: The present invention provides a method of sub-micron decal transfer lithography. The method includes forming a first pattern in a surface of a first silicon-containing elastomer, bonding at least a portion of the first pattern to a substrate, and etching a portion of at least one of the first silicon-containing elastomer and the substrate.Type: ApplicationFiled: May 5, 2006Publication date: August 14, 2008Inventors: Ahn Heejoon, Ralph Nuzzo, Anne Shim
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Publication number: 20080108171Abstract: Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.Type: ApplicationFiled: September 20, 2007Publication date: May 8, 2008Inventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Heung Cho Ko, Jongseung Yoon, Etienne Menard, Alfred Baca
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Publication number: 20070032089Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: ApplicationFiled: June 1, 2006Publication date: February 8, 2007Applicant: The Board of Trustees of the University of IllinoisInventors: Ralph Nuzzo, John Rogers, Etienne Menard, Keon Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Ko
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Publication number: 20060084012Abstract: A method of making a microstructure includes selectively activating a portion of a surface of a silicon-containing elastomer, contacting the activated portion with a substance, and bonding the activated portion and the substance, such that the activated portion of the surface and the substance in contact with the activated portion are irreversibly attached. The selective activation may be accomplished by positioning a mask on the surface of the silicon-containing elastomer, and irradiating the exposed portion with UV radiation.Type: ApplicationFiled: October 14, 2004Publication date: April 20, 2006Inventors: Ralph Nuzzo, William Childs, Michael Motala, Keon Lee
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Publication number: 20050233198Abstract: A microfluidic electrochemical reactor includes an electrode and one or more microfluidic channels on the electrode, where the microfluidic channels are covered with a membrane containing a gas permeable polymer. The distance between the electrode and the membrane is less than 500 micrometers. The microfluidic electrochemical reactor can provide for increased reaction rates in electrochemical reactions using a gaseous reactant, as compared to conventional electrochemical cells. Microfluidic electrochemical reactors can be incorporated into devices for applications such as fuel cells, electrochemical analysis, microfluidic actuation, pH gradient formation.Type: ApplicationFiled: March 8, 2005Publication date: October 20, 2005Inventors: Ralph Nuzzo, Svetlana Mitrovski
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Publication number: 20050199584Abstract: A method of making a microstructure includes forming a pattern in a surface of a silicon-containing elastomer, oxidizing the pattern, contacting the pattern with a substrate; and bonding the oxidized pattern and the substrate such that the pattern and the substrate are irreversibly attached. The silicon-containing elastomer may be removably attached to a transfer pad.Type: ApplicationFiled: August 4, 2004Publication date: September 15, 2005Inventors: Ralph Nuzzo, William Childs