Patents by Inventor Randall Stutzman

Randall Stutzman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flow through cooling assemblies for conduction-cooled circuit modules
    Publication number: 20070070601
    Abstract: A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.
    Type: Application
    Filed: September 27, 2005
    Publication date: March 29, 2007
    Applicant: Lockheed Martin Corporation
    Inventors: David Vos, Randall Stutzman, Jon Larcheveque, Eugene Urda
  • Method of packaging a high performance chip
    Patent number: 6655020
    Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: December 2, 2003
    Assignee: International Business Machines Corporation
    Inventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
  • High performance chip packaging and method
    Patent number: 6552266
    Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: April 22, 2003
    Assignee: International Business Machines Corporation
    Inventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
  • High performance chip packaging and method
    Patent number: 6552264
    Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board.
    Type: Grant
    Filed: March 11, 1998
    Date of Patent: April 22, 2003
    Assignee: International Business Machines Corporation
    Inventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
  • HIGH PERFORMANCE CHIP PACKAGING AND METHOD
    Publication number: 20020053449
    Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.
    Type: Application
    Filed: March 11, 1998
    Publication date: May 9, 2002
    Inventors: TIMOTHY F. CARDEN, GLENN O. DEARING, KISHOR V. DESAI, STEPHEN R. ENGLE, RANDALL STUTZMAN, GEORGE H. THIEL
  • High performance chip packaging and method
    Publication number: 20010009196
    Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.
    Type: Application
    Filed: January 26, 2001
    Publication date: July 26, 2001
    Inventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
  • High performance chip packaging and method
    Publication number: 20010009197
    Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.
    Type: Application
    Filed: January 26, 2001
    Publication date: July 26, 2001
    Inventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel