Patents by Inventor Randolph E. Crutchfield
Randolph E. Crutchfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230420383Abstract: Various embodiments of an integrated circuit package are disclosed. The package includes an integrated circuit having an integrated circuit contact disposed on a first major surface of the integrated circuit; a first passivation layer disposed on the first major surface of the integrated circuit and over the integrated circuit contact; and a redistribution layer disposed on the first passivation layer. The redistribution layer includes a conductive trace and a shield region that define a plane of the redistribution layer. The package further includes a second passivation layer disposed on the redistribution layer, and a patterned conductive layer disposed on the second passivation layer and including a conductive trace. A portion of the shield region of the redistribution layer is disposed between the conductive trace of the patterned conductive layer and the integrated circuit along an axis that is substantially orthogonal to the first major surface of the integrated circuit.Type: ApplicationFiled: June 22, 2022Publication date: December 28, 2023Inventors: Randolph E. Crutchfield, Jeff M. Wheeler
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Patent number: 11569178Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.Type: GrantFiled: May 19, 2021Date of Patent: January 31, 2023Assignee: MEDTRONIC, INC.Inventors: Chunho Kim, Mark R. Boone, Randolph E. Crutchfield
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Publication number: 20220088391Abstract: The disclosure describes capturing the cardiac tissue using current steering techniques with a multi-pole cardiac lead implanted near the cardiac tissue. The techniques may include current-controlled sources in an IMD to provide current regulation to the pacing pulses allowing direct stimulation through multiple electrode contacts with known current delivery to the tissue. This current steering technique may use a delivery current source coupled to a delivery electrode and a receiving current source coupled to a receiving electrode to steer the current to the desired tissue to be stimulated. In some examples, different electrode pairs may be paced sequentially or together. In other examples, two or more electrodes may be considered the “delivery electrodes” and two or more electrodes may be considered the “receiving electrodes.” In some examples a current-controlled source in the IMD may be implemented using a source degeneration circuit.Type: ApplicationFiled: September 2, 2021Publication date: March 24, 2022Inventors: Randolph E. Crutchfield, James J. St. Martin
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Patent number: 11213690Abstract: A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.Type: GrantFiled: June 15, 2012Date of Patent: January 4, 2022Assignee: Medtronic, Inc.Inventors: Mark R. Boone, Mohsen Askarinya, Randolph E. Crutchfield, Erik J. Herrmann, Mark S. Ricotta, Lejun Wang
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Publication number: 20210272909Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.Type: ApplicationFiled: May 19, 2021Publication date: September 2, 2021Inventors: Chunho Kim, Mark R. Boone, Randolph E. Crutchfield
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Patent number: 11031345Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.Type: GrantFiled: August 9, 2019Date of Patent: June 8, 2021Assignee: Medtronic, Inc.Inventors: Chunho Kim, Mark R. Boone, Randolph E. Crutchfield
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Patent number: 10737090Abstract: An external defibrillator system may include processing circuitry; signal generation circuitry communicatively coupled to the processing circuitry; and a plurality of electrodes, each including an electrode body electrically coupled to the signal generation circuitry and configured to deliver an electrical pulse therapy to a patient; and an electrolyte dispersal pad that includes a substrate defining a plurality of wells, each defining an opening; an electrolyte material, e.g., fluid, disposed within at least a portion of the plurality of wells; and a conductive material disposed over at least a portion of the openings and configured to retain the electrolyte material within the plurality of wells, where the processing circuitry is configured control the signal generation circuitry to pass a current pulse through a portion of the conductive material to fuse the portion of the conductive material to release the electrolyte material from at least one of the wells.Type: GrantFiled: July 11, 2017Date of Patent: August 11, 2020Assignee: Medtronic, Inc.Inventors: Randolph E. Crutchfield, Gerard A. Bast, David A. Cano, Lisa Anne Harness Mesias, Clark B. Norgaard, Mark E. Porter, Jerome Sims, II, Philip Timson
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Patent number: 10625087Abstract: Techniques are disclosed for modulating the generation of charge current by operational circuitry included in an implantable medical device (IMD) for delivery of an induction stimulation pulse waveform by the IMD. The modulation may include modulating a charging circuit of the operational circuitry to facilitate the regulation of the induction stimulation pulse waveform. The techniques include monitoring an electrical parameter of a charging path during the delivery of the induction stimulation pulse and modulating the charging circuit based on the monitored electrical parameter.Type: GrantFiled: April 24, 2014Date of Patent: April 21, 2020Assignee: Medtronic, Inc.Inventors: Randolph E. Crutchfield, Lonny V. Cabelka
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Publication number: 20200058592Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.Type: ApplicationFiled: August 9, 2019Publication date: February 20, 2020Inventors: Chunho KIM, Mark R. BOONE, Randolph E. CRUTCHFIELD
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Publication number: 20190015657Abstract: An external defibrillator system may include processing circuitry; signal generation circuitry communicatively coupled to the processing circuitry; and a plurality of electrodes, each including an electrode body electrically coupled to the signal generation circuitry and configured to deliver an electrical pulse therapy to a patient; and an electrolyte dispersal pad that includes a substrate defining a plurality of wells, each defining an opening; an electrolyte material, e.g., fluid, disposed within at least a portion of the plurality of wells; and a conductive material disposed over at least a portion of the openings and configured to retain the electrolyte material within the plurality of wells, where the processing circuitry is configured control the signal generation circuitry to pass a current pulse through a portion of the conductive material to fuse the portion of the conductive material to release the electrolyte material from at least one of the wells.Type: ApplicationFiled: July 11, 2017Publication date: January 17, 2019Inventors: Randolph E. Crutchfield, Gerard A. Bast, David A. Cano, Lisa Anne Harness Mesias, Clark B. Norgaard, Mark E. Porter, Jerome Sims, II, Philip Timson
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Patent number: 10159847Abstract: An implantable medical device includes a housing, a power source and an operational circuit that is coupled to the power source. The operational circuit includes a first electrode terminal and a second electrode terminal, an output circuit configured to deliver an electrical stimulation therapy through the first and second electrode terminals and a control circuit configured to evaluate an electrical parameter associated with the output circuit and to control generation of the electrical stimulation therapy responsive to a result of the evaluated parameter. Among other things, the implantable medical device may modify a parameter of the therapy delivery in response to a result of the evaluation.Type: GrantFiled: May 20, 2015Date of Patent: December 25, 2018Assignee: Medtronic, Inc.Inventors: Marshall J. Rasmussen, Lonny V. Cabelka, Randolph E. Crutchfield, Jon E. Zimmer
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Patent number: 9956422Abstract: Apparatus and methods for generating an induction waveform for performing threshold testing in an implantable medical device are disclosed. Such tests may be performed during the implant procedure, or during a device checkup procedure, or routinely during the lifetime of the device. The threshold test may include induction of an arrhythmia (such as ventricular fibrillation) followed by delivery of therapy at various progressively-increasing stimulation parameters to terminate the arrhythmia. As such, the capability to induce fibrillation within the device is desired. Induction of the arrhythmias may be accomplished via delivery of a relatively low energy shock or through delivery of an induction stimulation pulse to the cardiac tissue timed concurrently with the vulnerable period of the cardiac cycle.Type: GrantFiled: April 24, 2014Date of Patent: May 1, 2018Assignee: Medtronic, Inc.Inventors: Randolph E. Crutchfield, Lonny V. Cabelka, Mark R. Boone, Kevin P. Kuehn, Marshall J. Rasmussen
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Patent number: 9861827Abstract: An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled in a parallel configuration. The implantable medical device includes both a low power circuit that is selectively coupled between the first and second cells and a high power output circuit that is directly coupled to the first and second cells in a parallel configuration. An isolation circuit is coupled to the first cell, the second cell and the low power circuit to maintain a current isolation between the first cell and the second cell at least during delivery of current having a large magnitude to the high power output circuit.Type: GrantFiled: April 24, 2015Date of Patent: January 9, 2018Assignee: Medtronic, Inc.Inventors: Lonny V Cabelka, Mark R Boone, Randolph E Crutchfield, Kevin P Kuehn, John T Meador, John D Norton, Craig L Schmidt
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Patent number: 9750950Abstract: Implantable medical device systems of the present disclosure may include a subcutaneous implantable cardioverter defibrillator (SICD) that is powered by a multi-cell power source that is connected to a transformer and power conversion circuitry to charge one or more relatively small, but powerful, high voltage capacitors to provide a relatively high discharge voltage. The SICD includes electrical isolation for the multi-cell power source to protect against cross-charging between the cells during the operational lifetime of the SICD.Type: GrantFiled: September 3, 2015Date of Patent: September 5, 2017Assignee: Medtronic, Inc.Inventors: John D Norton, Andrew J Ries, Randolph E Crutchfield
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Patent number: 9724528Abstract: An implantable medical device includes a low-power circuit, a high-power circuit, and a dual-cell power source. The power source is coupled to a dual-transformer such that each cell is connected to only one of the transformers. Each transformer includes multiple windings and each of the windings is coupled to a capacitor, and the capacitors are all connected in a series configuration. The low power circuit is coupled to the power source and issues a control signal to control the delivery of charge from the power source to the plurality of capacitors through the first and second transformers.Type: GrantFiled: April 24, 2015Date of Patent: August 8, 2017Assignee: Medtronic, Inc.Inventors: Mark R Boone, Randolph E Crutchfield, Lonny V Cabelka, Kevin P Kuehn, John T Meador
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Patent number: 9643025Abstract: An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled to a transformer in a parallel configuration. The transformer includes multiple secondary windings and each of the windings is coupled to a capacitor that stores energy for delivery of a therapy to a patient. In accordance with embodiments of this disclosure, the low power circuit is configured to control simultaneous delivery of energy from each of the cells to a plurality of capacitors through the transformer.Type: GrantFiled: April 24, 2015Date of Patent: May 9, 2017Assignee: Medtronic, Inc.Inventors: Randolph E Crutchfield, Mark R Boone, Lonny V Cabelka, John T Meador
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Patent number: 9604071Abstract: An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled in a parallel configuration. The implantable medical device includes both a low power circuit that is selectively coupled between the first and second cells and a high power output circuit that is directly coupled to the first and second cells in a parallel configuration. An isolation circuit is coupled to the first cell, the second cell and the low power circuit to maintain a current isolation between the first cell and the second cell at least during delivery currents having a large magnitude that are delivered to the high power output circuit.Type: GrantFiled: April 24, 2015Date of Patent: March 28, 2017Assignee: Medtronic, Inc.Inventors: Randolph E Crutchfield, Mark R Boone, Lonny V Cabelka, Kevin P Kuehn, John T Meador, John D Norton, Craig L Schmidt
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Patent number: 9579517Abstract: An implantable medical device includes a low-power circuit, a high-power circuit, and a dual-cell power source. The power source is coupled to a transformer having first and second primary windings, each of which is selectively coupled to the power source and a plurality of secondary windings that are magnetically coupled to the first and second primary windings. The plurality of secondary windings are interlaced along a length of each of the secondary windings. Each of the plurality of secondary transformer windings is coupled to a capacitor, and the capacitors are all connected in a series configuration. The low power circuit is coupled to the power source and issues a control signal to control the delivery of charge from the power source to the plurality of capacitors through the first and second transformers.Type: GrantFiled: April 24, 2015Date of Patent: February 28, 2017Assignee: Medtronic, Inc.Inventors: John T Meador, Randolph E Crutchfield, Mark R Boone, Lonny V Cabelka
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Patent number: 9539435Abstract: An implantable medical device includes a low-power circuit, a high-power circuit, and a multi-cell power source. The implantable medical device delivers stimulation therapy to cardiac tissue. The cardioversion energy is delivered across through electrodes that are coupled to terminals of the high-power circuit. A protection circuit for protecting the low-voltage circuit components from high voltage pulses includes a first segment coupled to a first of the electrodes and a second segment coupled to a second of the electrodes, the components of the low-voltage circuit being coupled to the transthoracic protection circuit portion, and a reference potential corresponding to a ground potential, wherein the first and second segments of the transthoracic protection circuit portion are coupled to the reference potential in a parallel configuration.Type: GrantFiled: April 24, 2015Date of Patent: January 10, 2017Assignee: Medtronic, Inc.Inventors: Marshall J Rasmussen, Randolph E Crutchfield, Mark R Boone, Lonny V Cabelka, Kevin P Kuehn, Forrest C. M. Pape
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Patent number: 9526910Abstract: Recent advancements in power electronics technology have provided opportunities for enhancements to circuits of implantable medical devices. The enhancements have contributed to increasing circuit miniaturization and an increased efficiency in the operation of the implantable medical devices. The therapy delivery circuits and techniques of the disclosure facilitate generation of a therapy stimulation waveform that may be shaped based on the patient's physiological response to the stimulation waveform. The generated therapy stimulation waveforms include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. Unlike the truncated exponential waveform delivered by the conventional therapy delivery circuit which is based on the behavior of the output capacitors (i.e., i=C(dV/dt)), the stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response.Type: GrantFiled: November 10, 2014Date of Patent: December 27, 2016Assignee: Medtronic, Inc.Inventors: Randolph E Crutchfield, Lonny V Cabelka, Mark R Boone, Marshall J Rasmussen