Abstract: A separable connector interface includes at least one electrically conductive element with a metal polymer composite deposited thereon. The metal polymer composite has conductive particles dispersed within a protective binder.

Abstract: A coating for improved flammability performance for use with electrical components for use with multiple surfaces, including metal and polymeric surfaces is provided for herein. The coating comprises a carrier, primary additives and secondary additive and provides for enhanced performance of the electrical components by eliminating or delaying the start of a flame event or in the case of a flame event, decreasing the flame height.

Abstract: An article and a method of forming an article are provided. The article includes a thermoplastic build material and a polymeric support material. The polymeric support material is selectively removable from the thermoplastic build material through immersion in a solvent. The method of forming an article includes forming a part through additive manufacturing with a thermoplastic build material and a polymeric support material, immersing the part in a solvent, selectively softening the polymeric support material with the solvent, removing the part from the solvent, and separating the polymeric support material from the thermoplastic build material. Another method of forming an article includes forming a part through additive manufacturing with a thermoplastic build material and a polymeric support material, immersing the part in a solvent, selectively dissolving the polymeric support material with the solvent, and removing the thermoplastic build material from the solvent.

Abstract: This invention relates to a process for synthesizing InSb nanoparticles, a method to stabilize them, and a method to provide a photodetector to detect infrared light.

Abstract: An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.

Abstract: An article and a method of forming an article are provided. The article includes a thermoplastic build material and a polymeric support material. The polymeric support material is selectively removable from the thermoplastic build material through immersion in a solvent. The method of forming an article includes forming a part through additive manufacturing with a thermoplastic build material and a polymeric support material, immersing the part in a solvent, selectively softening the polymeric support material with the solvent, removing the part from the solvent, and separating the polymeric support material from the thermoplastic build material. Another method of forming an article includes forming a part through additive manufacturing with a thermoplastic build material and a polymeric support material, immersing the part in a solvent, selectively dissolving the polymeric support material with the solvent, and removing the thermoplastic build material from the solvent.

Abstract: This invention relates to a precursor material, which can be decomposed to form semiconductors and metal oxides, or more generally, materials for electronic components. The precursors comprise metal complexes of hydroxamato ligands. The invention further relates to a preparation process for thin inorganic films comprising various metals (e.g. Cu/In/Zn/Ga/Sn) and oxygen, selenium and/or sulfur. The thin films can be used in photovoltaic panels (solar cells), other semiconductor or electronic devices, and other applications using such films. The process uses molecular, metal containing precursor complexes with hydroxamato ligands. These can be combined in the process with chalcogenide sources or oxygen. Exemplarily, various metal oxides and copper-based chalcopyrites of the I-III-VI2 type are prepared with high purity at low temperatures.

Abstract: The invention relates to a preparation process for thin semiconducting inorganic films comprising various metals (Cu/In/Zn/Ga/Sn), selenium and/or sulfur. The process uses molecular precursors comprising metal complexes with oximato ligands. Copper-based chalcopyrites of the I-III-IV2-type are prepared with high purity at low temperatures under ambient conditions. The thin films can be used in photovoltaic panels (solar cells).

Abstract: The invention relates to a preparation process for thin semiconducting inorganic films comprising various metals (Cu/In/Zn/Ga/Sn), selenium and/or sulfur. The process uses molecular precursors comprising metal complexes with oximato ligands. Copper-based chalcopyrites of the I-III-IV2-type are prepared with high purity at low temperatures under ambient conditions. The thin films can be used in photovoltaic panels (solar cells).