Patents by Inventor Raquel de Souza Borges Ferreira

Raquel de Souza Borges Ferreira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240078702
    Abstract: A method for recognizing a reference point associated with a fiducial marker including the steps of: obtaining or receiving image data of the fiducial marker; determining the degree of which the image data of the fiducial marker is aligned with one or more reference images; of which if the degree of alignment is determined to be less than an acceptable threshold predicting a set of coordinates of the reference point associated with the fiducial marker; incorporating the set of coordinates with the image data to form a modified image data; and determining the degree of which the modified image data of the fiducial marker is aligned with one or more reference images.
    Type: Application
    Filed: September 5, 2022
    Publication date: March 7, 2024
    Inventors: Yi LI, Hong Seung YEON, Nicholas HAEHN, Wei LI, Raquel DE SOUZA BORGES FERREIRA, Minglu LIU, Robin McREE, Yosuke KANAOKA, Gang DUAN, Arnab ROY
  • Publication number: 20240070366
    Abstract: A package substrate stack modeler includes a manufacturing modeler, configured to generate a model of a real package substrate stack based on an ideal design of the package substrate stack; a signal integrity model, configured to determine a signal integrity of a metal trace of the real package substrate stack; and a yield model, configured to determine a yield of the real package substrate stack; wherein the metal trace comprises a first value of a trace variable; further comprising a processor, configured to select a second value of the trace variable of the metal trace based on the determined signal integrity of the metal trace or the determined yield of the package substrate stack model.
    Type: Application
    Filed: August 25, 2022
    Publication date: February 29, 2024
    Inventors: Nicholas HAEHN, Raquel DE SOUZA BORGES FERREIRA, Siddharth ALUR, Prakaram JOSHI, Dhanya ATHREYA, Yidnekachew MEKONNEN, Ali HARIRI, Andrea NICOLAS, Sri Chaitra Jyotsna CHAVALI, Kemal AYGUN
  • Patent number: 11150633
    Abstract: A method for providing a 3D shape model for a new process in an additive manufacturing system includes receiving an unoptimized 3D model of one or more shapes based on a first process (P1); receiving deviation information based on P1; baseline deviation modeling of P1 based on the received unoptimized 3D model and the received deviation information to thereby generate an optimized 3D model for the one or more shapes based on P1; applying a transfer function that connects deviation information of P1 to deviation information of a second process (P2); receiving deviation information based on P2; adaptively modeling the deviations of P2 based on the transformed baseline model and the deviation information of P2; generating an optimized 3D model for the one or more shapes based on P2; and generating a compensation plan for additively manufacturing the one or more shapes between P1 and P2.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: October 19, 2021
    Assignees: Purdue Research Foundation, University Of Southern California
    Inventors: Raquel de Souza Borges Ferreira, Arman Sabbaghi, Qiang Huang, Kevin Amstutz
  • Publication number: 20190346830
    Abstract: A method for providing a 3D shape model for a new process in an additive manufacturing system includes receiving an unoptimized 3D model of one or more shapes based on a first process (P1); receiving deviation information based on P1; baseline deviation modeling of P1 based on the received unoptimized 3D model and the received deviation information to thereby generate an optimized 3D model for the one or more shapes based on P1; applying a transfer function that connects deviation information of P1 to deviation information of a second process (P2); receiving deviation information based on P2; adaptively modeling the deviations of P2 based on the transformed baseline model and the deviation information of P2; generating an optimized 3D model for the one or more shapes based on P2; and generating a compensation plan for additively manufacturing the one or more shapes between P1 and P2.
    Type: Application
    Filed: May 13, 2019
    Publication date: November 14, 2019
    Applicants: Purdue Research Foundation, University of Southern California
    Inventors: Raquel de Souza Borges Ferreira, Arman Sabbaghi, Qiang Huang, Kevin Amstutz