Patents by Inventor Ravi Ramanathan

Ravi Ramanathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11924213
    Abstract: A user permission system manages and regulates access to secure data at one or more third-party data sites. The system may provide access to one or more databases or other data structures based on user authentication and access rules that have been established, such as by a user associated with the data being accessed at the third party data store. Access may be provided via an API to the third-party data site, along with access credentials of a user with data stored with the third-party data site, allowing the system to access data on behalf of the user.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: March 5, 2024
    Assignee: ConsumerInfo.com, Inc.
    Inventors: Michelle Felice-Steele, Michele Raneri, Paul DeSaulniers, Joe Manna, Jeff Softley, Srikumar Puthupadi Kanthadai, Aga Dzhafar Hady Ogiu Dzhafarov, Pat Finneran, Donna Meryl Smith, Gregory Lennox Wright, Marizette Galvez, Ujjayan Banerjee, Ravi Devesetti, Shivakumar Ramanathan, Mukeshkumar G. Patel
  • Patent number: 8527401
    Abstract: A computer system and method for processing a mortgage loan receives borrower, property, loan and underwriting data entered by a lender via a certifying company Internet web site. The system, which is operated by the certifying company, communicates with outside service provider systems to order and obtain products there from. The system is loaded with lender parameters for assessing loan risk. The system uses the entered data, outside service provider products and lender parameters to provide a loan assessment and a mortgage loan fulfillment product if the assessment is favorable. The mortgage loan fulfillment product includes a loan package, deed of trust, a promissory note, a title insurance policy and a loan fulfillment certification of the process compliance and data integrity.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: September 3, 2013
    Assignee: The First American Corporation
    Inventors: Craig I. DeRoy, Jim Dufficy, Kathleen Collins, Roger S. Hull, Ravi Ramanathan
  • Publication number: 20110186966
    Abstract: A gallium arsenide (GaAs) integrated circuit device is provided. The GaAs circuit device has a GaAs substrate with a copper contact layer for making electrical ground contact with a pad of a target device. Although copper is known to detrimentally affect GaAs devices, the copper contact layer is isolated from the GaAs substrate using a barrier layer. The barrier layer may be, for example, a layer of nickel vanadium (NiV). This nickel vanadium (NiV) barrier protects the gallium arsenide substrate from the diffusion effects of the copper contact layer. An organic solder preservative may coat the exposed copper to reduce oxidation effects. In some cases, a gold or copper seed layer may be deposited on the GaAs substrate prior to depositing the copper contact layer.
    Type: Application
    Filed: April 11, 2011
    Publication date: August 4, 2011
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Hong Shen, Ravi Ramanathan, Qiuliang Luo, Robert W. Warren, Usama K. Abdali
  • Patent number: 7923842
    Abstract: A gallium arsenide (GaAs) integrated circuit device is provided. The GaAs circuit device has a GaAs substrate with a copper contact layer for making electrical ground contact with a pad of a target device. Although copper is known to detrimentally affect GaAS devices, the copper contact layer is isolated from the GaAs substrate using a barrier layer. The barrier layer may be, for example, a layer of nickel vanadium (NiV). This nickel vanadium (NiV) barrier protects the gallium arsenide substrate from the diffusion effects of the copper contact layer. An organic solder preservative may coat the exposed copper to reduce oxidation effects. In some cases, a gold or copper seed layer may be deposited on the GaAs substrate prior to depositing the copper contact layer.
    Type: Grant
    Filed: March 16, 2006
    Date of Patent: April 12, 2011
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hong Shen, Ravi Ramanathan, Qiuliang Luo, Robert W Warren, Usama K Abdali
  • Publication number: 20070297106
    Abstract: A circuit and process is provided for protecting a device from the detrimental effects of electro-static discharge (ESD). The circuit includes an ESD breakdown device that is used to activate a current drawdown device. When a voltage exceeding the ESD breakdown device's breakdown voltage is applied, a signal is generated that causes the current drawdown device to pump current to ground. In this way, the effects of the ESD charge are substantially reduced. In one example, the ESD breakdown device is a reverse biased diode, and the current drawdown circuit includes a Darlington circuit. When an ESD surge causes the diode to breakdown, a signal is applied to the Darlington circuit, which pumps the ESD current safely to ground.
    Type: Application
    Filed: June 23, 2006
    Publication date: December 27, 2007
    Inventors: Peter H. Dai, Jane Xu, Peter J. Zampardi, Ravi Ramanathan
  • Patent number: 7300102
    Abstract: An improved seating system that includes a seat back assembly (10) that is fabricated to include a seat back (12) with a first panel portion (14) that is optionally secured to a second panel portion (16) with one or more fasteners such as welds, adhesives, tack-offs, steel brackets or otherwise. The first panel portion (14), the second panel portion (16) or both preferably are plastic. The seat back assembly (10) may include one or more integrated reinforcement structures (20).
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: November 27, 2007
    Assignee: Dow Global Technologies, Inc.
    Inventors: Vikas Gupta, Hein J. Koelman, Steve J. Rogers, Eric Kurtycz, Ravi Ramanathan
  • Publication number: 20070215897
    Abstract: A gallium arsenide (GaAs) integrated circuit device is provided. The GaAs circuit device has a GaAs substrate with a copper contact layer for making electrical ground contact with a pad of a target device. Although copper is known to detrimentally affect GaAS devices, the copper contact layer is isolated from the GaAs substrate using a barrier layer. The barrier layer may be, for example, a layer of nickel vanadium (NiV). This nickel vanadium (NiV) barrier protects the gallium arsenide substrate from the diffusion effects of the copper contact layer. An organic solder preservative may coat the exposed copper to reduce oxidation effects. In some cases, a gold or copper seed layer may be deposited on the GaAs substrate prior to depositing the copper contact layer.
    Type: Application
    Filed: March 16, 2006
    Publication date: September 20, 2007
    Inventors: Hong Shen, Ravi Ramanathan, Qiuliang Luo, Robert Warren, Usama Abdali
  • Patent number: 7234763
    Abstract: An improved seating system that includes a seat back assembly (10) that is fabricated to include a seat back (12) with a first panel portion (14) that is optionally secured to a second panel portion (16) with one or more fasteners such as welds, adhesives, tack-offs, steel brackets or otherwise. The first panel portion (14), the second panel portion (16) or both preferably are plastic. The seat back assembly (10) may include one or more integrated reinforcement structures (20).
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: June 26, 2007
    Assignee: Dow Global Technologies Inc
    Inventors: Vikas Gupta, Hein J. Koelman, Steve J. Rogers, Eric Kurtycz, Ravi Ramanathan
  • Publication number: 20060136330
    Abstract: A computer system and method for processing a mortgage loan receives borrower, property, loan and underwriting data entered by a lender via a certifying company Internet web site. The system, which is operated by the certifying company, communicates with outside service provider systems to order and obtain products there from. The system is loaded with lender parameters for assessing loan risk. The system uses the entered data, outside service provider products and lender parameters to provide a loan assessment and a mortgage loan fulfillment product if the assessment is favorable. The mortgage loan fulfillment product includes a loan package, deed of trust, a promissory note, a title insurance policy and a loan fulfillment certification of the process compliance and data integrity.
    Type: Application
    Filed: October 24, 2005
    Publication date: June 22, 2006
    Inventors: Craig DeRoy, Jim Dufficy, Kathleen Collins, Roger Hull, Ravi Ramanathan
  • Publication number: 20050113249
    Abstract: A Diesel soot catalyst has ceria and platinum present in a Diesel particulate filter in a ratio, by weight, of ceria to platinum of at most about 75. This catalyst allows for the use of very small amounts of platinum metal while still achieving low balance point temperatures for burning of Diesel soot.
    Type: Application
    Filed: November 22, 2004
    Publication date: May 26, 2005
    Inventors: Robin Ziebarth, Cheng Li, Ravi Ramanathan
  • Publication number: 20050082896
    Abstract: An improved seating system that includes a seat back assembly (10) that is fabricated to include a seat back (12) with a first panel portion (14) that is optionally secured to a second panel portion (16) with one or more fasteners such as welds, adhesives, tack-offs, steel brackets or otherwise. The first panel portion (14), the second panel portion (16) or both preferably are plastic. The seat back assembly (10) may include one or more integrated reinforcement structures (20).
    Type: Application
    Filed: October 27, 2004
    Publication date: April 21, 2005
    Applicant: Dow Global Technologies Inc.
    Inventors: Vikas Gupta, Hein Koelman, Steve Rogers, Eric Kurtycz, Ravi Ramanathan
  • Patent number: 6860010
    Abstract: A method of forming a valve cover suitable for attachment to an engine head is disclosed. The valve cover is molded from a plastic material to include at least one structure of a positive crankcase ventilation (PCV) system. Additionally, the design of the valve cover includes various advantages including, for example, structural integrity, ease of installation or the like.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: March 1, 2005
    Assignee: Dow Global Technologies, Inc.
    Inventors: Bart R. Jones, Daryl J. Hertema, Ravi Ramanathan, Sam L. Crabtree
  • Patent number: 6784252
    Abstract: Disclosed are blow molded automotive articles comprising a coupled propylene polymer composition.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: August 31, 2004
    Assignee: Dow Global Technologies Inc.
    Inventors: Ravi Ramanathan, Thomas D. Traugott, Leo R. Novak, Malcolm F. Finlayson
  • Publication number: 20040160089
    Abstract: An improved seating system that includes a seat back assembly (10) that is fabricated to include a seat back (12) with a first panel portion (14) that is optionally secured to a second panel portion (16) with one or more fasteners such as welds, adhesives, tack-offs, steel brackets or otherwise. The first panel portion (14), the second panel portion (16) or both preferably are plastic. The seat back assembly (10) may include one or more integrated reinforcement structures (20).
    Type: Application
    Filed: February 11, 2004
    Publication date: August 19, 2004
    Applicant: Dow Global Technologies Inc.
    Inventors: Vikas Gupta, Hein J. Koelman, Steve J. Rogers, Eric Kurtycz, Ravi Ramanathan
  • Patent number: 6739673
    Abstract: An improved seating system that includes a seat back assembly (10) that is fabricated to include a seat back (12) with a first panel portion (14) that is optionally secured to a second panel portion (16) with one or more fasteners such as welds, adhesives, tack-offs, steel brackets or otherwise. The first panel portion (14), the second panel portion (16) or both preferably are plastic. The seat back assembly (10) may include one or more integrated reinforcement structures (20).
    Type: Grant
    Filed: August 12, 2002
    Date of Patent: May 25, 2004
    Assignee: Dow Global Technologies, Inc.
    Inventors: Vikas Gupta, Hein J. Koelman, Steve J. Rogers, Eric Kurtycz, Ravi Ramanathan
  • Publication number: 20040096610
    Abstract: A fuel tank comprising two or more sections bonded together with an adhesive which bonds to low energy surface materials and has fuel barrier properties.
    Type: Application
    Filed: September 29, 2003
    Publication date: May 20, 2004
    Inventors: Ravi Ramanathan, Gregory J. Korchnak, David M. Courter, Martin C. Cornell, Arthur F. Cawley, Kenneth Ritzema, Steven B. Swartzmiller
  • Publication number: 20030214082
    Abstract: A valve cover suitable for attachment to an engine head is disclosed. The valve cover is molded from a plastic material to include at least one structure of a positive crankcase ventilation (PCV) system. Additionally, the design of the valve cover includes various advantages including, for example, structural integrity, ease of installation or the like.
    Type: Application
    Filed: May 15, 2002
    Publication date: November 20, 2003
    Applicant: Dow Global Technologies, Inc.
    Inventors: Bart R. Jones, Daryl Hertema, Ravi Ramanathan, Sam L. Crabtree
  • Publication number: 20030215655
    Abstract: Improved multi-layer coextruded blow-molded objects (such as fuel containers) having at least a barrier layer and a support layer are disclosed together with improved methods for preparing such objects. The barrier layer includes an amount of modified polyolefin having approximately the same density as the support layer, wherein the modified polyolefin is prepared by grafting an unsaturated carboxylic acid or a derivative thereof to the polyolefin, the modified polyolefin being added in an amount such that the gas-barrier layer sufficiently adheres to the adjacent layer and such that the gas barrier properties of the fabricated article are still adequate. The present invention also relates to modification of the rheology of base resins, such as PET (a preferred material for the barrier layer), so that they more closely match the rheology of high density polyethylene (a preferred material for the support layer).
    Type: Application
    Filed: November 1, 2002
    Publication date: November 20, 2003
    Inventors: Mark A. Barger, Joseph A. Schomaker, Ravi Ramanathan, Malcolm F. Finlayson, Chuiwah A. Cheung, Kalyan Sehanobish
  • Publication number: 20030069362
    Abstract: Disclosed are blow molded automotive articles comprising a coupled propylene polymer composition.
    Type: Application
    Filed: September 3, 2002
    Publication date: April 10, 2003
    Inventors: Ravi Ramanathan, Thomas D. Traugott, Leo R. Novak, Malcolm F. Finlayson
  • Publication number: 20030062759
    Abstract: An improved seating system that includes a seat back assembly (10) that is fabricated to include a seat back (12) with a first panel portion (14) that is optionally secured to a second panel portion (16) with one or more fasteners such as welds, adhesives, tack-offs, steel brackets or otherwise. The first panel portion (14), the second panel portion (16) or both preferably are plastic. The seat back assembly (10) may include one or more integrated reinforcement structures (20).
    Type: Application
    Filed: August 12, 2002
    Publication date: April 3, 2003
    Applicant: DOW GLOBAL TECHNOLOGIES, INC.
    Inventors: Vikas Gupta, Hein J. Koelman, Steve J. Rogers, Eric Kurtycz, Ravi Ramanathan