Patents by Inventor Raymond Rosado

Raymond Rosado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10439112
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: October 8, 2019
    Assignee: Cree, Inc.
    Inventors: Joseph G. Clark, Jeffrey Carl Britt, Amber C. Abare, Raymond Rosado, Harsh Sundani, David T. Emerson, Jeremy Scott Nevins
  • Patent number: 10008637
    Abstract: Light emitter devices and methods with reduced dimensions and improved light output are provided. In one embodiment, a light emitter device includes a submount having an area of approximately 6 square millimeters (mm2) or less. The device can further include a light emitting chip on the submount and a lens disposed over the light emitting chip and positioned on the submount. The device can be operable for emitting light at approximately 100 lumens or higher.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: June 26, 2018
    Assignee: Cree, Inc.
    Inventors: Jeffrey C. Britt, David T. Emerson, Raymond Rosado, Justin Lydon
  • Patent number: 9660153
    Abstract: A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely spaced apart anode and cathode pads of the substrate. An encapsulant is provided on the light emitting diode die and the mounting substrate. The gap is configured to prevent sufficient encapsulant from entering the gap that would degrade operation of the LED.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: May 23, 2017
    Assignee: Cree, Inc.
    Inventors: David Todd Emerson, Raymond Rosado, Matthew Donofrio, John Adam Edmond
  • Patent number: 9640737
    Abstract: Horizontal light emitting diodes include anode and cathode contacts on the same face and a transparent substrate having an oblique sidewall. A conformal phosphor layer having an average equivalent particle diameter d50 of at least about 10 ?m is provided on the oblique sidewall. High aspect ratio substrates may be provided. The LED may be directly attached to a submount.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: May 2, 2017
    Assignee: Cree, Inc.
    Inventors: Matthew Donofrio, John Adam Edmond, James Ibbetson, David Todd Emerson, Michael John Bergmann, Kevin Haberern, Raymond Rosado, Jeffrey Carl Britt
  • Patent number: 9627361
    Abstract: Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: April 18, 2017
    Assignee: Cree, Inc.
    Inventors: Peter S. Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Jeffrey C. Britt
  • Patent number: 9496466
    Abstract: Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: November 15, 2016
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Justin Lydon, Raymond Rosado, Jeffrey C. Britt
  • Patent number: 9349929
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: May 24, 2016
    Assignee: Cree, Inc.
    Inventors: Joseph G. Clark, Amber C. Abare, David T. Emerson, Jeremy S. Nevins, Raymond Rosado, Michael Bergmann
  • Patent number: 9041042
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: May 26, 2015
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Publication number: 20150048393
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 19, 2015
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: 8896013
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: November 25, 2014
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: 8696159
    Abstract: Multi-chip LED devices are described. Embodiments of the present invention provide multi-chip LED devices with relatively high efficiency and good color rendering. The LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The optical element may be molded from silicone. The LED chips may be connected in parallel. In some embodiments, the LED device includes a submount, which may be made of a ceramic material such as alumina or aluminum nitride. Wire bonds can be connected to the LED chips so that all the wire bonds tend the outside of a group of LED chips. Various sizes and types of LED chips may be used, including vertical LED chips and sideview LED chips.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: April 15, 2014
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Jeffrey C. Britt
  • Publication number: 20130322068
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.
    Type: Application
    Filed: July 20, 2012
    Publication date: December 5, 2013
    Applicant: CREE, Inc.
    Inventors: JOSEPH G. CLARK, JEFFREY CARL BRITT, AMBER C. ABARE, RAYMOND ROSADO, HARSH SUNDANI, DAVID T. EMERSON, JEREMY SCOTT NEVINS
  • Publication number: 20130322070
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
    Type: Application
    Filed: December 13, 2012
    Publication date: December 5, 2013
    Applicant: CREE, Inc.
    Inventors: Joseph G. Clark, Amber C. Abare, David T. Emerson, Jeremy S. Nevins, Raymond Rosado
  • Publication number: 20130141920
    Abstract: Light emitter devices and methods with reduced dimensions and improved light output are provided. In one embodiment, a light emitter device includes a submount having an area of approximately 6 square millimeters (mm2) or less. The device can further include a light emitting chip on the submount and a lens disposed over the light emitting chip and positioned on the submount. The device can be operable for emitting light at approximately 100 lumens or higher.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 6, 2013
    Applicant: CREE, INC.
    Inventors: David T. Emerson, Justin Lydon, Raymond Rosado, Jeffrey C. Britt
  • Publication number: 20130141905
    Abstract: Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 6, 2013
    Applicant: CREE, INC.
    Inventors: Christopher P. Hussell, Justin Lydon, Raymond Rosado, Jeffrey C. Britt
  • Publication number: 20120193660
    Abstract: Horizontal light emitting diodes include anode and cathode contacts on the same face and a transparent substrate having an oblique sidewall. A conformal phosphor layer having an average equivalent particle diameter d50 of at least about 10 ?m is provided on the oblique sidewall. High aspect ratio substrates may be provided. The LED may be directly attached to a submount.
    Type: Application
    Filed: January 31, 2011
    Publication date: August 2, 2012
    Inventors: Matthew Donofrio, John Adam Edmond, James Ibbetson, David Todd Emerson, Michael John Bergmann, Kevin Haberern, Raymond Rosado, Jeffrey Carl Britt
  • Publication number: 20120193661
    Abstract: A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely spaced apart anode and cathode pads of the substrate. An encapsulant is provided on the light emitting diode die and the mounting substrate. The gap is configured to prevent sufficient encapsulant from entering the gap that would degrade operation of the LED.
    Type: Application
    Filed: May 20, 2011
    Publication date: August 2, 2012
    Inventors: David Todd Emerson, Raymond Rosado, Matthew Donofrio, John Adam Edmond
  • Patent number: D660257
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: May 22, 2012
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Jeffrey C. Britt
  • Patent number: D709464
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: July 22, 2014
    Assignee: Cree, Inc.
    Inventors: Amber C. Abare, Jeffrey Carl Britt, Joseph G. Clark, Raymond Rosado, Harsh Sundani
  • Patent number: D749051
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: February 9, 2016
    Assignee: Cree, Inc.
    Inventors: Joseph G Clark, Amber C Abare, David T Emerson, Jeremy S Nevins, Raymond Rosado