Patents by Inventor Raymond S. Wong

Raymond S. Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Expandable films and molded products therefrom
    Patent number: 5540963
    Abstract: A thin, tacky, non-pourable film of incompatible in situ-expandable thermoplastic particles and thermosettable matrix resin that contains an essentially uniform density and thickness across the breadth of the film. The in situ-expandable mass is not pourable yet can be easily dispensed in a uniform manner within a mold and thereafter expanded to the dimensions of the mold. Composites and reinforced compositions, as well as methods of molding, are disclosed.
    Type: Grant
    Filed: March 7, 1995
    Date of Patent: July 30, 1996
    Assignee: The Dexter Corporation
    Inventor: Raymond S. Wong
  • Expandable films and molded products therefrom
    Patent number: 5397611
    Abstract: A thin, tacky, non-pourable film of incompatible in situ-expandable thermoplastic particles and thermosettable matrix resin that contains an essentially uniform density and thickness across the breadth of the film. The in situ-expandable mass is not pourable yet can be easily dispensed in a uniform manner within a mold and thereafter expanded to the dimensions of the mold. Composites and reinforced compositions, as well as methods of molding, are disclosed.
    Type: Grant
    Filed: August 10, 1993
    Date of Patent: March 14, 1995
    Assignee: The Dexter Corporation
    Inventor: Raymond S. Wong
  • Expandable films and molded products therefrom
    Patent number: 5234757
    Abstract: A thin, tacky, non-pourable film of incompatible in situ-expandable thermoplastic particles and thermosettable matrix resin that contains an essentially uniform density and thickness across the breadth of the film. The in situ-expandable mass is not pourable yet can be easily dispensed in a uniform manner within a mold and thereafter expanded to the dimensions of the mold. Composites and reinforced compositions, as well as methods of molding, are disclosed.
    Type: Grant
    Filed: April 30, 1991
    Date of Patent: August 10, 1993
    Assignee: The Dexter Corporation
    Inventor: Raymond S. Wong