Patents by Inventor Regan Nayve

Regan Nayve has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8585186
    Abstract: The present invention provides a method of manufacturing a substrate which forms a wiring pattern on a substrate having a plurality of through-holes. In the method, the wiring pattern is formed, after burying a filling material into the through-holes and planarizing a surface of the substrate. The filling material may be a conductive material, and a portion of the conductive material may be removed after the wiring pattern is formed. Removal of the portion of the conductive material may be carried out after a protective film, which protects the wiring pattern, is formed. The filling material may be a conductive material and a sacrificial material, and the sacrificial material may be removed after the wiring pattern is formed.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: November 19, 2013
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Regan Nayve, Michiaki Murata
  • Patent number: 8389084
    Abstract: A fluid impermeable protective layer is described for a structure that has a 3-dimensional profile. The 3-dimensional profile can include actuators. The protective layer is applied so that there are no breaches in the protective layer and so that the protective layer is not too thick to prevent the actuators from being able to properly function.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: March 5, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Regan Nayve, Darren T. Imai, Alex F. Fong
  • Publication number: 20120194617
    Abstract: The present invention provides a method of manufacturing a substrate which forms a wiring pattern on a substrate having a plurality of through-holes. In the method, the wiring pattern is formed, after burying a filling material into the through-holes and planarizing a surface of the substrate. The filling material may be a conductive material, and a portion of the conductive material may be removed after the wiring pattern is formed. Removal of the portion of the conductive material may be carried out after a protective film, which protects the wiring pattern, is formed. The filling material may be a conductive material and a sacrificial material, and the sacrificial material may be removed after the wiring pattern is formed.
    Type: Application
    Filed: April 11, 2012
    Publication date: August 2, 2012
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Regan Nayve, Michiaki Murata
  • Patent number: 8177334
    Abstract: The present invention provides a method of manufacturing a substrate which forms a wiring pattern on a substrate having a plurality of through-holes. In the method, the wiring pattern is formed, after burying a filling material into the through-holes and planarizing a surface of the substrate. The filling material may be a conductive material, and a portion of the conductive material may be removed after the wiring pattern is formed. Removal of the portion of the conductive material may be carried out after a protective film, which protects the wiring pattern, is formed. The filling material may be a conductive material and a sacrificial material, and the sacrificial material may be removed after the wiring pattern is formed.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: May 15, 2012
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Regan Nayve, Michiaki Murata
  • Publication number: 20100221497
    Abstract: A fluid impermeable protective layer is described for a structure that has a 3-dimensional profile. The 3-dimensional profile can include actuators. The protective layer is applied so that there are no breaches in the protective layer and so that the protective layer is not too thick to prevent the actuators from being able to properly function.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 2, 2010
    Inventors: Regan Nayve, Darren T. Imai, Alex F. Fong
  • Publication number: 20080043067
    Abstract: The present invention provides a method of manufacturing a substrate which forms a wiring pattern on a substrate having a plurality of through-holes. In the method, the wiring pattern is formed, after burying a filling material into the through-holes and planarizing a surface of the substrate. The filling material may be a conductive material, and a portion of the conductive material may be removed after the wiring pattern is formed. Removal of the portion of the conductive material may be carried out after a protective film, which protects the wiring pattern, is formed. The filling material may be a conductive material and a sacrificial material, and the sacrificial material may be removed after the wiring pattern is formed.
    Type: Application
    Filed: February 9, 2007
    Publication date: February 21, 2008
    Inventors: Regan Nayve, Michiaki Murata
  • Patent number: 6254222
    Abstract: Through-holes serving as common liquid chambers 5 are formed in a flow channel substrate 1 by a wet anisotropic etching process. One opened end of each through-hole serves as a liquid inlet 4. Trenches rectangular in cross section, which are used as liquid flow channels 7, are formed in the flow channel substrate by RIE process. Each liquid flow channel 7 includes a front constriction 41 formed near its associated discharge orifice 9 and a rear constriction 42 formed near a connection portion between the channel and the common liquid chamber 5. The common liquid chamber 5 is communicatively connected to the liquid flow channel 7 in a linear fashion, and a portion of the liquid flow channel 7 between the front constriction 41 and the rear constriction 42 may be designed to be broad. Therefore, the flow channel resistance is reduced, the liquid jetting efficiency is improved, and the liquid re-supplying is performed at high speed.
    Type: Grant
    Filed: November 27, 1998
    Date of Patent: July 3, 2001
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Michiaki Murata, Regan Nayve, Atsushi Fukugawa, Masahiko Fujii