Patents by Inventor Reid T. Hirata

Reid T. Hirata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink blade pack for device under test testing
    Patent number: 9244107
    Abstract: Embodiments of the present disclosure provide an apparatus configured to engage a device for testing the device via automatic test equipment. The apparatus includes a heat sink, wherein the heat sink comprises a plurality of fins extending from the heat sink, and wherein the heat sink is configured to engage the device. The apparatus further includes a heat conduction layer coupled to the heat sink, a first leg coupled to the heat conduction layer, and a second leg coupled to the heat conduction layer. The second leg is spaced apart from the first leg. A vacuum path is defined through (i) the heat conduction layer and (ii) the heat sink. The vacuum path permits the apparatus to engage the device to be tested by the automatic test equipment.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: January 26, 2016
    Assignee: Marvell World Trade Ltd.
    Inventors: Bruce Tirado, Scott Wu, William Su, David Ganapol, Robert P. Zaldain, Reid T. Hirata, Tom Lim
  • HEAT SINK BLADE PACK FOR DEVICE UNDER TEST TESTING
    Publication number: 20140132296
    Abstract: Embodiments of the present disclosure provide an apparatus configured to engage a device for testing the device via automatic test equipment. The apparatus includes a heat sink, wherein the heat sink comprises a plurality of fins extending from the heat sink, and wherein the heat sink is configured to engage the device. The apparatus further includes a heat conduction layer coupled to the heat sink, a first leg coupled to the heat conduction layer, and a second leg coupled to the heat conduction layer. The second leg is spaced apart from the first leg. A vacuum path is defined through (i) the heat conduction layer and (ii) the heat sink. The vacuum path permits the apparatus to engage the device to be tested by the automatic test equipment.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 15, 2014
    Applicant: Marvell World Trade Ltd.
    Inventors: Bruce Tirado, Scott Wu, William Su, David Ganapol, Robert P. Zaldain, Reid T. Hirata, Tom Lim