Patents by Inventor Reimund Engl

Reimund Engl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10978418
    Abstract: A method of forming an electrical contact and a method of forming a chip package are provided. The methods may include arranging a metal contact structure including a non-noble metal and electrically contacting the chip, arranging a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: April 13, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Publication number: 20210082861
    Abstract: In various embodiments, a method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.
    Type: Application
    Filed: November 6, 2020
    Publication date: March 18, 2021
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Patent number: 10672678
    Abstract: In various embodiments, methods for forming a chip package are provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: June 2, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler, Brigitte Ruehle
  • Publication number: 20200013749
    Abstract: In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
    Type: Application
    Filed: September 17, 2019
    Publication date: January 9, 2020
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Patent number: 10497634
    Abstract: In various embodiments, a chip package is provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: December 3, 2019
    Assignee: Infineon Technologies AG
    Inventors: Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler, Brigitte Ruehle
  • Patent number: 10461056
    Abstract: In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: October 29, 2019
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Publication number: 20190287875
    Abstract: In various embodiments, methods for forming a chip package are provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.
    Type: Application
    Filed: June 5, 2019
    Publication date: September 19, 2019
    Inventors: Heinrich Koerner, Michael Bauer, Reimund ENGL, Michael Huettinger, Werner Kanert, Joachim Mahler, Brigitte Ruehle
  • Patent number: 9941181
    Abstract: In various embodiments, a chip package is provided. The chip package may include a chip including a chip metal surface, a metal contact structure electrically contacting the chip metal surface, and packaging material including a contact layer being in physical contact with the chip metal surface and/or with the metal contact structure; wherein at least in the contact layer of the packaging material, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less than 10 atomic parts per million.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: April 10, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler, Brigitte Ruehle
  • Publication number: 20170338164
    Abstract: In various embodiments, a chip package is provided. The chip package may include a chip including a chip metal surface, a metal contact structure electrically contacting the chip metal surface, and packaging material including a contact layer being in physical contact with the chip metal surface and/or with the metal contact structure; wherein at least in the contact layer of the packaging material, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less than 10 atomic parts per million.
    Type: Application
    Filed: May 19, 2017
    Publication date: November 23, 2017
    Inventors: Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler, Brigitte Ruehle
  • Publication number: 20170338169
    Abstract: In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
    Type: Application
    Filed: May 22, 2017
    Publication date: November 23, 2017
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Publication number: 20170338165
    Abstract: In various embodiments, a chip package is provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.
    Type: Application
    Filed: May 22, 2017
    Publication date: November 23, 2017
    Inventors: Heinrich KOERNER, Michael BAUER, Reimund ENGL, Michael HUETTINGER, Werner KANERT, Joachim MAHLER, Brigitte RUEHLE
  • Publication number: 20150279782
    Abstract: A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier and a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier. The first thickness is smaller than the second thickness.
    Type: Application
    Filed: June 10, 2015
    Publication date: October 1, 2015
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Henrik Ewe, Joachim Mahler, Manfred Mengel, Reimund Engl, Josef Hoeglauer, Jochen Dangelmaier
  • Patent number: 9059083
    Abstract: A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier and a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier. The first thickness is smaller than the second thickness.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: June 16, 2015
    Assignee: Infineon Technologies AG
    Inventors: Henrik Ewe, Joachim Mahler, Manfred Mengel, Reimund Engl, Josef Hoeglauer, Jochen Dangelmaier
  • Publication number: 20140319688
    Abstract: In one embodiment, a method of forming a semiconductor device includes forming a metal line over a substrate and depositing an alloying material layer over a top surface of the metal line. The method further includes forming a protective layer by combining the alloying material layer with the metal line.
    Type: Application
    Filed: July 8, 2014
    Publication date: October 30, 2014
    Inventors: Dirk Meinhold, Norbert Mais, Reimund Engl, Hans-Joerg Timme, Alfred Vater, Stephan Henneck, Norbert Urbansky
  • Patent number: 8835319
    Abstract: In one embodiment, a method of forming a semiconductor device includes forming a metal line over a substrate and depositing an alloying material layer over a top surface of the metal line. The method further includes forming a protective layer by combining the alloying material layer with the metal line.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: September 16, 2014
    Assignee: Infineon Technologies AG
    Inventors: Dirk Meinhold, Norbert Mais, Reimund Engl, Hans-Joerg Timme, Alfred Vater, Stephan Henneck, Norbert Urbansky
  • Patent number: 8642408
    Abstract: A semiconductor device and method is disclosed. One embodiment provides a method comprising placing a first semiconductor chip on a carrier. After placing the first semiconductor chip on the carrier, an electrically insulating layer is deposited on the carrier. A second semiconductor chip is placed on the electrically insulating layer.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: February 4, 2014
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Joachim Mahler, Bernd Rakow, Reimund Engl, Rupert Fischer
  • Publication number: 20130228929
    Abstract: In one embodiment, a method of forming a semiconductor device includes forming a metal line over a substrate and depositing an alloying material layer over a top surface of the metal line. The method further includes forming a protective layer by combining the alloying material layer with the metal line.
    Type: Application
    Filed: March 2, 2012
    Publication date: September 5, 2013
    Applicant: Infineon Technologies AG
    Inventors: Dirk Meinhold, Norbert Mais, Reimund Engl, Hans-Joerg Timme, Alfred Vater, Stephan Henneck, Norbert Urbansky
  • Patent number: 8330252
    Abstract: An integrated circuit device includes a semiconductor chip and a control chip at different supply potentials. A lead chip island includes an electrically conductive partial region and an insulation layer. The semiconductor chip is arranged on the electrically conductive partial region of the lead chip island and the control chip is cohesively fixed on the insulation layer.
    Type: Grant
    Filed: October 10, 2007
    Date of Patent: December 11, 2012
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Reimund Engl, Thomas Behrens, Wolfgang Kuebler, Rainald Sander
  • Patent number: 8110906
    Abstract: A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: February 7, 2012
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Wae Chet Yong, Stanley Job Doraisamy, Gerhard Deml, Rupert Fischer, Reimund Engl
  • Publication number: 20110189821
    Abstract: A semiconductor device and method is disclosed. One embodiment provides a method comprising placing a first semiconductor chip on a carrier. After placing the first semiconductor chip on the carrier, an electrically insulating layer is deposited on the carrier. A second semiconductor chip is placed on the electrically insulating layer.
    Type: Application
    Filed: October 7, 2010
    Publication date: August 4, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf Otremba, Joachim Mahler, Bernd Rakow, Reimund Engl, Rupert Fischer