Patents by Inventor Reinhard Golly

Reinhard Golly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless in-chip and chip to chip communication
    Patent number: 10122420
    Abstract: Apparatus and methods are provided for wireless communications between integrated circuits or integrated circuit dies of an electronic system. In an example, an apparatus can include a first integrated circuit die including a plurality of integrated circuit devices, a second integrated circuit die including a second plurality of integrated circuit devices, and a conductor device configured to wirelessly receive a signal from the first integrated circuit die, to conduct the signal from a first end of an electrical conductor of the conductor device to a second end of the electrical conductor, and to wirelessly transmit the signal to the second integrated circuit die from the second end of the electrical conductor.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: November 6, 2018
    Assignee: Intel IP Corporation
    Inventors: Thorsten Meyer, Andreas Augustin, Reinhard Golly, Peter Baumgartner
  • WIRELESS IN-CHIP AND CHIP TO CHIP COMMUNICATION
    Publication number: 20170180014
    Abstract: Apparatus and methods are provided for wireless communications between integrated circuits or integrated circuit dies of an electronic system. In an example, an apparatus can include a first integrated circuit die including a plurality of integrated circuit devices, a second integrated circuit die including a second plurality of integrated circuit devices, and a conductor device configured to wirelessly receive a signal from the first integrated circuit die, to conduct the signal from a first end of an electrical conductor of the conductor device to a second end of the electrical conductor, and to wirelessly transmit the signal to the second integrated circuit die from the second end of the electrical conductor.
    Type: Application
    Filed: December 22, 2015
    Publication date: June 22, 2017
    Inventors: Thorsten Meyer, Andreas Augustin, Reinhard Golly, Peter Baumgartner
  • Circuit arrangement for processing a radio-frequency signal
    Patent number: 9496907
    Abstract: Described herein is a circuit arrangement for processing a radio-frequency signal.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: November 15, 2016
    Assignee: Intel Deutschland GmbH
    Inventor: Reinhard Golly
  • Semiconductor devices
    Patent number: 9385105
    Abstract: A semiconductor device includes: a chip having at least one electrically conductive contact at a first side of the chip; an extension layer extending laterally from one or more sides of the chip; a redistribution layer on a surface of the extension layer and the first side, and coupled to the contact; an interposer having at least one electrically conductive contact at a first surface of the interposer and coupled to the redistribution layer, and at least one electrically conductive contact at a second surface of the interposer opposite to the first surface; a molding material at least partially enclosing the chip and the redistribution layer, and in contact with the interposer. Another semiconductor device includes: an interposer; a redistribution layer over the interposer; a circuit having first and second circuit portions, wherein the redistribution layer includes the first circuit portion, and the interposer includes the second circuit portion.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: July 5, 2016
    Assignee: Intel Deutschland GmbH
    Inventors: Thorsten Meyer, Gerald Ofner, Bernd Waidhas, Hans-Joachim Barth, Sven Albers, Reinhard Golly, Philipp Riess, Bernd Ebersberger
  • SEMICONDUCTOR DEVICES
    Publication number: 20150028478
    Abstract: A semiconductor device includes: a chip having at least one electrically conductive contact at a first side of the chip; an extension layer extending laterally from one or more sides of the chip; a redistribution layer on a surface of the extension layer and the first side, and coupled to the contact; an interposer having at least one electrically conductive contact at a first surface of the interposer and coupled to the redistribution layer, and at least one electrically conductive contact at a second surface of the interposer opposite to the first surface; a molding material at least partially enclosing the chip and the redistribution layer, and in contact with the interposer. Another semiconductor device includes: an interposer; a redistribution layer over the interposer; a circuit having first and second circuit portions, wherein the redistribution layer includes the first circuit portion, and the interposer includes the second circuit portion.
    Type: Application
    Filed: January 10, 2013
    Publication date: January 29, 2015
    Inventors: Thorsten Meyer, Gerald Ofner, Bernd Waidhas, Hans-Joachim Barth, Sven Albers, Reinhard Golly, Philipp Riess, Bernd Ebersberger
  • Circuit Arrangement for Processing a Radio-Frequency Signal
    Publication number: 20090088109
    Abstract: Described herein is a circuit arrangement for processing a radio-frequency signal.
    Type: Application
    Filed: September 26, 2008
    Publication date: April 2, 2009
    Applicant: Infineon Technologies AG
    Inventor: Reinhard Golly