Patents by Inventor Ren Zhou

Ren Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120116617
    Abstract: A method for providing traction control on a wheeled vehicle involves receiving a speed reference signal. A variance in wheel size between a first and at least one other wheel of the vehicle is determined. Lastly, a drive control signal operable to control power to each of the first and at least one other wheel is output, the drive control signal being based on the speed reference signal and determined variance in wheel size and operable to provide that a tractive force exerted by each of the wheels on a corresponding surface during traction and/or braking is substantially similar.
    Type: Application
    Filed: February 16, 2009
    Publication date: May 10, 2012
    Applicant: Schaffler IP Pty Limited
    Inventors: Bernard Schaffler, Ren Zhou
  • Publication number: 20100152804
    Abstract: The above-described methods and apparatus are believed to be of particular benefit for patients suffering heart failure including cardiac dysfunction, chronic HF, and the like and all variants as described herein and including those known to those of skill in the art to which the invention is directed. It will understood that the present invention offers the possibility of monitoring and therapy of a wide variety of acute and chronic cardiac dysfunctions. The current invention provides systems and methods for delivering therapy for cardiac hemodynamic dysfunction via the innervated myocardial substrate receives one or more discrete pulses of electrical stimulation during the refractory period of said innervated myocardial substrate.
    Type: Application
    Filed: December 9, 2009
    Publication date: June 17, 2010
    Applicant: Medtronic, Inc.
    Inventors: Karen J. Kleckner, Kathleen A. Prieve, Jeffrey M. Gillberg, Ren Zhou, Kenneth M. Anderson, D. Curtis Deno, Glenn C. Zillmer, Ruth N. Klepfer, Vincent E. Splett, David E. Euler, Lawrence J. Mulligan, Edwin G. Duffin, David A. Igel, John E. Burnes
  • Publication number: 20070299477
    Abstract: The above-described methods and apparatus are believed to be of particular benefit for patients suffering heart failure including cardiac dysfunction, chronic HF, and the like and all variants as described herein and including those known to those of skill in the art to which the invention is directed. It will understood that the present invention offers the possibility of monitoring and therapy of a wide variety of acute and chronic cardiac dysfunctions. The current invention provides systems and methods for delivering therapy for cardiac hemodynamic dysfunction via the innervated myocardial substrate receives one or more discrete pulses of electrical stimulation during the refractory period of said innervated myocardial substrate.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 27, 2007
    Inventors: Karen Kleckner, Kathleen Prieve, Jeffrey Gillberg, Ren Zhou, Kenneth Anderson, D. Deno, Glenn Zillmer, Ruth Klepfer, Vincent Splett, David Euler, Lawrence Mulligan, Edwin Duffin, David Igel, John Burnes
  • Publication number: 20070187038
    Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing having a backing member having a bonding surface, an inner electrode having a lower surface on one side and a bonding surface on the other side, and an outer electrode having a lower surface on one side and a bonding surface on the other side. At least one of the electrodes has a flange, which extends underneath at least a portion of the lower surface of the other electrode.
    Type: Application
    Filed: February 13, 2006
    Publication date: August 16, 2007
    Inventors: Daxing Ren, Enrico Magni, Eric Lenz, Ren Zhou
  • Patent number: 7233824
    Abstract: An extra-systolic stimulation (ESS) therapy addresses cardiac dysfunction including heart failure. ESS therapy employs atrial and/or ventricular extra-systoles via pacing-level stimulation to a heart. These extra-systoles must be timed correctly to achieve beneficial effects on myocardial mechanics (efficacy) while maintaining an extremely low level of risk of arrhythmia induction and excellent ICD-like arrhythmia sensing and detection (security). The present invention relates to therapy delivery guidance and options for improved ESS therapy delivery. These methods may be employed individually or in combinations in an external or implantable ESS therapy delivery device.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: June 19, 2007
    Assignee: Medtronic, Inc.
    Inventors: Karen J. Kleckner, Kathleen A. Prieve, Jeffrey M. Gillberg, Ren Zhou, Kenneth M. Anderson, D. Curtis Deno, Glenn C. Zillmer, Ruth N. Klepfer, Vincent E. Splett
  • Patent number: 7054719
    Abstract: A method of mixing two or more chemicals such as for a CMP system. The method includes delivering a first chemical to a first inlet port of a point of use mixer at a first flow rate, delivering a second chemical to a second inlet port of the point of use mixer at a second flow rate, controlling the flow of the first and second chemicals into the mixer upon demand for a mixture of the first and second chemicals and balancing the flow of the first and second chemicals into the mixer. The mixture can also be output such as to a CMP process. A system for mixing two or more chemicals is also described.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: May 30, 2006
    Assignee: Lam Research Corporation
    Inventors: Xuyen Pham, Tuan Nguyen, Vien Quach, Ren Zhou
  • Patent number: 7040970
    Abstract: An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: May 9, 2006
    Assignee: Lam Research Corporation
    Inventors: Simon McClatchie, Sabir Majumder, Ren Zhou, Xuyen Pham, Tuan A. Nguyen
  • Patent number: 7040954
    Abstract: Apparatus and methods control CMP to uniformly polish a series of wafers. Average motor current I(avg) drawn by, and related average work W(avg) performed by, motors during CMP on the wafers reliably indicate quality of a roughness polishing characteristic of a polishing surface of a polishing pad. A conditioner controller controls a rate at which the quality of the polishing surface is restored by conditioning in relation to a rate of change of the quality of the polishing surface due to the CMP. Motor current is measured and averaged over many CMP-processed wafers. The method defines a baseline range of values of average work and controls conditioning according to whether average work is within the baseline range. When the polishing surface moves at constant velocity relative to each of the wafers that are being polished, a control signal based on average motor current represents the quality of the polishing characteristic.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: May 9, 2006
    Assignee: Lam Research Corporation
    Inventors: Simon McClatchie, Peter Norton, Xuyen Pham, Ren Zhou
  • Publication number: 20060014478
    Abstract: An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.
    Type: Application
    Filed: July 15, 2004
    Publication date: January 19, 2006
    Inventors: Simon McClatchie, Sabir Majumder, Ren Zhou, Xuyen Pham, Tuan Nguyen
  • Patent number: 6953750
    Abstract: A linear chemical mechanical planarization (CMP) system includes a belt pad, a slurry bar having a plurality of nozzles, and a heating module for heating slurry. The heating module has a plurality of heating elements, each of which is coupled in flow communication with one of the plurality of nozzles of the slurry bar. The system also may include a control system for controlling the heating elements of the heating module and first and second temperature sensors coupled to the control system. The first temperature sensors measure the temperature of slurry heated by each of the heating elements, and the second temperature sensors measure the temperature of the surface of the belt pad. A method for dispensing slurry in a linear CMP system, and methods for controlling the temperature of the surface of the belt pad and the temperature of slurry in a linear CMP system also are described.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: October 11, 2005
    Assignee: Lam Research Corporation
    Inventors: Patrick P. H. Wu, Xuyen Pham, Tuan A. Nguyen, Ren Zhou
  • Patent number: 6896586
    Abstract: A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: May 24, 2005
    Assignee: Lam Research Corporation
    Inventors: Xuyen Pham, Tuan Nguyen, Ren Zhou, David Wei, Linda Jiang, Katgenhalli Y. Ramanujam, Joseph P. Simon, Tony Luong, Sridharan Srivatsan, Anjun Jerry Jin
  • Publication number: 20050101998
    Abstract: An extra-systolic stimulation (ESS) therapy addresses cardiac dysfunction including heart failure. ESS therapy employs atrial and/or ventricular extra-systoles via pacing-level stimulation to a heart. These extra-systoles must be timed correctly to achieve beneficial effects on myocardial mechanics (efficacy) while maintaining an extremely low level of risk of arrhythmia induction and excellent ICD-like arrhythmia sensing and detection (security). The present invention relates to therapy delivery guidance and options for improved ESS therapy delivery. These methods may be employed individually or in combinations in an external or implantable ESS therapy delivery device.
    Type: Application
    Filed: November 7, 2003
    Publication date: May 12, 2005
    Inventors: Karen Kleckner, Kathleen Prieve, Jeffrey Gillberg, Ren Zhou, Kenneth Anderson, D. Deno, Glenn Zillmer, Ruth Klepfer, Vincent Splett
  • Publication number: 20050070212
    Abstract: A system and method of delivering a liquid to a CMP polishing pad includes supplying the liquid to a nozzle, the nozzle being oriented toward a polishing surface of the CMP polishing pad. The liquid flows at a rate of less than or equal to about 100 cc per minute. A pressurized carrier gas is also supplied to the nozzle. The liquid is substantially evenly sprayed from the nozzle onto the CMP polishing pad.
    Type: Application
    Filed: September 30, 2003
    Publication date: March 31, 2005
    Applicant: Lam Research Corporation
    Inventors: Xuyen Pham, Ren Zhou, Wen-Chiang Tu
  • Patent number: 6872128
    Abstract: A system and method of delivering a liquid to a CMP polishing pad includes supplying the liquid to a nozzle, the nozzle being oriented toward a polishing surface of the CMP polishing pad. The liquid flows at a rate of less than or equal to about 100 cc per minute. A pressurized carrier gas is also supplied to the nozzle. The liquid is substantially evenly sprayed from the nozzle onto the CMP polishing pad.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: March 29, 2005
    Assignee: Lam Research Corporation
    Inventors: Xuyen Pham, Ren Zhou, Wen-Chiang Tu
  • Patent number: 6821195
    Abstract: An invention is provided for a carrier head for use in a CMP process. The carrier head includes a metal plate that is capable of transferring a downforce to a wafer during a CMP operation. A plurality of vacuum holes is disposed within the metal plate, wherein each vacuum hole is positioned such that the vacuum hole is within five millimeters of an edge of the wafer during the CMP operation. In this manner, each vacuum hole can be positioned such that the vacuum hole is within an edge exclusion zone of the wafer during the CMP operation. In some embodiments, each vacuum hole is positioned such that the vacuum hole is within three millimeters of the edge of the wafer during the CMP operation, such as 2.7 millimeters from the edge of the wafer.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: November 23, 2004
    Assignee: Lam Research Corporation
    Inventors: Xuyen Pham, Ren Zhou, Raisa Khavinson
  • Publication number: 20040199293
    Abstract: A method of mixing two or more chemicals such as for a CMP system. The method includes delivering a first chemical to a first inlet port of a point of use mixer at a first flow rate, delivering a second chemical to a second inlet port of the point of use mixer at a second flow rate, controlling the flow of the first and second chemicals into the mixer upon demand for a mixture of the first and second chemicals and balancing the flow of the first and second chemicals into the mixer. The mixture can also be output such as to a CMP process. A system for mixing two or more chemicals is also described.
    Type: Application
    Filed: April 19, 2004
    Publication date: October 7, 2004
    Applicant: Lam Research Corporation
    Inventors: Xuyen Pham, Tuan Nguyen, Vien Quach, Ren Zhou
  • Publication number: 20040162007
    Abstract: A substrate polishing system includes a delivery arm having a nozzle configured to combine a rinse fluid and a gas into an atomized spray, and to direct the atomized spray toward a polishing pad. The atomization process causes droplets of the rinse agent in the atomized spray to become negatively charged. The negative charge causes in the rinse agent to adhere to waste particles and slurry, which facilitates removal thereof from the polishing pad.
    Type: Application
    Filed: February 19, 2003
    Publication date: August 19, 2004
    Inventors: Ky Phan, Xuyen Pham, Greg Bettencourt, Ren Zhou
  • Patent number: 6732017
    Abstract: A chemical mechanical planarization (CMP) system includes a point of use chemical mixing system. The point of use chemical mixing system includes a first and a second pump, a first and a second flow sensor, a mixer and a controller. The first pump has an input coupled to a first chemical supply and the first flow sensor coupled to the output of the first pump. The second pump has an input coupled to a second chemical supply and the second flow sensor coupled to the output of the second pump. The mixer has inputs coupled to the output of the first and second flow sensors. The controller is configured to receive signals from the first and second flow sensors and to produce control signals for the first and second pumps and the mixer. The controller is further configured to cause a mixture of the first and second chemicals upon a demand from the CMP process.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: May 4, 2004
    Assignee: Lam Research Corp.
    Inventors: Xuyen Pham, Tuan Nguyen, Vien Quach, Ren Zhou
  • Publication number: 20030186623
    Abstract: A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.
    Type: Application
    Filed: March 29, 2002
    Publication date: October 2, 2003
    Applicant: LAM Research Corp.
    Inventors: Xuyen Pham, Tuan Nguyen, Ren Zhou, David Wei, Linda Jiang, Katgenhalli Y. Ramanujam, Joseph P. Simon, Tony Luong, Sridharan Srivatsan, Anjun Jerry Jin
  • Publication number: 20030158630
    Abstract: A chemical mechanical planarization system includes a point of use chemical mixing system. The point of use chemical mixing system includes a first and a second pump, a first and a second flow sensor, a mixer and a controller. The first pump has an input coupled to a first chemical supply and the first flow sensor coupled to the output of the first pump. The second pump has an input coupled to a second chemical supply and the second flow sensor coupled to the output of the second pump. The mixer has inputs coupled to the output of the first and second flow sensors. The controller is configured to receive signals from the first and second flow sensors and to produce control signals for the first and second pumps and the mixer. The controller is further configured to cause a mixture of the first and second chemicals upon a demand from the CMP process.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Applicant: Lam Research Corporation
    Inventors: Xuyen Pham, Tuan Nguyen, Vien Quach, Ren Zhou