Abstract: A light emitting device (LED) package comprises: a thermally conductive layer; an electrically insulating layer having openings extending therethrough; LEDs situated within the openings of the electrically insulating layer and including contact pads; and electrically conductive strips attached to the contact pads and the electrically insulating layer.

Abstract: A light emitting device comprises a plurality of organic light emitting diode (OLED) modules. The OLED modules are arranged into a series group where the individual OLED modules are electrically connected in series. The device is configured to be coupled to a power supply. A display is also provided. The display includes a plurality of OLED modules arranged to depict a shape selected from the group consisting of at least one letter, at least one number, at least one image, and a combination thereof.

Abstract: A two-stage valve for controlling the flow of fluid from a pressurized fluid supply with an upper main body including a cavity with a contoured inner surface; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A first valve opens and closes the flow of gas from the pressurized gas supply to the cavity. A second valve allows the pressure in the cavity to exhaust to the environment. Raising and lowering of the pressure in the cavity causes the pre-stressed diaphragm to open and close the flow of gas from the pressurized gas supply through the primary flow path of the two-stage valve. The design is suitable as a microvalve using Micro-Electro-Mechanical Systems (MEMS) concepts.

Abstract: An optical coupler comprises a fiber optic prism (FOP) comprising first, second, and third side surfaces, the FOP being adapted to receive light through the first side surface, reflect the received light from the third side surface, and transmit the reflected light through the second side surface. The FOP may be used in an optical coupling arrangement comprising a substrate including a light element and a wave guide overlying the substrate, with the optical being situated such that one of the first and second side surfaces is adjacent the light element and the other of the first and second side surfaces is adjacent the wave guide.

Abstract: A two-stage valve for controlling the flow of gas from a pressurized gas supply with an upper main body including a cavity; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A secondary flow path exists from the pressurized gas supply through the lower main body, through the upper main body, and terminating in the cavity in the upper main body. A first valve is installed in the secondary flow path to open and close the flow of gas from the pressurized gas supply to the cavity. A second valve installed in an exhaust passage in the upper main body allows the pressure in the cavity to exhaust to the environment. When the second valve is closed, the pressure in the cavity in the upper main body can be increased to lower the pre-stressed diaphragm.

Abstract: A method and structure for reducing mechanical shear stresses induced in an IC chip by metal interconnect lines that interconnect the chip with its surrounding substrate. A dielectric layer overlies at least a portion of the substrate and a peripheral surface region of the chip. The lines are formed on the dielectric layer and are electrically interconnected with contact pads on the peripheral surface region of the chip, i.e., beneath the dielectric layer. At least one trench is formed in the dielectric layer and surrounds the peripheral surface region of the chip. The lines traverse the trench so as to have nonplanar portions within the trench. The trenches and the nonplanar portions of the lines increase the expansion/contraction capability of the dielectric layer and lines in a region sufficiently close to where the lines are interconnected to the contact pads, such that shear stresses at critical points near the line-pad connections are significantly reduced.

Abstract: A light emitting device (LED) package comprises: a thermally conductive layer; an electrically insulating layer having openings extending therethrough; LEDs situated within the openings of the electrically insulating layer and including contact pads; and electrically conductive strips attached to the contact pads and the electrically insulating layer.

Abstract: A two-stage valve for controlling the flow of gas from a pressurized gas supply with an upper main body including a cavity; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A secondary flow path exists from the pressurized gas supply through the lower main body, through the upper main body, and terminating in the cavity in the upper main body. A first valve is installed in the secondary flow path to open and close the flow of gas from the pressurized gas supply to the cavity. A second valve installed in an exhaust passage in the upper main body allows the pressure in the cavity to exhaust to the environment. When the second valve is closed, the pressure in the cavity in the upper main body can be increased to lower the pre-stressed diaphragm.

Abstract: An optical coupler comprises a fiber optic prism (FOP) comprising first, second, and third side surfaces, the FOP being adapted to receive light through the first side surface, reflect the received light from the third side surface, and transmit the reflected light through the second side surface. The FOP may be used in an optical coupling arrangement comprising a substrate including a light element and a wave guide overlying the substrate, with the optical being situated such that one of the first and second side surfaces is adjacent the light element and the other of the first and second side surfaces is adjacent the wave guide.

Abstract: A method and structure for reducing mechanical shear stresses induced in an IC chip by metal interconnect lines that interconnect the chip with its surrounding substrate. A dielectric layer overlies at least a portion of the substrate and a peripheral surface region of the chip. The lines are formed on the dielectric layer and are electrically interconnected with contact pads on the peripheral surface region of the chip, i.e., beneath the dielectric layer. At least one trench is formed in the dielectric layer and surrounds the peripheral surface region of the chip. The lines traverse the trench so as to have nonplanar portions within the trench. The trenches and the nonplanar portions of the lines increase the expansion/contraction capability of the dielectric layer and lines in a region sufficiently close to where the lines are interconnected to the contact pads, such that shear stresses at critical points near the line-pad connections are significantly reduced.

Abstract: A method and structure for reducing mechanical shear stresses induced in an IC chip by metal interconnect lines that interconnect the chip with its surrounding substrate. A dielectric layer overlies at least a portion of the substrate and a peripheral surface region of the chip. The lines are formed on the dielectric layer and are electrically interconnected with contact pads on the peripheral surface region of the chip, i.e., beneath the dielectric layer. At least one trench is formed in the dielectric layer and surrounds the peripheral surface region of the chip. The lines traverse the trench so as to have nonplanar portions within the trench. The trenches and the nonplanar portions of the lines increase the expansion/contraction capability of the dielectric layer and lines in a region sufficiently close to where the lines are interconnected to the contact pads, such that shear stresses at critical points near the line-pad connections are significantly reduced.

Abstract: A process for producing a pattern in the surface coating of an electrode used in an electrochemical machining process comprises the steps of providing a cylinder having a body composed of an electrically conductive material and a surface coating of an electrically insulating material and exposing the surface coating of the cylinder to a source of light in accordance with the pattern. Locators(s) may optionally be formed on the surface of the cylinder to assist in positioning the electrode in a predrilled hole.

Abstract: A method for fabricating a substantially transparent polymer substrate for an anti-scatter x-ray grid for medical diagnostic radiography includes positioning a phase mask between the substrate and a high power laser; providing a laser beam from the laser; conditioning the laser beam; ablating a first portion the substrate through the phase mask with the conditioned laser beam; and moving the substrate; and ablating a second portion of the substrate through the phase mask with the conditioned laser beam.

Abstract: A protective cap is deposited over the top and sides of an air bridge structure located on an integrated circuit chip. The protective cap provides mechanical strength during the application of a high density interconnect structure over the chips, to prevent deformation of the sensitive (air bridge) structure, and also to prevent any contamination from intruding under the air bridge. More importantly, the protective cap does not impede the performance of the air bridge and therefore does not need to be removed, thereby eliminating the necessity of ablating the HDI structure. Furthermore, the protective cap allows additional area for metallization to provide alternate circuits for coupling, power or ground planes, etc.

Abstract: An anti-scatter x-ray grid for medical diagnostic radiography includes a substrate having channels therein of material that is substantially non-absorbent of x-radiation and absorbing material in the channels including material that is substantially absorbent of x-radiation. The substrate preferably comprises material capable of remaining stable at the melting temperature of the absorbing material.

Abstract: A protective cap is deposited over the top and sides of an air bridge structure located on an integrated circuit chip. The protective cap provides mechanical strength during the application of a high density interconnect structure over the chips, to prevent deformation of the sensitive (air bridge) structure, and also to prevent any contamination from intruding under the air bridge. More importantly, the protective cap does not impede the performance of the air bridge and therefore does not need to be removed, thereby eliminating the necessity of ablating the HDI structure. Furthermore, the protective cap allows additional area for metallization to provide alternate circuits for coupling, power or ground planes, etc.

Abstract: A method for fabricating an anti-scatter x-ray grid for medical diagnostic radiography includes providing a substrate having channels therein and material that is substantially non-absorbent of x-radiation; and filling the channels with absorbing material that is substantially absorbent of x-radiation. In one embodiment, the step of providing a substrate having channels therein comprises sawing a plastic substrate with a thin circular blade and the step of filling the channels with absorbing material comprises melting the absorbing material and flowing the melted absorbing material into the channels.

Abstract: A process for repairing an electronic army wafer assembly having a short circuit between two non-insulative layers separated by a dielectric layer includes the step of selectively ablating one of the non-insulative layers so as to electrically isolate the situs of the short circuit while maintaining the electrical integrity of the underlying non-insulative layer intact. A laser beam is directed onto the non-insulative layer and scanned in a selected pattern to isolate the situs of the short circuit; the laser is further controlled such that a selected energy density is delivered to the surface to be ablated such that the underlying non-insulative layer is not damaged.

Abstract: Micromachined organic crystals are used in electro-optic modulators to provide high speed modulation capability. Machined modulator blocks of organic crystal material, such as dimethylamino n-methylstilbazolium tosylate (DAST), have smooth surfaces adapted to couple light between the organic crystal and a medium adjoining the crystal in the electro-optic modulator. Electrodes are disposed with respect to the modulator block such that an electric field is generated along a selected axis corresponding to the polar axis of the organic crystal. A method of machining the soft organic crystal adapted for use as a modulator includes illuminating the organic crystal material via an opaque mask having a selected pattern corresponding to a desired machined pattern for the organic crystal.

Abstract: An ultraviolet light filter is provided by implanting an ultraviolet light absorbing chemical species into an ultraviolet light transmissive substrate. Two such filters having gradient distributions may be overlapped and shifted relative to each other to provide adjustable attenuation.