Abstract: The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by i) applying a layer of the inhibiting material onto said substrate and mechanically removing locally the layer of the inhibiting material to obtain said pattern; or ii) applying a layer of the inhibiting material onto said substrate, wherein said layer has pre-determined pattern which incompletely covers said substrate; (c) establishing a distribution of particles of a first metal or alloy thereof on the layer of the inhibiting material and the pattern as obtained in step.

Abstract: Method and system for making a product (1) having a solid body (2) and having one or more cavities (3, 15) inside that solid body, with a broad surface and a small thickness. A liquid material is provided within a mold (4), and solidification of the liquid material is controlled in a position dependent way from the outside of the product. When using a thermoplastic material, the system may cool said liquid material less in areas that are projections of the cavities on the outside of the product on its broad surface. When using a thermosetting material the system may include means (5, 9) for controlled heating the liquid material, excluding the projections of the intended cavities. Once part of the product has sufficiently solidified outside the intended cavities the liquid material is driven from the intended cavities by means of a fluid. In the product some cavities may be provided with a conductive layer or structure, e.g.

Abstract: The invention is directed to a method for preparing a moulded body comprising an integrated electric circuit, to a body comprising an integrated electric circuit, and to a device comprising the body. The method of the invention comprises—placing one or more electrical components in a mould and fixing the one or more electrical components; —at least partially moulding said body using a moulding material; —providing a conductive pattern onto said at least partially moulded body; —providing one or more conductive interconnections onto said at least partially moulded body; and—optionally further moulding said body, wherein the at least partially moulding of said body, the provision of the conductive pattern, and the provision of the one or more conductive interconnections are carried out within said mould.

Abstract: The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by i) applying a layer of the inhibiting material onto said substrate and mechanically removing locally the layer of the inhibiting material to obtain said pattern; or ii) applying a layer of the inhibiting material onto said substrate, wherein said layer has pre-determined pattern which incompletely covers said substrate; (c) establishing a distribution of particles of a first metal or alloy thereof on the layer of the inhibiting material and the pattern as obtained in step.

Abstract: The invention relates to a microfluidic device comprising an actuator for converting between mechanical and electrical energy comprising an electro-active polymer or electro-active polymer composition, wherein the stiffness of the actuator at or near a first surface or part thereof differs from the stiffness at or near a second surface or part thereof, or wherein the stiffness of the actuator at or near a first extremity differs from the stiffness at or near a second extremity.

Abstract: The invention provides a process for preparing a moulded product on which or in which a layer of a metal or alloy thereof is applied, in which process use is made of a mould, which process comprises a moulding step and a metallising step, wherein the moulding and metallising step are both carried out in the mould, wherein said metallising step comprises can electroless process. The invention further relates to a device comprising the moulded product obtained by said process.

Abstract: The invention provides an electroless process for depositing a metal on an essentially catalyst-free substrate, which process comprises the steps of: (a)providing an essentially catalyst-free substrate; and (b) exposing said essentially catalyst-free substrate to an electroless solution to deposit the metal on the substrate, which solution comprises metal ions and a reducing agent for reducing the metal ions into the metal, whereby at least the surface of the substrate has a temperature or is heated to a temperature (T1) which is higher than the temperature (T2) of the solution.

Abstract: The invention is directed to a method for manufacturing, in one production step and from one material, a polymeric article having at least one optical transparent area and at least one optical non-transparent area. The inventors found that it is possible to simultaneously create transparent and non-transparent areas, while the article is formed, by influencing specific cooling parameters.

Abstract: Method and system for making a product (1) having a solid body (2) and having one or more cavities (3, 15) inside that solid body, with a broad surface and a small thickness. A liquid material is provided within a mould (4), and solidification of the liquid material is controlled in a position dependent way from the outside of the product. When using a thermoplastic material, the system may cool said liquid material less in areas that are projections of the cavities on the outside of the product on its broad surface. When using a thermosetting material the system may include means (5, 9) for controlled heating the liquid material, excluding the projections of the intended cavities. Once part of the product has sufficiently solidified outside the intended cavities the liquid material is driven from the intended cavities by means of a fluid. In the product some cavities may be provided with a conductive layer or structure, e.g.

Abstract: Manufacturing a wire beam (1), comprising a support member (2) and a number of conductors (3). In order to incorporate the conductors on or in the support member the wire beam is manufactured by means of a so-called moulded interconnect device (MID) manufacture process. At least part of the conductors may be shaped, during the MID manufacturing process, as conductors which are conductively interconnected at their ends. The interconnected conductors then may be used as a common electrode during an electrodeposition process in which the conductors are galvanized electrically to provide them with an additional conductive layer. The interconnected ends are removed after completion of the electrodeposition process.

Abstract: Method for manufacturing a polymer body (1) which comprises first areas (2) which are transparent and areas (3) which are non-transparent. A semi-manufactured body comprising said first areas and said second areas which are, however, either both transparent or both non-transparent, is produced by applying a well-known method. When the semi-manufactured body is entirely transparent, the polymer in the second areas is heated to above the polymer's melting temperature and subsequently cooled so slowly as to realize substantial crystallization of the polymer in the second areas. When the semi-manufactured body is entirely non-transparent, the polymer in said first areas is heated to above the polymer's melting temperature and subsequently cooled so quickly as to prevent substantial crystallization of the polymer in the first areas.