Abstract: A method is described for producing a module to be incorporated in a card body wherein a module carrier is provided with a conductive structure on one side. During production of the module carrier, a material whose properties essential for a certain manner of connection with a layer of material of the card body upon incorporation of the module in the card body are adjusted to said layer of material is used at least for a first layer of the module carrier located on the side opposite the conductive structure.

Abstract: The invention relates to a portable data carrier (1) with a break-out mini smart card (2) embedded therein. The mini smart card (2) is separated from the remaining card body by a free punch (3) extending over substantial parts of the mini smart card. According to the invention, the mini smart card (2) contains another rated breaking line (5) having a different break-out direction from that of the mini smart card.

Abstract: A method is described for producing a module to be incorporated in a card body wherein a module carrier is provided with a conductive structure on one side. During production of the module carrier, a material whose properties essential for a certain manner of connection with a layer of material of the card body upon incorporation of the module in the card body are adjusted to said layer of material is used at least for a first layer of the module carrier located on the side opposite the conductive structure.

Abstract: A portable data carrier with a break-out mini smart card embedded therein. The mini smart card is separated from the remaining card body by a free punch extending over substantial parts of the mini smart card. According to the invention, another rated breaking line is provided within the mini smart card, preferably consisting of a perforated line and permitting further reduction in size of the mini smart card.

Abstract: The invention relates to a data carrier comprising a one- or multilayer card body in which an electronic module is embedded. The layers of the card body consist of paper and/or cardboard and are interconnected for example by thermally activable adhesive or contact adhesive. The cards can be produced by continuous technology, the individual card layers being supplied from endless rolls, provided with the necessary windows for receiving the modules, and finally interconnected. The modules are inserted in the resulting gaps. The individual cards are punched out.

Abstract: A lead frame module to be incorporated in data carriers is presented which is divided into two areas, namely a central area receiving the sensitive components of the module, and an outer area protruding beyond the edge of the central area and serving to glue the lead frame module to the data carrier. To prevent forces from being transmitted from the outer area of the electronic module to the central area upon bending loads of the data carrier, the outer area is decoupled mechanically from the central area. This can be done for example by providing partial discontinuities including relieving punchings in the transition between the central and outer area.

Abstract: An apparatus and method for producing plastic chip cards and chip card blanks with a wall thickness considerably reduced in certain areas involves first injecting the plastic material into an initial mold space that has no reductions in wall thickness as yet. The distance between certain wall areas of the initial mold space is then reduced to the required reduced measure, displacing the plastic material into adjacent areas of the mold space.

Abstract: The invention relates to a method for incorporating a carrier element or module in a card body. The card body is provided with a recess shaped accordingly for incorporating the carrier element. The carrier element comprises a substrate on which an integrated circuit is disposed. Before the carrier element is incorporated a contact adhesive element is first introduced into the recess by means of a suitable tool. The carrier element can then be connected firmly and permanently with the card body with the aid of the contact adhesive element under the action of pressure.

Abstract: A process for manufacturing a carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

Abstract: A carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.