Patents by Inventor Reza-ur Rahman Khan

Reza-ur Rahman Khan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150137343
    Abstract: Methods of assembling a ball grid array (BGA) package is provided. One method includes providing a tape substrate that has a first surface and a second surface, attaching a first surface of a stiffener to the first substrate surface, mounting an IC die to the second stiffener surface, mounting a heat spreader to the IC die, and attaching a plurality of solder balls to the second substrate surface.
    Type: Application
    Filed: November 14, 2014
    Publication date: May 21, 2015
    Applicant: Broadcom Corporation
    Inventors: Reza-ur Rahman KHAN, Sam Ziqun ZHAO, Brent BACHER
  • Publication number: 20140210083
    Abstract: In one embodiment, a device package is provided. The device package can include a substrate having first and second opposing surfaces, an opening being formed through the first and second surfaces of the substrate; a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate.
    Type: Application
    Filed: March 28, 2014
    Publication date: July 31, 2014
    Applicant: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law, Marc Papageorge
  • Patent number: 8686558
    Abstract: In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: April 1, 2014
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law, Marc Papageorge
  • Patent number: 8310067
    Abstract: A package is provided. The package includes a substrate having first and second surfaces, a stiffener coupled to the first surface of the substrate, and a thermal connector coupled to the second surface of the substrate that is configured to be coupled to a printed circuit board.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: November 13, 2012
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan
  • Patent number: 8021927
    Abstract: A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening and coupling a first surface of a second substrate to the IC die via a bump interconnect. The second surface of the second substrate has an array of contact pads capable of coupling to a board.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: September 20, 2011
    Assignee: Broadcom Corporation
    Inventors: Reza-Ur Rahman Khan, Sam Ziqun Zhao
  • Publication number: 20110140272
    Abstract: A package is provided. The package includes a substrate having first and second surfaces, a stiffener coupled to the first surface of the substrate, and a thermal connector coupled to the second surface of the substrate that is configured to be coupled to a printed circuit board.
    Type: Application
    Filed: February 18, 2011
    Publication date: June 16, 2011
    Applicant: Broadcom Corporation
    Inventors: Sam Ziqun ZHAO, Reza-ur Rahman Khan
  • Patent number: 7893546
    Abstract: Ball grid array (BGA) packages are provided. A BGA package includes a substrate that has a surface and a stiffener that has a surface and a protruding portion. The surface of the substrate has an opening therein. The protruding portion is located on the surface of the stiffener. The surface of the stiffener is coupled to the surface of the substrate. The protruding portion extends through the opening. An area of the surface of the stiffener is less than an area of the surface of the substrate. A surface of the protruding portion is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: February 22, 2011
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan
  • Publication number: 20100285637
    Abstract: A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening and coupling a first surface of a second substrate to the IC die via a bump interconnect. The second surface of the second substrate has an array of contact pads capable of coupling to a board.
    Type: Application
    Filed: July 23, 2010
    Publication date: November 11, 2010
    Applicant: Broadcom Corporation
    Inventors: Reza-Ur Rahman Khan, Sam Ziqun Zhao
  • Patent number: 7791189
    Abstract: An integrated circuit (IC) device package is presented. A frame body has opposing first and second surfaces and a central opening that is open at the first and second surfaces. The second frame body surface is mounted to a first stiffener surface. An IC die is mounted to the first stiffener surface within the central opening through the frame body. A planar lid has opposing first and second surfaces. The second lid surface is coupled to the first frame body surface. A first substrate surface is coupled to a second stiffener surface. An array of electrically conductive terminals is coupled to a second substrate surface. The stiffener, frame body, and lid form an enclosure structure substantially enclosing the IC die. The die enclosure spreads heat from the IC die, and shields EMI emanating from and radiating toward the IC die. At least one tab protrudes from the second surface of the frame body. At least one receptacle formed in the first surface of the stiffener corresponding to the at least one tab.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: September 7, 2010
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan
  • Patent number: 7786591
    Abstract: A cavity or die down ball grid array package includes an interposer substrate structure attached to the die. In an example, the interposer substrate reduces the interconnect length from a board to which the package mounts to power and ground pads on a top layer of the semiconductor or integrated circuit (IC) die. In this example, the interposer substrate also removes the requirement that power and ground pads be located on a periphery of the die. Power and ground pads can be located in an interior region on a top metal layer where they can be interconnected to the interposer substrate using electrically conductive bumps or wire bond(s).
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: August 31, 2010
    Assignee: Broadcom Corporation
    Inventors: Reza-ur Rahman Khan, Sam Ziqun Zhao
  • Patent number: 7781882
    Abstract: An integrated circuit (IC) package is provided. The IC package includes a substantially planar substrate having a plurality of contact pads on a first surface electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate, an IC die having a first surface mounted to the first surface of the substrate, and a heat sink assembly coupled to a second surface of the IC die and to a first contact pad on the first surface of the substrate to provide a thermal path from the IC die to the first surface of the substrate. The IC die has a plurality of I/O pads electrically connected to the plurality of contact pads on the first surface of the substrate. The IC die is mounted to the first surface of the substrate in a flip chip orientation.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: August 24, 2010
    Assignee: Broadcom Corporation
    Inventors: Chonghua Zhong, Reza-ur Rahman Khan
  • Patent number: 7781266
    Abstract: A method of assembling an IC device package is provided. A leadframe is formed. At least one IC die is attached to a die attach pad portion of the leadframe. Wire bonds are coupled between the IC die and the leadframe. A cap is attached to the leadframe. A second surface of the cap includes a cavity formed therein. The cap and leadframe form an enclosure structure that substantially encloses the at least one IC die. An encapsulating material is applied to encapsulate at least the IC die. A perimeter support ring portion of the leadframe is trimmed.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: August 24, 2010
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan
  • Patent number: 7719110
    Abstract: A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The heat spreader can include one or more walls. Generally, the one or more walls at least partially laterally surround the flip chip die and/or the substrate. The walls can completely laterally surround the flip chip die to define a cavity in the heat spreader. The flip chip package can further include an encapsulate. For example, the encapsulate can be injected between the one or more walls of the heat spreader and the flip chip die and/or other components of the flip chip package. The encapsulate and/or the one or more walls of the heat spreader can protect one or more components of the flip chip package against moisture, corrosives, heat, or radiation, to provide some examples.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: May 18, 2010
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan
  • Publication number: 20100052151
    Abstract: Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
    Type: Application
    Filed: November 16, 2009
    Publication date: March 4, 2010
    Applicant: Broadcom Corporation
    Inventors: Sam Ziqun ZHAO, Reza-ur Rahman Khan, Edward Law, Marc Papageorge
  • Publication number: 20100035383
    Abstract: A method of assembling an IC device package is provided. A leadframe is formed. At least one IC die is attached to a die attach pad portion of the leadframe. Wire bonds are coupled between the IC die and the leadframe. A cap is attached to the leadframe. A second surface of the cap includes a cavity formed therein. The cap and leadframe form an enclosure structure that substantially encloses the at least one IC die. An encapsulating material is applied to encapsulate at least the IC die. A perimeter support ring portion of the leadframe is trimmed.
    Type: Application
    Filed: August 4, 2009
    Publication date: February 11, 2010
    Applicant: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan
  • Patent number: 7629681
    Abstract: Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: December 8, 2009
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law, Marc Papageorge
  • Publication number: 20090267222
    Abstract: An integrated circuit (IC) package is provided. The IC package includes a substantially planar substrate having a plurality of contact pads on a first surface electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate, an IC die having a first surface mounted to the first surface of the substrate, and a heat sink assembly coupled to a second surface of the IC die and to a first contact pad on the first surface of the substrate to provide a thermal path from the IC die to the first surface of the substrate. The IC die has a plurality of I/O pads electrically connected to the plurality of contact pads on the first surface of the substrate. The IC die is mounted to the first surface of the substrate in a flip chip orientation.
    Type: Application
    Filed: July 2, 2009
    Publication date: October 29, 2009
    Applicant: Broadcom Corporation
    Inventors: Chonghua Zhong, Reza-ur Rahman Khan
  • Patent number: 7582951
    Abstract: Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a heat spreader cap defining a cavity, an IC die, and a leadframe. The leadframe includes a centrally located die attach pad, a plurality of leads, and a plurality of tie bars that couple the die attach pad to the leads. The IC die is mounted to the die attach pad. A planar rim portion of the cap that surrounds the cavity is coupled to the leadframe. The cap and the leadframe form an enclosure structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: September 1, 2009
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan
  • Publication number: 20090203172
    Abstract: Methods of assembling a ball grid array (BGA) package is provided. One method includes providing a tape substrate that has a first surface and a second surface, attaching a first surface of a stiffener to the first substrate surface, mounting an IC die to the second stiffener surface, mounting a heat spreader to the IC die, and attaching a plurality of solder balls to the second substrate surface.
    Type: Application
    Filed: April 15, 2009
    Publication date: August 13, 2009
    Applicant: Broadcom Corporation
    Inventors: Reza-ur Rahman Khan, Sam Ziqun Zhao, Brent Bacher
  • Patent number: 7550845
    Abstract: In a ball grid array (BGA) package, a first stiffener is attached to a surface of a substrate. A second stiffener is attached to the surface of the substrate to be co-planar with the first stiffener. The second stiffener is separated from the first stiffener by a channel therebetween. An integrated circuit (IC) die is mounted to a surface of the second stiffener.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: June 23, 2009
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan