Abstract: A sensor comprises a sensor element configured to provide a sensor signal representing at least one measurand detected by the sensor element, an electrical circuit configured to process the sensor signal to form a data signal, a photovoltaic cell configured to provide electrical energy for the sensor element and the electrical circuit, and a housing, in which the sensor element, the electrical circuit and the photovoltaic cell are positioned, the housing including a recess in which the photovoltaic cell is positioned, and a rim surrounding the recess and protruding beyond the photovoltaic cell. A method is also provided.

Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

Abstract: A method for producing a thermoelectric generator includes a preparation step, a connection step and an insertion step. In the preparation step, a first substrate, a thermoelectric generator material and a second substrate are prepared. In the connection step, the generator material is connected to the first substrate and the second substrate. In this way, a first side of the generator material is connected to the first substrate in a thermally and electrically conductive manner. A second side of the generator material, opposite the first side, is connected to the second substrate in a thermally and electrically conductive manner. In the insertion step, a support material is inserted between the first substrate and the second substrate, in order to support the first substrate and the second substrate against each other and/or to mechanically connect them together.

Abstract: A photovoltaic module has at least one solar cell having an irradiation surface for receiving light. The photovoltaic module is configured to provide a voltage. The photovoltaic module also includes a carrier unit which is arranged laterally offset from the solar cell at least on one side. A first surface of the carrier unit is oriented flush with the irradiation surface of the solar cell within a predefined tolerance range. The photovoltaic module also includes at least one electrical conductor, which contacts a carrier contact connection on a second surface of the carrier unit opposite the first surface via a cell contact connection of an electronic component on the solar cell or the solar cell in an electrically conductive manner. The cell contact connection is arranged on a contacting side of the solar cell opposite the irradiation surface.

Abstract: A pump apparatus for gaseous media. A film is provided on a substrate and is connected to the substrate in the edge region of the film. By interaction between a magnetic device on the substrate and a magnetic device on the film, the film can be raised or lowered on the substrate. A pumping motion is thereby produced.

Abstract: A flip-chip manufactured MEMS device. The device includes a substrate and a MEMS die. The substrate has a plurality of bumps, a plurality of connection points configured to electrically connect the MEMS device to another device, and a plurality of vias electrically connecting the bumps to the connections points. The MEMS die is attached to the substrate using flip-chip manufacturing techniques, but the MEMS die is not subjected to processing normally associated with creating bumps for flip-chip manufacturing.

Abstract: An electronic module includes at least one support plate and at least one electronic component. The at least one support plate defines at least one through opening and has a contact side that includes at least one contact element. The at least one electronic module includes at least one electronic component positioned on the contact side of the support plate opposite the through opening. The at least one contact element projects beyond the at least one electronic component.

Abstract: Measures are described which simplify the functional testing of a component having an MEMS element provided with a pressure-sensitive sensor diaphragm, and which allow a self-calibration of the component even after it is already in place, i.e., following the end of the production process. The component has a housing, in which are situated at least one MEMS element having a pressure-sensitive sensor diaphragm and a switching arrangement for detecting the diaphragm deflections as measuring signals; an arrangement for analyzing the measuring signals; and an arrangement for the defined excitation of the sensor diaphragm. The housing has at least one pressure connection port. The arrangement for exciting the sensor diaphragm includes at least one selectively actuable actuator component for generating defined pressure pulses that act on the sensor diaphragm.

Abstract: A capacitive MEMS microphone element is described which may be used optionally for detecting acoustic signals (microphone mode) or for detecting ultrasound signals in a defined frequency range (ultrasound mode). In the layered structure of the MEMS microphone element, at least two carrier elements for the two electrode sides of a capacitor system are formed one above the other and at a distance from one another for signal detection. At least one of the two carrier elements is sound pressure-sensitive and at least one of the two electrode sides includes at least two electrode segments which are electrically contactable independent of one another, which together with the at least one electrode of the other electrode side form partial capacitances which are independent of one another.

Abstract: A component includes a substrate having at least one flexible substrate area which has at least one area reinforced by forming a material composite. The material composite includes at least a portion of the flexible substrate area. The component also includes a first microstructured or nanostructured element and a connecting mechanism configured to attach the first microstructured or nanostructured element to the flexible substrate area. A damping mass is configured to cover at least the first microstructured or nanostructured element and a portion of the substrate protruding over the material composite. The component is configured to provide a secure receptacle for the electronic element and to offer good vibration decoupling of the electronic element from vibrations of the component.

Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

Abstract: Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.

Abstract: A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate, at least one circuit chip mounted on the substrate, and an enveloping package in which the circuit chip is packaged. The functional apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement having a plurality of micromechanical loudspeakers, which is mounted on the enveloping package. A covering device is mounted above the micromechanical functional arrangement, particularly the loudspeaker arrangement, opposite the enveloping package. A method is implemented to manufacture the micromechanical functional apparatus.

Abstract: A micromechanical sensor system combination, and a corresponding manufacturing method, includes an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, the interposer chip having first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; as well as a micromechanical sensor chip system including a second front side a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, the first front side being attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts.

Abstract: An inertial sensor includes a first sensor element, which is damped against vibrations from an interface of the inertial sensor by a damping element. The first sensor element is configured to detect a first measured variable in a first frequency band, and the damping element is configured to dampen vibrations at least in the first frequency band. The inertial sensor further includes a second sensor element, which is mechanically coupled to the interface. The second sensor element is configured to detect a second measured variable in a second frequency band.

Abstract: Measures are described by which the back volume of a microphone component can be realized regardless of its packaging. Within the framework of a microphone module, a circuit board is used for the 2nd-level mounting of at least one microphone component part, in whose surface at least one connection opening is formed, which terminates in a cavity in the layer structure of the circuit board. In addition, the circuit board surface having the connection opening is configured for a sealing mounting of the microphone component part above the connection opening, so that the microphone component is acoustically connected to the cavity in the circuit board via the connection opening in the circuit board surface, and this cavity functions as backside volume for the microphone component part.

Abstract: An electrical circuit includes a component, a thermoelectric generator, and a housing. The component is a sensor element configured to sense a quantity to be measured. The component is mechanically connected to an element side of a carrier element of the circuit. The thermoelectric generator is electrically connected to the component and mechanically connected to the carrier element. The thermoelectric generator is configured to supply the component with electrical energy by using a heat flow flowing through the thermoelectric generator. The housing is arranged on the element side of the carrier element and at least partially covers the component and the thermoelectric generator. The housing is configured to conduct the heat flow to the thermoelectric generator.

Abstract: A MEMS component for generating pressure pulses is provided, its micromechanical structure including at least three function levels: a first function level in which at least one stationary trench structure is implemented, a second function level, which is implemented above the first function level and includes at least one triggerable displacement element as well as through-openings as pressure outlet openings, the displacement element protruding into the trench structure and being movable in parallel with the function levels, whereby positive and negative pressure pulses are generated, and a third function level, which is implemented above the second function level and includes at least one triggerable cover element for at least one part of the pressure outlet openings in the second function level.

Abstract: A new signal acquisition concept is provided for MEMS components having a pressure-sensitive diaphragm element, which at least partially spans a pressure connection opening. This signal acquisition concept is distinguished by an especially high sensitivity. For this purpose, the MEMS component includes a resonant vibrator device having a vibrating element, which is suspended, capable of vibrating, within a closed cavity and is equipped with at least one drive electrode and at least one sensing electrode. The vibrating element of the resonant vibrator device is coupled mechanically to the diaphragm element, so that the vibrating element is deformed in the case of a diaphragm deflection.

Abstract: An implementation for an electret in a capacitive MEMS element including a pressure-sensitive diaphragm, which is produce-able using standard methods of semiconductor technology for easy integration into the manufacturing process of MEMS semiconductor elements. Such MEMS elements include at least one pressure-sensitive diaphragm including at least one deflectable diaphragm electrode of a capacitor system for signal detection and one fixed non-pressure-sensitive counter-element including at least one counter-electrode of this capacitor system, at least one electrode of the capacitor system being provided with an electrically charged electret, so that there is a potential difference between the two electrodes of the capacitor system. The electret includes at least two adjacent layers made from different dielectric materials, electrical charges being stored on their boundary surface.