Patents by Inventor Richard A. Wilson

Richard A. Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11522504
    Abstract: Inductance-capacitance (LC) resonators having different resonant frequencies, and radio frequency (RF) transistor amplifiers including the same. One usage of such LC resonators is to implement RF short/DC block circuits. A RF transistor amplifier may include a transistor on a base of the RF transistor amplifier coupled to an input and an output of the RF transistor amplifier; a first inductance-capacitance (LC) resonator comprising a first inductance and a first capacitance; and a second LC resonator comprising a second inductance and a second capacitance. The first LC resonator may be configured to resonate at a first frequency, and the second LC resonator may be configured to resonate at a second frequency different from the first frequency.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: December 6, 2022
    Assignee: Wolfspeed, Inc.
    Inventors: Haedong Jang, Madhu Chidurala, Richard Wilson
  • Publication number: 20220359054
    Abstract: This invention discloses a method of calculating insulin sensitivity factors for use in calculating insulin doses dynamically as a function of current blood glucose level based on a temporally-weighted average of the patient's total daily insulin dose, the pharmacodynamic and/or pharmacokinetic profile of the insulin used, and the patient's typical ratio of basal insulin to bolus insulin. When average total daily insulin and the other relevant variables are inserted into the equation, the result is a mathematical function that can be used to estimate the effects of each unit of insulin delivered on a patient's blood glucose level. This mathematical equation is valid over a wide range of diabetic conditions and could be widely used throughout the world at very little cost (and at considerable improvement) to the current technology in use for these purposes.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Inventor: Christopher Richard Wilson
  • Publication number: 20220351820
    Abstract: This invention discloses a method of calculating insulin sensitivity factors for use in calculating insulin doses dynamically as a function of current blood glucose level based on the patient's total daily insulin dose. When the total daily insulin is inserted into the equation, the result is a mathematical function that can be used to estimate the effects of each unit of insulin delivered on a patient's blood glucose level at their current blood glucose level. This mathematical equation is valid over a wide range of diabetic conditions and could be widely used throughout the world at very little cost (and at considerable improvement) to the current technology.
    Type: Application
    Filed: May 1, 2021
    Publication date: November 3, 2022
    Inventor: Christopher Richard Wilson
  • Publication number: 20220341611
    Abstract: A system and method to control environmental parameters of predefined zones within a structure. An embodiment of the system uses damper assemblies that are entirely wireless as a result of energy capturing devices which convert air flow within the HVAC system ductwork into electrical current and a wireless control module that remove the need for hard-wiring for power or control. Still further, an embodiment of the system uses wireless components to monitor the environmental parameters of a structure's zones, process and communicate necessary zone adjustments, and actuate system components.
    Type: Application
    Filed: July 5, 2022
    Publication date: October 27, 2022
    Inventors: Al ZELCZER, Leonard ROTH, Richard WILSON, Kenneth BARTON
  • Publication number: 20220331227
    Abstract: A core shell microcapsule having a liquid core and an outer shell, in which the liquid core comprises solvent and a piroctone compound and the shell comprises polyurea comprising amino sulphonic acid.
    Type: Application
    Filed: August 25, 2020
    Publication date: October 20, 2022
    Inventors: Christopher FIDGE, Stephen GOLDING, Stefan Antonius Franciscus BON, Samuel Richard WILSON-WHITFORD, James MERRINGTON
  • Publication number: 20220323922
    Abstract: A core shell microcapsule having a liquid core and an outer shell, in which the liquid core comprises solvent and a piroctone compound and the shell comprises polyurea formed from monomeric units of aliphatic isocyanates and amines.
    Type: Application
    Filed: August 25, 2020
    Publication date: October 13, 2022
    Inventors: Christopher FIDGE, Stephen GOLDING, Stefan Antonius Franciscus BON, Samuel Richard WILSON-WHITFORD, James MERRINGTON
  • Patent number: 11426350
    Abstract: A method for using treated biochar to reduce the overall environmental impact of farming and minimize the carbon footprint of farms is provided. The method comprising engaging in one or more of the following practices: (1) combining treated biochar with feed or using biochar as feed for animals to reduce methane from enteric fermentation and increase animal health and nutrition; (2) combining treated biochar with compost, animal bedding or manure piles to reduce odor and increase nutrient retention; (3) applying treated biochar to lagoons to reduce odor and treat water; (4) applying treated biochar to pastures to increase pasture health; (5) applying treated biochar to crops to increase crop productivity, healthier roots and prevent fertilizer leaching; and (6) using the carbon negativity of a produced biochar to reduce the overall farm or ranch carbon footprint.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: August 30, 2022
    Assignee: Carbon Technology Holdings, LLC
    Inventors: Juliette MacKay, Richard Wilson Belcher, Wesley J. Bolsen, Brian Buege, Daren Einar Daugaard, Han Suk Kim
  • Patent number: 11408623
    Abstract: A system and method to control environmental parameters of predefined zones within a structure. An embodiment of the system uses damper assemblies that are entirely wireless as a result of energy capturing devices which convert air flow within the HVAC system ductwork into electrical current and a wireless control module that remove the need for hard-wiring for power or control. Still further, an embodiment of the system uses wireless components to monitor the environmental parameters of a structure's zones, process and communicate necessary zone adjustments, and actuate system components.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: August 9, 2022
    Assignee: ARZEL ZONING TECHNOLOGY, INC.
    Inventors: Al Zelczer, Leonard Roth, Richard Wilson, Kenneth Barton
  • Patent number: 11384031
    Abstract: The invention relates to a microbial delivery where biochar acts as a carrier for microbes.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: July 12, 2022
    Assignee: Carbon Technology Holdings, LLC
    Inventors: Richard Wilson Belcher, Han Suk Kim, Brian Buege, Mark L. Jarand, Michael C. Cheiky, Ronald A. Sills
  • Patent number: 11367696
    Abstract: RF amplifiers are provided that include a submount such as a thermally conductive flange. A dielectric substrate is mounted on an upper surface of the submount, the dielectric substrate having a first outer sidewall, a second outer sidewall that is opposite and substantially parallel to the first outer sidewall, and an interior opening. An RF amplifier die is mounted on the submount within the interior opening of the dielectric substrate, where a longitudinal axis of the RF amplifier die defines a first axis. The RF amplifier die is positioned so that a first angle defined by the intersection of the first axis with the first outer sidewall is between 5° and 45°. The dielectric substrate may be a ceramic substrate or a dielectric layer of a printed circuit board.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: June 21, 2022
    Assignee: Wolfspeed, Inc.
    Inventors: Simon Ward, Richard Wilson, Alexander Komposch
  • Publication number: 20220174985
    Abstract: A method for capturing material extracted from biochar is provided comprising the steps of: (i) providing a biochar; (ii) contacting the biochar with an extraction media, where the extraction media causes the removal of residual compounds from the pores and surface of the biochar, creating a resulting extract comprised of the extraction media and removed compounds; and (iii) collecting the resulting extract. The method also can include other steps of extraction and purification. The method further comprises the step of applying the resulting extract to seeds, plants, soil, other agricultural products, or for use in other applications. A biochar having high levels of soluble signaling compounds is also provided, where the biochar is derived from a biomass source that together with predefined pyrolysis parameters produces resulting biochar having increased levels of soluble signaling compounds that are known to increase seed germination rates and early plant growth.
    Type: Application
    Filed: August 23, 2021
    Publication date: June 9, 2022
    Inventors: Han Suk Kim, Matthew William Smith, Haijun Wan, Richard Wilson Belcher, Ranko Panayotov Bontchev, Brian Buege
  • Publication number: 20220169577
    Abstract: A method and system is provided for treating water to remove contaminants using treated biochar placed in the water flow pathway of a water treatment process. The system further includes the further treatment of the treated biochar after its use in the water treatment process for use in agricultural or animal applications.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 2, 2022
    Inventors: Rajashekharam Malyala, Richard Wilson Belcher, Ranko Panayotov Bontchev, Brian Buege, Mark L. Jarand, Han Suk Kim, Juliette MacKay, Ronald A. Sills, Vern Traxler
  • Patent number: 11336253
    Abstract: An amplifier circuit includes a first port, a second port, a reference potential port, and an RF amplifier device having a first terminal electrically coupled to the first port, a second terminal electrically coupled to the second port, and a reference potential terminal electrically coupled to the reference potential port. The RF amplifier device amplifies an RF signal across an RF frequency range that includes a fundamental RF frequency. An impedance matching network is electrically coupled to the first terminal and the first port. The impedance matching network includes a baseband termination circuit that presents low impedance in a baseband frequency region, a fundamental frequency matching circuit that presents a complex conjugate of an intrinsic impedance of the RF amplifier device in the RF frequency range, and a second order harmonic termination circuit that presents low impedance at second order harmonics of frequencies in the fundamental RF frequency range.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: May 17, 2022
    Assignee: Wolfspeed, Inc.
    Inventors: Bayaner Arigong, Haedong Jang, Richard Wilson, Frank Trang, Qianli Mu, E J Hashimoto
  • Patent number: 11214528
    Abstract: A method and system is provided for treating water to remove contaminants using treated biochar placed in the water flow pathway of a water treatment process. The system further includes the further treatment of the treated biochar after its use in the water treatment process for use in agricultural or animal applications.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: January 4, 2022
    Assignee: Carbon Technology Holdings, LLC
    Inventors: Rajashekharam Malyala, Richard Wilson Belcher, Ranko Panayotov Bontchev, Brian Buege, Mark L. Jarand, Han Suk Kim, Juliette MacKay, Ronald A. Sills, Vern Traxler
  • Publication number: 20210408977
    Abstract: Inductance-capacitance (LC) resonators having different resonant frequencies, and radio frequency (RF) transistor amplifiers including the same. One usage of such LC resonators is to implement RF short/DC block circuits. A RF transistor amplifier may include a transistor on a base of the RF transistor amplifier coupled to an input and an output of the RF transistor amplifier; a first inductance-capacitance (LC) resonator comprising a first inductance and a first capacitance; and a second LC resonator comprising a second inductance and a second capacitance. The first LC resonator may be configured to resonate at a first frequency, and the second LC resonator may be configured to resonate at a second frequency different from the first frequency.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 30, 2021
    Inventors: Haedong Jang, Madhu Chidurala, Richard Wilson
  • Publication number: 20210408978
    Abstract: A packaged radio frequency transistor amplifier includes a package housing, an RF transistor amplifier die that is mounted within the package housing, a first capacitor die that is mounted within the package housing, an input leadframe that extends through the package housing to electrically connect to a gate terminal of the RF transistor amplifier die, and an output leadframe that extends through the package housing to electrically connect to a drain terminal of the RF transistor amplifier die. The output leadframe includes an output pad region, an output lead that extends outside of the package housing, and a first arm that extends from one of the output pad region and the output lead to be adjacent the first capacitor die.
    Type: Application
    Filed: June 24, 2020
    Publication date: December 30, 2021
    Inventors: Madhu Chidurala, Richard Wilson, Haedong Jang, Simon Ward
  • Publication number: 20210384866
    Abstract: An amplifier includes an input matching network; at least one transistor; an input lead coupled to the at least one transistor; a ground terminal coupled to the transistor; an output lead coupled to the at least one transistor; an output matching circuit coupled to the output lead and to the at least one transistor; and a baseband impedance enhancement circuit having at least one reactive element coupled to the input matching network. The baseband impedance enhancement circuit is configured to reduce resonances of a baseband termination.
    Type: Application
    Filed: June 5, 2020
    Publication date: December 9, 2021
    Inventors: Richard Wilson, Marvin Marbell, Michael LeFevre
  • Publication number: 20210336280
    Abstract: Disclosed herein are aspects of methods, systems, and devices forming fuel cell sub-assemblies including placing a gasket with a peripheral seal defining a central aperture of the gasket on at least one of an anode flow plate and a cathode flow plate then placing a gas diffusion layer having less rigidity than the gasket within said within said central aperture wherein the gas diffusion layer is substantially uniformly spaced by a predetermined spacing from the inside facing surface of the gasket for forming a gallery.
    Type: Application
    Filed: July 6, 2021
    Publication date: October 28, 2021
    Applicant: Intelligent Energy Limited
    Inventor: Antony Richard Wilson
  • Publication number: 20210313283
    Abstract: A multi-level radio frequency (RF) integrated circuit component includes an upper level including at least one inductor, and a lower level including at least one conductive element that provides electrical connection to the at least one inductor. The lower level separates the at least one inductor from a lower surface that is configured to be attached to a conductive pad. Related integrated circuit device packages are also discussed.
    Type: Application
    Filed: September 24, 2020
    Publication date: October 7, 2021
    Inventors: Richard Wilson, Madhu Chidurala
  • Publication number: 20210280478
    Abstract: A radio frequency (RF) package includes a support having a semiconductor die attach region; a frame that includes an electrically insulative member having a lower side attached to the support and an upper side opposite the support; the frame includes an opening at least partially registered with said semiconductor die attach region; and the frame includes an upper metallization at the upper side of the electrically insulative member and a lower metallization The frame includes first electrically conductive edge connection connecting the first metallization to the first lower metallization.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 9, 2021
    Inventors: Richard Wilson, Haedong Jang, Simon Ward, Madhu Chidurala